Patent application number | Description | Published |
20100055401 | MANUFACTURING METHOD OF FILM HAVING MICRO-PATTERN THEREON AND FILM MANUFACTURED THEREBY - A method of efficiently manufacturing a film having micro-patterns and an optical film manufactured using the same are used for various optical purposes. The method includes forming a first micro-pattern on one face of the film, and forming a second micro-pattern, which has a geometry equal to that of the first micro-pattern, on the other face of the film by a photo-lithography method using the first micro-pattern formed on one face of the film as a photomask. | 03-04-2010 |
20100069520 | Block copolymer of polyimide and polyamic acid, method for producing the block copolymer, photosensitive resin composition comprising the block copolymer and protective film formed using the block copolymer - A block copolymer of a polyimide and a polyamic acid is disclosed. Further disclosed are a method for producing the block copolymer and a positive type photosensitive composition comprising the block copolymer. The solubility of the photosensitive composition in an alkaline aqueous solution is controlled to achieve high resolution of a pattern. Further disclosed are a protective film of a semiconductor device and an ITO insulating film of an organic light emitting diode (OLED), which are formed using the block copolymer. The protective film and the ITO insulating film are very stable over time. | 03-18-2010 |
20100233618 | POLYIMIDE-BASED POLYMERS, COPOLYMERS THEREOF AND POSITIVE TYPE PHOTORESIST COMPOSITIONS COMPRISING THE SAME - Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings. | 09-16-2010 |
20110046277 | PHOTOSENSITIVE POLYIMIDE AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME - The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed. | 02-24-2011 |
20110123927 | PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYIMIDE RESIN AND NOVOLAK RESIN - A photosensitive resin composition is provided. The photosensitive resin composition comprises a) an alkali-soluble polyimide resin, b) an alkali-soluble novolak resin, c) a photosensitizer, and d) an organic solvent. The photosensitive resin composition is resistant to heat and can be used to form a pattern whose lateral angles are easily controllable. A large difference in developability between exposed and unexposed portions of the photosensitive resin composition is caused when patterning. The photosensitive resin composition is advantageous in terms of sensitivity, resolution, heat resistance and adhesiveness. Particularly, the lateral angles of the pattern can be easily controlled by varying the contents of the alkali-soluble resins. Therefore, the photosensitive resin composition is useful in the formation of an insulating film pattern of an organic light emitting diode (OLED). | 05-26-2011 |
20110223538 | PHOTOSENSITIVE ORGANIC INSULATOR COMPOSITION FOR OLED DEVICE - Polyimide or a precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive organic insulator composition having the same are disclosed. The polyimide or the precursor thereof is prepared from diamine including polyalkyleneoxide. The use of the photosensitive organic insulator composition can allow for low temperature curing and shorten a curing time, form a low taper angle, and implement a high sensitivity and high residual film. Also, since the photosensitive organic insulator composition, as a positive photosensitive composition, has excellent solubility with respect to an alkali solution of an exposed portion, the generation of impurity can be minimized. | 09-15-2011 |
20110274853 | NEGATIVE PHOTORESIST COMPOSITION AND PATTERNING METHOD FOR DEVICE - The present invention relates to a negative photoresist composition and a patterning method for device in which a photoresist pattern having a high sensitivity with a good reverse taper profile can be formed not only to realize an effective patterning of various thin films but also to facilitate removal of the photoresist pattern after the patterning. The photoresist composition comprises an alkali-soluble binder resin; a halogen-containing first photo-acid generator; a triazine-based second photo-acid generator; a cross-linking agent having an alkoxy structure; and a solvent. | 11-10-2011 |
20120301826 | POLYIMIDE-BASED POLYMERS, COPOLYMERS THEREOF AND POSITIVE TYPE PHOTORESIST COMPOSITIONS COMPRISING THE SAME - Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings. | 11-29-2012 |
20130189622 | BLOCK COPOLYMER OF POLYMIDE AND POLYAMIC ACID, METHOD FOR PRODUCING THE BLOCK COPOLYMER, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE BLOCK COPOLYMER AND PROTECTIVE FILM FORMED USING THE BLOCK COPOLYMER - A block copolymer of a polyimide and a polyamic acid is disclosed. Further disclosed are a method for producing the block copolymer and a positive type photosensitive composition comprising the block copolymer. The solubility of the photosensitive composition in an alkaline aqueous solution is controlled to achieve high resolution of a pattern. Further disclosed are a protective film of a semiconductor device and an ITO insulating film of an organic light emitting diode (OLED), which are formed using the block copolymer. The protective film and the ITO insulating film are very stable over time. | 07-25-2013 |
20140256876 | INSULATION MATERIAL FOR ELECTRONIC DEVICE - The present invention relates to insulating material for an electronic device that may inhibit damage to electronic devices by a high temperature curing process, and simultaneously contribute to improvement in reliability of electronic devices. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, and a residual solvent comprising a low boiling point solvent having boiling point of 130 to 180° C., wherein after curing at a temperature of 250° C. or less, the amount of outgassing is 4 ppm or less based on total weight of the soluble polyimide resin, and the amount of outgassing derived from water or alcohol is less than 0.1 ppm. | 09-11-2014 |
20140296408 | Insulation Material for Electronic Device - The present invention relates to insulating material for an electronic device that may inhibit damage to an electronic device due to a high temperature curing process, and simultaneously exhibit excellent properties and reliability. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, exhibits imidization degree of 70% or more after curing at a temperature of 250° C., and comprises a low boiling point solvent having boiling point of 130 to 180° C. as a residual solvent. | 10-02-2014 |
20150024327 | NEGATIVE PHOTORESIST COMPOSITION AND PATTERNING METHOD FOR DEVICE - The present invention relates to a negative photoresist composition and a patterning method for device in which a photoresist pattern having a high sensitivity with a good reverse taper profile can be formed not only to realize an effective patterning of various thin films but also to facilitate removal of the photoresist pattern after the patterning. The photoresist composition comprises an alkali-soluble binder resin; a halogen-containing first photo-acid generator; a triazine-based second photo-acid generator; a cross-linking agent having an alkoxy structure; and a solvent. | 01-22-2015 |