Patent application number | Description | Published |
20080240590 | METHODS AND APPARATUSES FOR ENCODING AND DECODING MULTI-VIEW IMAGE - Methods and apparatuses for encoding and decoding a multi-view image are provided. The method of encoding the multi-view image can use a difference in views between pictures of the multi-view image, add an image area obtained from a picture at one view at a first time to a picture at another view at a second time, thereby generating a reference picture, and perform prediction encoding using the generated reference picture, thereby increasing prediction encoding efficiency. | 10-02-2008 |
20080253671 | METHOD AND APPARATUS FOR ENCODING AND DECODING MULTI-VIEW IMAGE - A Method and apparatus for encoding and decoding a multi-view image are provided. The method of encoding a multi-view image includes determining whether each of pictures included in multi-view image sequences is a reference picture referred to by other pictures included in the multi-view image sequences for inter-view prediction, and encoding the pictures using at least one of inter-view prediction and temporal prediction based on the determination result, thereby efficiently encoding and decoding the multi-view image at high speed. | 10-16-2008 |
20080285863 | METHOD AND APPARATUS FOR ENCODING AND DECODING MULTI-VIEW IMAGE - A method and apparatus for encoding and decoding a multi-view image for a multi-view display apparatus are provided. The method of encoding a multi-view image includes: compressing a multi-view image based on a reference image relative to multiple views; generating enabled stereo pair information in relation to multi-view images; and generating a bitstream by using the compressed multi-view image and the enabled stereo pair information. | 11-20-2008 |
20080317361 | METHOD AND APPARATUS FOR ENCODING/DECODING IMAGE BY PARTITIONING IMAGE - A method and apparatus for encoding/decoding an image are provided. The method includes partitioning an image into a plurality of areas, allocating the partitioned plurality of areas to views of multi-view image sequences, and encoding the allocated plurality of areas. By doing so, the method can efficiently encode a large-screen image or a high-pixel image, without using a separate codec. | 12-25-2008 |
20110038414 | METHOD AND APPARATUS FOR ENCODING VIDEO, AND METHOD AND APPARATUS FOR DECODING VIDEO - Disclosed are method and apparatus for encoding and decoding an image which divides a current picture into blocks with various sizes and varies a number of intra prediction modes according to the sizes of the divided blocks. | 02-17-2011 |
20120114259 | METHOD AND APPARATUS FOR ENCODING AND DECODING MULTI-VIEW IMAGE - Provided is a method and apparatus for encoding and decoding a multiview image. By predicting a current picture based on at least one of an intra (I) picture of a previous image processing block and an I picture of a current image processing block, which is generated for a different view than a view at which the I picture of the previous image processing block is generated, and encoding the current picture based on the prediction, it is possible to prevent display quality degradation that may occur in images at views other than a base view. | 05-10-2012 |
20120140823 | METHOD AND APPARATUS FOR ENCODING VIDEO, AND METHOD AND APPARATUS FOR DECODING VIDEO - Disclosed are method and apparatus for encoding and decoding an image which divides a current picture into blocks with various sizes and varies a number of intra prediction modes according to the sizes of the divided blocks. | 06-07-2012 |
20120141041 | IMAGE FILTERING METHOD USING PSEUDO-RANDOM NUMBER FILTER AND APPARATUS THEREOF - An image filtering method and apparatus that filter a block of a plane area by using a pseudo-random filter are provided, whereby artifacts generated in image encoding and decoding procedures are removed, the method including: determining a similarity between pixel values of a the first block; and generating a second block by selectively applying a pseudo-random filter on the first block according to a result of based on the determining the determined similarity. | 06-07-2012 |
20120148166 | METHOD AND APPARATUS FOR ENCODING AND DECODING AND MULTI-VIEW IMAGE - A Method and apparatus for encoding and decoding a multi-view image are provided. The method of encoding a multi-view image includes determining whether each of pictures included in multi-view image sequences is a reference picture referred to by other pictures included in the multi-view image sequences for inter-view prediction, and encoding the pictures using at least one of inter-view prediction and temporal prediction based on the determination result, thereby efficiently encoding and decoding the multi-view image at high speed. | 06-14-2012 |
20120148167 | METHOD AND APPARATUS FOR ENCODING AND DECODING AND MULTI-VIEW IMAGE - A Method and apparatus for encoding and decoding a multi-view image are provided. The method of encoding a multi-view image includes determining whether each of pictures included in multi-view image sequences is a reference picture referred to by other pictures included in the multi-view image sequences for inter-view prediction, and encoding the pictures using at least one of inter-view prediction and temporal prediction based on the determination result, thereby efficiently encoding and decoding the multi-view image at high speed. | 06-14-2012 |
