Ehrenfried
Ehrenfried Bonhag, Schwabach DE
Patent application number | Description | Published |
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20110042941 | CONNECTING PIECE FOR A CLAMPING CONNECTOR - The invention relates to a polymer connecting piece ( | 02-24-2011 |
20110109084 | PLASTIC SLIDING SLEEVE AND CONNECTING FITTING HAVING SUCH A SLIDING SLEEVE - A plastic sliding sleeve ( | 05-12-2011 |
Ehrenfried Von Waldow, Wohltorf DE
Patent application number | Description | Published |
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20100242380 | ARRANGEMENT HAVING A SEISMICALLY REINFORCED COMPONENT - The invention relates to an arrangement with an earthquake-proof, pole-type or tower-type projecting component ( | 09-30-2010 |
Ehrenfried Zschech, Moritzburg DE
Patent application number | Description | Published |
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20090114000 | NANOPROBE TIP FOR ADVANCED SCANNING PROBE MICROSCOPY COMPRISING A LAYERED PROBE MATERIAL PATTERNED BY LITHOGRAPHY AND/OR FIB TECHNIQUES - By forming an appropriate material layer, such as a metal-containing material, on a appropriate substrate and patterning the material layer to obtain a cantilever portion and a tip portion, a specifically designed nano-probe may be provided. In some illustrative aspects, additionally, a three-dimensional template structure may be provided prior to the deposition of the probe material, thereby enabling the definition of sophisticated tip portions on the basis of lithography, wherein, alternatively or additionally, other material removal processes with high spatial resolution, such as FIB techniques, may be used for defining nano-probes, which may be used for electric interaction, highly resolved temperature measurements and the like. Thus, sophisticated measurement techniques may be established for advanced thermal scanning, strain measurement techniques and the like, in which a thermal and/or electrical interaction with the surface under consideration is required. These techniques may be advantageously used for failure localization and local analysis during the fabrication of advanced integrated circuits. | 05-07-2009 |
20110297869 | INSULATION MATERIAL FOR INTEGRATED CIRCUITS AND USE OF SAID INTEGRATED CIRCUITS - The invention relates to the fields of microelectronics and materials sciences and concerns an insulation layer material for integrated circuits in microelectronics, which can be used, for example, in integrated circuits as insulation material in semiconductor components. The object of the present invention is to disclose an insulation material for integrated circuits, which has dielectric constants of k≦2 with good mechanical properties at the same time. The object is attained with an insulation material for integrated circuits, containing at least MOFs and/or COFs. | 12-08-2011 |
20150066394 | ARRANGEMENT AND METHOD FOR THE SYNCHRONOUS DETERMINATION OF THE SHEAR MODULUS AND OF THE POISSON'S NUMBER ON SAMPLES OF ELASTICALLY ISOTROPIC AND ANISOTROPIC MATERIALS - The invention relates to an arrangement and to a method for the synchronous determination of the shear modulus and of the Poisson's number on samples of elastically isotropic and anisotropic materials. In the arrangement, an indenter is movable in parallel with its longitudinal axis (A) in the direction of the surface of a sample such that a force action is exerted on the material by its tip. The force can be determined by a device for measuring this force and the indenter is additionally deflected in translation along at least one further axis. The longitudinal axis (A) of the indenter is aligned at an angle ≠90° with respect to the surface of the sample and the indenter carries out an upward movement and a downward movement. In this respect, a device is present for calculating the shear modulus G and the Poisson's number v from the contact stiffness k determined in this manner, from the acting normal force P, from the indentation modulus M | 03-05-2015 |