Patent application number | Description | Published |
20100148378 | THERMOSETTING SILICONE RESIN COMPOSITION, SILICONE RESIN, SILICONE RESIN SHEET AND USE THEREOF - The present invention relates to a thermosetting silicone resin composition including a condensation reactable substituent group-containing silicon compound and an addition reactable substituent group-containing silicon compound; a silicone resin; a silicone resin sheet obtained from the thermosetting silicone resin composition or the silicone resin, and a use thereof. | 06-17-2010 |
20100213415 | METAL OXIDE FINE PARTICLES, SILICONE RESIN COMPOSITION AND USE THEREOF - The present invention relates to metal oxide fine particles treated with a surface-treating agent containing a silicon compound having an alkenyl group having 2 to 20 carbon atoms, a silicone resin composition obtained by reacting the metal oxide fine particles with an organohydrogensiloxane, a photo semiconductor element-encapsulating material containing the silicone resin composition, and a photosemiconductor device including a photosemiconductor element encapsulated with the silicone resin composition or the photosemiconductor element-encapsulating material. | 08-26-2010 |
20100225010 | COMPOSITION FOR THERMOSETTING SILICONE RESIN - The present invention relates to a composition for a thermosetting silicone resin, the composition including: (A) an organohydrogenpolysiloxane; (B) an alkenyl group-containing epoxy compound; (C) an alkenyl group-containing cyclic siloxane; and (D) a hydrosilylation catalyst, a thermosetting silicone resin composition obtained by reacting the composition and a production method thereof, a photosemiconductor element-encapsulating material including the thermosetting silicone resin composition, and a photosemiconductor device including a photosemiconductor element encapsulated with the resin composition or the photosemiconductor element-encapsulating material. | 09-09-2010 |
20110046320 | COMPOSITION FOR THERMOSETTING SILICONE RESIN - The present invention relates to a composition for thermosetting silicone resin including: (1) a dual-end silanol type silicone resin represented by formula (I) in which R | 02-24-2011 |
20110112268 | COMPOSITION FOR THERMOPLASTIC SILICONE RESIN - The present invention relates to a composition for a thermoplastic silicone resin, the composition including: an alkenyl-containing cage octasilsesquioxane represented by formula (I) in which R | 05-12-2011 |
20110210371 | COMPOSITION FOR THERMOSETTING SILICONE RESIN - The present invention relates to a composition for a thermosetting silicone resin including: (1) a dual-end silanol type silicone oil; (2) an alkenyl-containing silicon compound; (3) an organohydrogensiloxane; (4) a condensation catalyst; and (5) a hydrosilylation catalyst, in which the (4) condensation catalyst includes a tin complex compound. | 09-01-2011 |
20110248312 | SILICONE RESIN SHEET - The present invention relates to a silicone resin sheet obtained by semi-curing a composition for a silicone resin, the composition including: (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule thereof; (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule thereof; (3) a hydrosilylation catalyst; and (4) a curing retardant. | 10-13-2011 |
20110260209 | COMPOSITION FOR SILICONE RESIN - The present invention relates to a composition for a silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an organopolysiloxane having at least one alkenylsilyl group and at least two hydrosilyl groups in one molecule thereof; (3) a condensation catalyst; and (4) a hydrosilylation catalyst. | 10-27-2011 |
20110301276 | COMPOSITION FOR THERMOSETTING SILICONE RESIN - The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 μm, a content of particles having a particle size of 1 μm or less of 15% by number or less and a content of particles having a particle size of 60 μm or more of 15% by number or less. | 12-08-2011 |
20120028388 | METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE - A method for producing a light-emitting diode device includes a step of preparing a sealing layer by sealing in a light-emitting diode with a sealing material; a step of preparing a fluorescent layer by allowing a phosphor-containing resin composition containing phosphor and silicone resin to reach its B-stage; and a step of bonding the fluorescent layer to the surface of the sealing layer. | 02-02-2012 |
20120029161 | COMPOSITION FOR THERMOPLASTIC SILICONE RESIN - The present invention relates to a composition for a thermoplastic silicone resin, the composition including: at least one imide compound selected from the group consisting of compounds represented by formula (I) in which X represents a hydrogen atom or a monovalent hydrocarbon group and compounds represented by formula (II) in which Y represents a divalent hydrocarbon group; an organohydrogensiloxane; and a hydrosilylation catalyst. | 02-02-2012 |