20120148168 | METHOD AND APPARATUS FOR ENCODING AND DECODING AND MULTI-VIEW IMAGE - A Method and apparatus for encoding and decoding a multi-view image are provided. The method of encoding a multi-view image includes determining whether each of pictures included in multi-view image sequences is a reference picture referred to by other pictures included in the multi-view image sequences for inter-view prediction, and encoding the pictures using at least one of inter-view prediction and temporal prediction based on the determination result, thereby efficiently encoding and decoding the multi-view image at high speed. | 06-14-2012 |
20120148169 | METHOD AND APPARATUS FOR ENCODING AND DECODING AND MULTI-VIEW IMAGE - A Method and apparatus for encoding and decoding a multi-view image are provided. The method of encoding a multi-view image includes determining whether each of pictures included in multi-view image sequences is a reference picture referred to by other pictures included in the multi-view image sequences for inter-view prediction, and encoding the pictures using at least one of inter-view prediction and temporal prediction based on the determination result, thereby efficiently encoding and decoding the multi-view image at high speed. | 06-14-2012 |
20120148170 | METHOD AND APPARATUS FOR ENCODING AND DECODING AND MULTI-VIEW IMAGE - A Method and apparatus for encoding and decoding a multi-view image are provided. The method of encoding a multi-view image includes determining whether each of pictures included in multi-view image sequences is a reference picture referred to by other pictures included in the multi-view image sequences for inter-view prediction, and encoding the pictures using at least one of inter-view prediction and temporal prediction based on the determination result, thereby efficiently encoding and decoding the multi-view image at high speed. | 06-14-2012 |
20120155782 | METHOD AND APPARATUS FOR ENCODING AND DECODING AND MULTI-VIEW IMAGE - A Method and apparatus for encoding and decoding a multi-view image are provided. The method of encoding a multi-view image includes determining whether each of pictures included in multi-view image sequences is a reference picture referred to by other pictures included in the multi-view image sequences for inter-view prediction, and encoding the pictures using at least one of inter-view prediction and temporal prediction based on the determination result, thereby efficiently encoding and decoding the multi-view image at high speed. | 06-21-2012 |
20120201474 | METHOD AND APPARATUS FOR ENCODING AND DECODING MULTI-VIEW IMAGES BASED ON GLOBAL DISPARITY VECTOR - A method and apparatus for encoding and decoding multi-view images. The multi-view image encoding method selects a block corresponding to a current block from another picture having a view-point which is different from a view-point of a current picture to which the current block belongs, on the basis of a global disparity vector representing a global disparity between the current picture and the other picture; and encodes the current block on the basis of block information of a block from among the selected block and blocks adjacent to the selected block. Accordingly, multi-view images can be encoded in consideration of the individual differences between the appearances of objects as well as global disparities between view-points. | 08-09-2012 |
20120281755 | METHOD AND APPARATUS FOR ENCODING VIDEO, AND METHOD AND APPARATUS FOR DECODING VIDEO - Disclosed are method and apparatus for encoding and decoding an image which divides a current picture into blocks with various sizes and varies a number of intra prediction modes according to the sizes of the divided blocks. | 11-08-2012 |
20130329788 | METHOD AND APPARATUS FOR ENCODING VIDEO, AND METHOD AND APPARATUS FOR DECODING VIDEO - Disclosed are method and apparatus for encoding and decoding an image which divides a current picture into blocks with various sizes and varies a number of intra prediction modes according to the sizes of the divided blocks. | 12-12-2013 |
20140044187 | METHOD AND APPARATUS FOR ENCODING VIDEO, AND METHOD AND APPARATUS FOR DECODING VIDEO - An apparatus for decoding an image including: an entropy decoder which obtains information that indicates an intra prediction mode applied to a current block to be decoded, from a bitstream; and an intra prediction performer which performs intra prediction on the current block according to the intra prediction mode indicated by the extracted information. | 02-13-2014 |
20140079121 | METHOD AND APPARATUS FOR ENCODING VIDEO, AND METHOD AND APPARATUS FOR DECODING VIDEO - A method of decoding an image including: obtaining information about an intra prediction mode applied to a current block to be decoded, from a bitstream; obtaining one of a left neighboring pixel whose location is determined based on j*dy>>n and a up neighboring pixel whose location is determined based on i*dx>>m, where a current pixel is located on (i,j), dx, dy, m and n are integers; performing intra prediction on the current pixel using one of the left neighboring pixel and the up neighboring pixel. | 03-20-2014 |
