Patent application number | Description | Published |
20100032409 | FABRICATING A GRAPHENE NANO-DEVICE - Nanoscale graphene structure fabrication techniques are provided. An oxide nanowire useful as a mask is formed on a graphene layer and then ion beam etching is performed. A nanoscale graphene structure is fabricated by removing a remaining oxide nanowire after the ion beam etching. | 02-11-2010 |
20100157914 | Collision-Free Beacon Scheduling Method based on Distributed Address Assignment Scheme - Provided is a beacon scheduling method based on a distributed address assignment scheme that schedules a beacon and minimizes data delay using non-collision of addresses in a network, such as a ZigBee network, that provides a distributed address system. In the method, a time offset T | 06-24-2010 |
20100193940 | Wafer level package and method of manufacturing the same - The present invention relates to a wafer level package and a method of manufacturing the same. The wafer level package includes a first substrate including a first region and second regions with grooves around the first region; a semiconductor device positioned in the first region; first sealing members positioned in the grooves; a second substrate including projection units corresponding to the second regions in order to form a cavity corresponding to the first region; and second sealing members which are positioned above the projection units and laminate the first and second substrates to each other by being bonded to the first sealing members, and can prevent the sealing members from flowing to any region except for the sealing regions. | 08-05-2010 |
20100295172 | POWER SEMICONDUCTOR MODULE - Disclosed is a power semiconductor module having improved heat dissipation performance, including an anodized metal substrate including a metal plate, an anodized layer formed on a surface of the metal plate, and a circuit layer formed on the anodized layer on the metal plate, a power device connected to the circuit layer, and a housing mounted on the metal plate and for defining a sealing space which accommodates a resin sealing material for sealing the circuit layer and the power device. | 11-25-2010 |
20110012252 | POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant. | 01-20-2011 |
20110031608 | POWER DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - Disclosed is a power device package, which has high heat dissipation performance and includes an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both the surface of the metal plate and the inner wall of the cavity and a circuit layer formed on the metal plate, a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer, and a resin sealing material charged in the cavity of the metal plate. A method of fabricating the power device package is also provided. | 02-10-2011 |
20110042130 | Multilayered wiring substrate and manufacturing method thereof - A multilayered wiring substrate and a manufacturing method thereof are disclosed. The multilayered wiring substrate includes: a stacked body including an insulating member and first and second metal cores stacked with the insulating member interposed therebetween, and having a through hole penetrating the first and second metal cores; first and second insulation layers formed on an external surface, excluding an inner wall of the through hole, of the first and second metal cores, respectively; first and second inner layer circuit patterns and first and second outer layer circuit patterns formed on the first and second insulation layers, respectively; first and second via electrodes electrically connecting the first and second inner layer circuit patterns and the first and second outer layer circuit patterns; a third insulation layer formed on the inner wall of the through hole; and a through electrode made of a conductive material filled in the through hole and electrically connecting the first and second outer layer circuit patterns. | 02-24-2011 |
20110042699 | Substrate for light emitting diode package and light emitting diode package having the same - A substrate for a light emitting diode (LED) package, and an LED package having the same are disclosed. The substrate for an LED package includes: a metal plate; an insulation oxide layer formed on a portion of the surface of the metal plate; a first conductive pattern formed at one region of the insulation oxide layer and providing a light emitting diode mounting area; and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern. In the substrate for an LED package, because regions of the insulation oxide layer other than regions for insulating conductive patterns are removed, heat generated from the light emitting diode can be effectively released. In addition, degradation of reflexibility and luminance of the LED due to the insulation oxide layer can be prevented. | 02-24-2011 |
20110055774 | SYSTEM AND METHOD FOR CONTROLLING INTERACTION BETWEEN A MOBILE TERMINAL AND A DIGITAL PICTURE FRAME - A mobile terminal includes a wireless communication unit, a memory, a touch screen, and a controller. The wireless communication unit establishes a connection to an external digital picture frame. The memory stores a plurality of images including one or more characters and information mapped to the characters. The touch screen displays a first image stored in the memory. And, the controller transmits the first image and first information mapped to the first image to the digital picture frame via the wireless communication unit. | 03-03-2011 |
20110059544 | OLFACTORY RECEPTOR-FUNCTIONALIZED TRANSISTORS FOR HIGHLY SELECTIVE BIOELECTRONIC NOSE AND BIOSENSOR USING THE SAME - In accordance with an aspect of the present invention, there is provided a transistor including: a substrate; a source electrode and a drain electrode formed being spaced apart from each other on the substrate; a nanostructure electrically contacted with and formed between the source electrode and the drain electrode; and a lipid membrane having an olfactory receptor protein which is formed to cover surfaces of the source electrode, the drain electrode, and the nanostructure. The olfactory receptor-functionalized transistor in accordance with an aspect of the present invention is useful for a bioelectronic nose which can detect odorants highly specifically with femtomolar sensitivity, and may be applied in various fields requiring the rapid detection of specific odorants, for example, anti-bioterrorism, disease diagnostics, and food safety. | 03-10-2011 |
20110067902 | HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided. | 03-24-2011 |
20110083885 | METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME - Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated. | 04-14-2011 |
20110095315 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate | 04-28-2011 |