20120042930 | DYE-SENSITIZED SOLAR CELL AND DYE-SENSITIZED SOLAR CELL MODULE - A dye-sensitized solar cell comprising at least a catalyst layer; a porous insulating layer containing an electrolyte in the inside; a porous semiconductor layer adsorbing a sensitizing dye and containing an electrolyte in the inside; and a second conductive layer laminated on a first conductive layer, wherein a contact face between the porous insulating layer or the porous semiconductor layer and the catalyst layer or the second conductive layer laminated adjacent to each other has an uneven form with a surface roughness coefficient Ra in a range of 0.05 to 0.3 μm. | 02-23-2012 |
20120103400 | WET SOLAR CELL MODULE - A wet solar cell module includes two or more photoelectric conversion devices spaced from each other and sandwiched between a first insulating substrate and a second insulating substrate. The photoelectric conversion device includes a first electrode, a photoelectric conversion portion, and a second electrode that are stacked in this order on the first insulating substrate. One of the first electrode and the second electrode included in the photoelectric conversion device has a through portion. Between respective photoelectric conversion portions of two photoelectric conversion devices adjacent to each other, an inter-cell insulating portion extends through the through portion. In a space surrounded by the first insulating substrate, the second insulating substrate, and the inter-cell insulating portion, a carrier transporter is provided. | 05-03-2012 |
20120112211 | SILICONE RESIN, SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin is obtained by allowing a cage octasilsesquioxane having a group represented by formula (1) below, to react with
| 05-10-2012 |
20120256220 | ENCAPSULATING SHEET, LIGHT EMITTING DIODE DEVICE, AND A METHOD FOR PRODUCING THE SAME - An encapsulating sheet is stuck to a substrate mounted with a light emitting diode to encapsulate the light emitting diode. The encapsulating sheet includes an encapsulating material layer in which an embedding region is defined, the embedding region for embedding the light emitting diode from one side surface of the encapsulating material layer; a first phosphor layer laminated on the other side surface of the encapsulating material layer; and a second phosphor layer laminated on one side surface of the encapsulating material layer so as to be spaced apart from the embedding region. | 10-11-2012 |
20120306107 | SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, OPTICAL SEMICONDUCTOR ELEMENT DEVICE, AND PRODUCING METHOD OF SILICONE RESIN SHEET - A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two hydrosilyl groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without containing an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation inhibitor. | 12-06-2012 |
20120319154 | SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane containing alkenyl groups at side chain. | 12-20-2012 |
20120319575 | PHOSPHOR ADHESIVE SHEET, LIGHT EMITTING DIODE ELEMENT INCLUDING PHOSPHOR LAYER, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHODS THEREOF - A phosphor adhesive sheet includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in a thickness direction of the phosphor layer. The adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties. | 12-20-2012 |
20130020610 | SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, METHOD FOR PRODUCING SILICONE RESIN SHEET, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition includes (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein the curing retarder contains tetraalkylammonium hydroxide. | 01-24-2013 |
20130048209 | METHOD FOR PRODUCING LIGHT EMITTING DIODE DEVICE - A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate. | 02-28-2013 |
20130066033 | THERMOPLASTIC SILICONE RESIN - A thermoplastic silicone resin has a main chain consisting of a polysiloxane and at least two side chains which branch off from the main chain. The side chain contains a functional group having two or more atomic groups each capable of forming a hydrogen bonding. | 03-14-2013 |
20130069106 | SILICONE RESIN SHEET, PRODUCING METHOD THEREOF, ENCAPSULATING SHEET, AND LIGHT EMITTING DIODE DEVICE - A method for producing a silicone resin sheet includes the steps of forming a first coating layer by applying a first silicone resin composition which contains a first organopolysiloxane and a second organopolysiloxane; forming a precursor layer from the first coating layer by reacting the first organopolysiloxane with the second organopolysiloxane so as to have a conversion ratio of 5 to 40%; and forming a second layer on at least one surface in a thickness direction of the precursor layer by applying a second silicone resin composition which contains a third organopolysiloxane, a fourth organopolysiloxane, a hydrosilylation catalyst, and a curing retardant containing tetraalkylammonium hydroxide. | 03-21-2013 |
