Fasano, NY
Benjamin V. Fasano, Yorktown Heights, NY US
Patent application number | Description | Published |
---|---|---|
20110044369 | SILICON CARRIER OPTOELECTRONIC PACKAGING - An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board. | 02-24-2011 |
20120326290 | SILICON CARRIER OPTOELECTRONIC PACKAGING - An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board. | 12-27-2012 |
Benjamin V. Fasano, New Windsor, NY US
Patent application number | Description | Published |
---|---|---|
20080217793 | METHOD AND DEVICE INCLUDING REWORKABLE ALPHA PARTICLE BARRIER AND CORROSION BARRIER - A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100° C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate. | 09-11-2008 |
20090145973 | STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION APPLICATIONS - A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module. | 06-11-2009 |
20090184407 | METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCRETE COMPONENTS - Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate. | 07-23-2009 |
20120217986 | MODULE ASSEMBLY HOLDING WORKBOARD - A module assembly holding workboard is provided and includes a base having a central portion to support a computing module, a first wing at a first side of the central portion to support a first adapter and a second wing at a second side of the central portion to support a second adapter, the first and second adapters being coupled to the computing module via first and second conductive elements and a plurality of routing channel elements fixedly disposed at the first and second wings to retain the first and second conductive elements. | 08-30-2012 |
20130233598 | FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES AND METHODS THEREOF - A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection. | 09-12-2013 |
20140203945 | VALIDATION OF MECHANICAL CONNECTIONS - A connection validation apparatus includes a connector engagement mechanism configured to physically engage a connector to connect the connector to a connector interface. The apparatus further includes a connection indication detector located on the connector engagement mechanism and configured to detect at least one of a sound and a vibration corresponding to a secure connection of the connector with the connector interface. The apparatus also includes a connection indicator output unit configured to provide an indication to a user that the connector is securely connected with the connector interface based on the detection of the at least one of the sound and the vibration by the connection indication detector. | 07-24-2014 |
20150033556 | FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES AND METHODS THEREOF - A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection. | 02-05-2015 |
Benjamin Vito Fasano, New Windsor, NY US
Patent application number | Description | Published |
---|---|---|
20100084437 | Dispensing Assembly with a Controlled Gas Environment - Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material. | 04-08-2010 |
20100084438 | Dispensing Assembly with an Injector Controlled Gas Environment - An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas. | 04-08-2010 |
20150014836 | Electronic Module Assembly With Patterned Adhesive Array - An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress. | 01-15-2015 |
Christopher A. Fasano, Glenmont, NY US
Patent application number | Description | Published |
---|---|---|
20120101024 | Methods and Compositions for Differentiating Embryonic Stem Cells - Methods and compositions for differentiating mammalian stem and progenitor cells are provided. More particularly, methods and compositions for obtaining neural cells from human embryonic stem cells are provided. | 04-26-2012 |
John P. Fasano, Briarcliff Manor, NY US
Patent application number | Description | Published |
---|---|---|
20090164262 | METHOD AND STRUCTURE FOR RISK-BASED RESOURCE PLANNING FOR CONFIGURABLE PRODUCTS - A method for planning under uncertainty is disclosed. The method includes steps of processing a stochastic programming formulation based on forecast values of at least one of product and service configurations, and determining a resource requirements plan for one or more planning periods in a non-deterministic bill of resources of at least two levels. | 06-25-2009 |
John Peter Fasano, Briarcliff Manor, NY US
Patent application number | Description | Published |
---|---|---|
20080294486 | METHOD FOR SUBSTITUTION OF EMPLOYEES IN A SERVICE ENGAGEMENT - The substitution of employees in a service engagement is a computer based method designed to consider a set of attributes that describe the resource capabilities required for delivering a services engagement and identify the actual real-world human assets that can be substituted and/or matched to these attributes. The method will produce an allocation plan that provides the set of permissible substitutes for a given resource demand, given a set of allowable substitute resources for a particular resource attribute, and substitution and matching rules for the given resource demand. A set of metrics is created that identify which substitutions are best relative to the ideal match of resources to the demand. | 11-27-2008 |
Paul Fasano, Carmel, NY US
Patent application number | Description | Published |
---|---|---|
20110030269 | LUBRICANT COMPOSITION - A lubricant composition is suitable for use in diesel engines and is resistant to degradation by oxidative by-products of biodiesel fuel. The composition includes (A) a base oil, (B) at least one diphenylamine antioxidant, and (C) at least one antioxidant. The antioxidant (C) is selected from the group consisting of a sulfur containing phenolic antioxidant, a phenyl-alpha-naphthylamine antioxidant, and combinations thereof. The lubricant composition is formed using a method. In the method, the (A) base oil has an initial oxidation value measured according to ASTM D 6186. In addition in the method, the lubricant composition includes up to about 6 wt % of the biodiesel fuel and has a final oxidation value measured according to ASTM D 6186 that is equal to or greater than the initial oxidation value of the (A) base oil. | 02-10-2011 |
Paul Leonard Fasano, Carmel, NY US
Patent application number | Description | Published |
---|---|---|
20130270049 | FLUID COMPOSITION FOR A VIBRATION DAMPENER - A fluid composition comprises a base stock and a polymer. The base stock comprises a glycol, such as ethylene glycol. The polymer comprises the reaction product of a hydroxyl functional initiator, such as a diol, and alkylene oxides. The alkylene oxides are selected from the group of ethylene oxide (EO), propylene oxide (PO), and butylene oxide (BO). In certain embodiments, the alkylene oxides comprise EO and PO. The fluid composition provides a four-ball wear test scar of less than about 1 millimeter, generally under the following test conditions: 60 minutes run, 55° C., 1800 rpm, and 40 kg load. In other embodiments, the fluid composition comprises the polymer and is substantially free of the base stock. The fluid composition is useful for vibration dampening and can be used in vibration dampeners. The vibration dampener is useful for dampening vibrations between the two rigid components of the vehicle. | 10-17-2013 |