20110127580 | CAPACITOR-LESS MEMORY DEVICE - Provided is a capacitorless memory device. The device includes a semiconductor substrate, an insulating layer disposed on the semiconductor substrate, a storage region disposed on a partial region of the insulating layer, a channel region disposed on the storage region to provide a valence band energy offset between the channel region and the storage region, a gate insulating layer and a gate electrode sequentially disposed on the channel region, and source and drain regions connected to the channel region and disposed at both sides of the gate electrode. A storage region having different valence band energy from a channel region is disposed under the channel region unit so that charges trapped in the storage region unit cannot be easily drained. Thus, a charge retention time may be increased to improve data storage capability. | 06-02-2011 |
20120015484 | POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant. | 01-19-2012 |
20120106109 | POWER MODULE USING SINTERING DIE ATTACH AND MANUFACTURING METHOD THEREOF - Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module. | 05-03-2012 |
20120118615 | METAL CLAD LAMINATE, METHOD OF MANUFACTURING THE SAME, AND HEAT-RADIATING SUBSTRATE - Disclosed herein is a metal clad laminate, a method of manufacturing the same and a heat-radiating substrate using the same. The metal clad laminate has increased adhesion because a layer of carbon nanoparticles is formed between bonding surfaces of upper and lower metal foils to a prepreg, and has improved heat conductive properties and mechanical properties because the prepreg has carbon fibers incorporated therein. Also, resin members having carbon nanofibers incorporated therein may be alternately stacked with metal layers, and metal layers may be inserted in the prepreg thus improving heat conductive properties, and the number of stacked layers may vary depending on the end use thereby controlling heat conductive properties and mechanical properties of the metal clad laminate. | 05-17-2012 |
20120122278 | Method Of Manufacturing Semiconductor Package Board - Disclosed herein is a method of method of manufacturing a semiconductor package board, including: providing a substrate including a connection part formed on one side thereof, the connection part being provided thereon with a solder layer; disposing a conductive heat generator equipped with current wiring on the solder layer; applying current to the current wiring and thus heating the solder layer to attach a semiconductor chip to the connection part; and removing the current wiring from the conductive heat generator. The method is advantageous in that the semiconductor chip is attached to the substrate by applying current to the current wiring of the conductive heat generator to locally heat only the solder layer, thus reducing thermal stress and preventing the deformation of the substrate. | 05-17-2012 |
20120273558 | HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided. | 11-01-2012 |
20130045550 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate | 02-21-2013 |
20130195331 | APPARATUS FOR SHARING AND MANAGING INFORMATION IN PICTURE ARCHIVING COMMUNICATION SYSTEM AND METHOD THEREOF - Disclosed are an apparatus and method for sharing and managing information in a PACS. A system for storing and managing medical image includes a pre-processing unit for generating a second medical image set by using at least part of a first medical image set and a medical image storage unit for storing the first medical image set and the generated second medical image set and store first information, stored in relation to any one of the first medical image set and the second medical image set, in relation to the other of the first medical image set and the second medical image set. Although thin-slice data is deleted, annotation or marking for 3-D data can be maintained and managed. | 08-01-2013 |
20140113392 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate including an insulation layer formed thereon, and forming a circuit layer and electrode pads on the conductive substrate using a plating process. The method further includes selectively plating the circuit layer, in which the optical element is to be mounted, with a conductor to such a thickness that the optical element is buried, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon. | 04-24-2014 |
20140113393 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate, forming a cavity space in the conductive substrate, and forming an insulation layer on the conductive substrate. The method further includes the steps of forming a circuit layer and electrode pads on the conductive substrate using a plating process, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon. | 04-24-2014 |
20140297309 | SYSTEM AND METHOD FOR SUPPLYING MEDICAL IMAGE - The present invention relates to a system and method for providing medical images. The system for providing medical images according to an example of the present invention includes: one or more software viewer modules; a software user-specified worklist management module; and a software display controller module. The one or more software viewer modules display medical images. The user-specific worklist management module provides a user-specific worklist corresponding to a logged-in user, based on the role of the logged-in user, via a worklist interface which provides varying functions. The display controller module controls one or displaying monitors to display detailed information and medical images for a list, selected from among user-specific worklist, via the one or more software viewer modules based on status information on the one or more software viewer modules. | 10-02-2014 |
20150055171 | METHOD OF SETTING PRINTING OPTION THROUGH TOUCH INPUT AND MOBILE DEVICE TO PERFORM SAME - A method of setting a printing option through a touch input includes displaying a preview, which includes a virtual sheet of paper and thumbnails corresponding to content to be printed, on a touch screen of a mobile device, determining a printing option by receiving and analyzing a touch input on the virtual sheet of paper and the thumbnails, and applying the determined printing option to the preview. | 02-26-2015 |
20150072329 | EDUCATIONAL TIMEPIECE - An educational timepiece provided with the hour hand and the minute hand, which comprises a base plate having an upper surface on which the hour hand and the minute hand rotate, and an angle hand rotating on the upper surface of the base plate for measuring the angle between the hour hand and the minute hand, wherein the angle hand serves to measure the angle between the hour hand and one of the hour indication parts adjacent to the hour hand, the interval between every two adjacent hour indication parts being divided by a given angle. | 03-12-2015 |