Patent application number | Description | Published |
20120092306 | DISPLAY DEVICE AND REPAIRING METHOD FOR THE SAME - A display device and a repairing method for the same are disclosed. The display device includes a substrate, a pixel array, at least one gate driver unit, at least one source driver unit, a first repair line, a second repair line, a first dummy line, and a second dummy line. The first repair line is disposed between the pixel array and the source driver unit. The second repair line is disposed opposite to the first repair line on the pixel array. The first dummy line and the second dummy line are respectively disposed at two sides of the pixel array and crossing the gate lines, the first repair line, and the second repair line. A signal transmission is not required to go around the outmost periphery of the gate driver unit in a repairing process. As a result, the signal attenuation can be decreased effectively. | 04-19-2012 |
20120092579 | DISPLAY DEVICE AND REPAIRING METHOD FOR THE SAME - A display device and a repairing method for the same are disclosed. The display device includes a substrate, a pixel array, at least one gate driver unit, at least one source driver unit, a first repair line, a second repair line, a first dummy line, and a second dummy line. The first repair line is disposed between the pixel array and the source driver unit. The second repair line is disposed opposite to the first repair line on the pixel array. The first dummy line and the second dummy line are respectively disposed at two sides of the pixel array and crossing the gate lines, the first repair line, and the second repair line. A signal transmission is not required to go around the outmost periphery of the gate driver unit in a repairing process. As a result, the signal attenuation can be decreased effectively. | 04-19-2012 |
Patent application number | Description | Published |
20100214503 | DISPLAY PANEL AND REPAIR METHOD THEREOF - A display panel and a repair method thereof are disclosed. The display panel comprises a plurality of signal lines, having at least one first repair line and at least one second repair line. The first repair line and the second repair line are respectively disposed at both sides of the signal lines, and the signal lines are partially overlapped. The method comprises: electrically connecting the broken signal line and the first repair line; electrically connecting the broken signal line and the second repair line; and utilizing a flexible conductive component to electrically connect the first repair line and the second repair line. | 08-26-2010 |
20100265424 | DISPLAY PANEL HAVING REPAIR STRUCTURE AND METHOD OF REPAIRING DISPLAY PANEL - A display panel having a repair structure utilizes floating repair lines integrated into the display panel. Each of the floating repair lines bridges across each of any two adjacent pixels so as to be used for the repair of open lines on scan lines, data lines and common lines in the display panel as required. The display panel of the present invention having a repair structure integrates each of the floating repair lines between each of any two adjacent pixels so as to form new substitutional signal transmission routes of various types of open lines. The substitutional signal transmission route is able to reduce the resistive-capacitive delay of the repaired display panel and the impedance of repaired lines, and avoid signal decay and distortion. | 10-21-2010 |
20130277814 | METHOD FOR FIXING SEMICONDUCTOR CHIP ON CIRCUIT BOARD AND STRUCTURE THEREOF - A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer. An organic insulating material is formed on the insulating layer of the outside edge of the chip connecting portion. An anisotropic conductive film (ACF) is then formed to cover the chip connecting portion and a portion of the organic insulating material. Finally, a semiconductor chip is hot-pressed on the ACF. The organic insulating material formed on the insulating layer is used to prevent the metal wires beneath the insulating layer from occurring of corrosion. A semiconductor chip package structure is also provided. | 10-24-2013 |
20140231985 | SEMICONDUCTOR CHIP PACKAGE STRUCTURE - A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer. An organic insulating material is formed on the insulating layer of the outside edge of the chip connecting portion. An anisotropic conductive film (ACF) is then formed to cover the chip connecting portion and a portion of the organic insulating material Finally, a semiconductor chip is hot-pressed on the ACF. The organic insulating material formed on the insulating layer is used to prevent the metal wires beneath the insulating layer from occurring of corrosion. A semiconductor chip package structure is also provided. | 08-21-2014 |