20130092974 | SILICONE RESIN SHEET, CURED SHEET, AND LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF - A silicone resin sheet is formed from a resin composition containing a thermosetting silicone resin and microparticles. The complex viscosity thereof at a frequency of 10 Hz is 80 to 1000 Pa·s and the tan δ thereof at a frequency of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30° C.; a rate of frequency increase of 10 Hz/min; and a distortion of 1% in a shear mode. | 04-18-2013 |
20130099395 | SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane. | 04-25-2013 |
20130105997 | SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, OPTICAL SEMICONDUCTOR ELEMENT DEVICE, AND PRODUCING METHOD OF SILICONE RESIN SHEET | 05-02-2013 |
20130193477 | LIGHT EMITTING DIODE DEVICE AND METHOD OF PRODUCING THE SAME - A method of producing a light emitting diode device includes preparing an encapsulating resin layer; embedding a light emitting diode element in the encapsulating resin layer; and heating while pressing with gas the encapsulating resin layer having the light emitting diode element being embedded therein. | 08-01-2013 |
20130228803 | LIGHT-EMITTING DEVICE, LIGHTING DEVICE, LIGHT-EMITTING DEVICE ASSEMBLY, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate including a mirror surface region on its upper surface, a semiconductor light-emitting element disposed in the mirror surface region, and an encapsulating layer joined onto the upper surface of the substrate. The encapsulating layer includes a lower layer that is in contact with the upper surface of the substrate, covers the surrounding of the semiconductor light-emitting element, and contains phosphor; and an upper layer that is positioned on the lower layer, and has a larger phosphor content per unit area than that of the lower layer. | 09-05-2013 |
20130229805 | LIGHT-EMITTING DEVICE ASSEMBLY AND LIGHTING DEVICE - A light-emitting device assembly includes a plurality of light-emitting devices. The plurality of light-emitting devices each includes a circuit board including a pair of electrodes to be connected to an external power source, and to which an electric power is supplied from the power source through the electrodes; a semiconductor element supported on and electrically connected to the circuit board; and an encapsulating layer that encapsulates the semiconductor element on the circuit board. The plurality of light-emitting devices are disposed so as to be continuous in one direction. The encapsulating layer is disposed so that the encapsulating layers of the light-emitting devices next to each other are in contact with each other when viewed from the top. | 09-05-2013 |
20130234186 | ENCAPSULATING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - An encapsulating sheet includes a transparent layer in which a concave portion that is dented from the surface inwardly is formed and a phosphor encapsulating layer which fills the concave portion. The transparent layer is formed from a transparent composition containing a first silicone resin composition and the phosphor encapsulating layer is formed from a phosphor encapsulating composition containing a phosphor and a second silicone resin composition. | 09-12-2013 |
20130329397 | LIGHT SOURCE APPARATUS AND LIGHTING APPARATUS - A laser lighting module includes a base part, a laser diode which is a blue laser device, a substrate with which the laser diode is in contact, a ceramic phosphor which reflects light entering from the laser diode to thereby change a direction of the light and is excited by the light to generate yellow fluorescence, and a lens for adjusting luminous intensity distribution of light emitted from the ceramic phosphor. The substrate is formed of a material which is thin and has excellent thermal conductivity, and is in surface contact with the laser diode and the base part. In the laser lighting module, since the substrate serves as a device heat radiator, it is possible to easily remove the heat generated by the laser diode. | 12-12-2013 |
20130329416 | LIGHTING APPARATUS - A lighting apparatus includes a laser lighting module, an LED lighting module, and a sensor module. The laser lighting module includes a base part, a laser diode mounted on a substrate fixed on the base part, a ceramic phosphor upon which a blue laser light from the laser diode is incident, and a lens for adjusting luminous intensity distribution of light emitted from the ceramic phosphor, and is mounted on a module mount part of a mount body part. The LED lighting module and the sensor module are also mounted on other module mount parts of the mount body part, respectively. Thus, by mounting various combinations of the laser lighting modules and the LED lighting modules on the mount body part provided with a plurality of module mount parts, it is possible to manufacture lighting apparatuses for various uses at low cost. | 12-12-2013 |
20130341671 | SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray. | 12-26-2013 |
20130345370 | SILICONE RESIN COMPOSITION - A first silicone resin composition is prepared by allowing an organopolysiloxane containing silanol groups at both ends containing silanol groups at both ends of a molecule and a silicon compound containing, in one molecule, at least two leaving groups leaving by a condensation reaction with the silanol groups to undergo the condensation reaction in the presence of a condensation catalyst. The silicon compound contains a trifunctional silicon compound containing, in one molecule, the three leaving groups and a bifunctional silicon compound containing, in one molecule, the two leaving groups. | 12-26-2013 |
20140001656 | ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE | 01-02-2014 |
20140001657 | ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE | 01-02-2014 |
20140001948 | REFLECTING LAYER-PHOSPHOR LAYER-COVERED LED, PRODUCING METHOD THEREOF, LED DEVICE, AND PRODUCING METHOD THEREOF | 01-02-2014 |
20140001949 | PHOSPHOR LAYER-COVERED LED, PRODUCING METHOD THEREOF, AND LED DEVICE | 01-02-2014 |
20140091334 | ENCAPSULATING SHEET-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, SEMICONDUCTOR DEVICE, AND PRODUCING METHOD THEREOF - A method for producing an encapsulating sheet-covered semiconductor element includes a semiconductor element disposing step of disposing a plurality of semiconductor elements at spaced intervals to each other and an encapsulating sheet disposing step of disposing an encapsulating sheet so as to cover a plurality of the semiconductor elements and to form a space over the semiconductor elements adjacent to each other. | 04-03-2014 |
20140091348 | ENCAPSULATING SHEET-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, SEMICONDUCTOR DEVICE, AND PRODUCING METHOD THEREOF - An encapsulating sheet-covered semiconductor element includes a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface that is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface and the exposed surface has the other side portion that is positioned toward the other side with respect to the one surface of the semiconductor element. | 04-03-2014 |
20140131752 | PHOSPHOR LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, OPTICAL SEMICONDUCTOR DEVICE, AND PRODUCING METHOD THEREOF - A method for producing a phosphor layer-covered optical semiconductor element includes a step of opposing a phosphor layer containing a phosphor to an optical semiconductor element and an adjusting step of adjusting a color tone of light emitted from the optical semiconductor element and exited via the phosphor layer by adjusting the thickness of the phosphor layer. | 05-15-2014 |
20140171579 | SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, METHOD FOR PRODUCING SILICONE RESIN SHEET, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition includes (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein the curing retarder contains tetraalkylammonium hydroxide. | 06-19-2014 |
20140175494 | SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane containing alkenyl groups at side chain. | 06-26-2014 |
20140178678 | ENCAPSULATING SHEET - An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element and a gas barrier layer provided at one side in a thickness direction of the embedding layer, having a thickness of 50 μm or more and 1,000 μm or less, and for suppressing the passing of a gas in the thickness direction. | 06-26-2014 |
20140179879 | SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane containing alkenyl groups at side chain. | 06-26-2014 |
20140183593 | ENCAPSULATING LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE - A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element. | 07-03-2014 |
20140367729 | ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE - A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board formed with a through hole passing through in a thickness direction and a pressure-sensitive adhesive layer laminated on a surface at one side in the thickness direction of the support board so as to cover the through hole; disposing a semiconductor element on a surface at one side in the thickness direction of the pressure-sensitive adhesive layer in opposed to the through hole in the thickness direction; covering the semiconductor element with an encapsulating layer to produce an encapsulating layer-covered semiconductor element; and inserting a pressing member into the through hole from the other side in the thickness direction to peel the encapsulating layer-covered semiconductor element from the pressure-sensitive adhesive layer. | 12-18-2014 |
20150076552 | SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray. | 03-19-2015 |
20150087095 | ENCAPSULATING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - An encapsulating sheet includes a transparent layer in which a concave portion that is dented from the surface inwardly is formed and a phosphor encapsulating layer which fills the concave portion. The transparent layer is formed from a transparent composition containing a first silicone resin composition and the phosphor encapsulating layer is formed from a phosphor encapsulating composition containing a phosphor and a second silicone resin composition. | 03-26-2015 |