20140079127 | METHOD AND APPARATUS FOR ENCODING VIDEO, AND METHOD AND APPARATUS FOR DECODING VIDEO - An apparatus of decoding an image includes an entropy decoder which obtains information about an intra prediction mode applied to a current block to be decoded, from a bitstream; and an intra prediction performer which obtains one of a left neighboring pixel whose location is determined based on j*dy>>n and a up neighboring pixel whose location is determined based on i*dx>>m, where a current pixel is located on (i,j), dx, dy, m and n are integers and performs intra prediction on the current pixel using one of the left neighboring pixel and the up neighboring pixel. | 03-20-2014 |
20140132719 | METHOD AND APPARATUS FOR ENCODING AND DECODING AND MULTI-VIEW IMAGE - A method of predictive-decoding a multi-view image includes receiving a bitstream comprising information indicating whether each of pictures included in multi-view image sequences is a reference picture referred to by others of the pictures included in the multi-view image sequences for inter-view prediction and data about the multi-view image sequences; extracting the information indicating whether each of pictures included in multi-view image sequences is the reference picture and the data about the multi-view image sequences from the received bitstream; determining whether pictures included in the data about the multi-view image sequences are to be used for inter-view prediction decoding based on the extracted information indicating whether each of pictures included in multi-view image sequences is the reference picture; and performing predictive-encoding based on a result of the determination, wherein the information indicating whether each of pictures included in multi-view image sequences is the reference picture is included in a parameter for each of the pictures. | 05-15-2014 |
20140286394 | METHOD AND APPARATUS FOR ENCODING VIDEO, AND METHOD AND APPARATUS FOR DECODING VIDEO - A method of decoding an image includes obtaining information that indicates an intra prediction mode of a current block to be decoded, from a bitstream, the intra prediction mode indicating a particular direction among a plurality of directions, the particular direction being indicated by one of dx number of pixels in a horizontal direction and a fixed number of pixels in a vertical direction, and dy number of pixels in the vertical direction and a fixed number of pixels in the horizontal direction and obtaining a number of neighboring pixels located on one side among a left side of the current block and an upper side of the current block according to a position of a current pixel (j,i) and the particular direction (dx or dy) indicated by the intra prediction mode, when the number of the neighboring pixels is 1, obtaining a prediction value of the current pixel based on the neighboring pixel, and when the number of the neighboring pixels is 2, obtaining the prediction value of the current pixel based on a weighted average of the neighboring pixels. | 09-25-2014 |
20150019995 | IMAGE DISPLAY APPARATUS AND METHOD OF OPERATING THE SAME - Provided are an image display apparatus and a method of operating the same. The method includes recognizing a plurality of users, displaying a selection menu configured to allow selection of a personal screen corresponding to each of the recognized plurality of users, receiving an input selecting at least one personal screen from the selection menu, and displaying the selected at least one personal screen, wherein the at least one personal screen includes personal content based on user information. | 01-15-2015 |
20150042882 | METHOD OF ACQUIRING INFORMATION ABOUT CONTENTS, IMAGE DISPLAY APPARATUS USING THE METHOD, AND SERVER SYSTEM FOR PROVIDING INFORMATION ABOUT CONTENTS - A method of acquiring information about content includes the operations of receiving a video signal from an external apparatus connected to an image display apparatus, extracting an object included in an on screen display (OSD) image from an image that is produced using the video signal, and collecting the information about content by using the extracted object. | 02-12-2015 |
20150046968 | FUNCTION UPGRADE DEVICE, DISPLAY APPARATUS AND METHOD FOR CONTROLLING DISPLAY APPARATUS THEREOF - A function upgrade device, a display apparatus, and a method for controlling a display apparatus are provided. The function upgrade device may include a function unit configured to perform a function in conjunction with the display apparatus, a storage configured to store user information and an application related to the function unit, an interface configured to connect the function upgrade device to the display apparatus and enable the function upgrade device to communicate with the display apparatus, and a controller configured to, when the display apparatus is connected to the function upgrade device through the interface, control the function unit to operate in conjunction with the display apparatus based on the user information and the application stored in the storage. | 02-12-2015 |
20150086124 | METHOD AND APPARATUS FOR DETERMINING OFFSET VALUES USING HUMAN VISUAL CHARACTERISTICS - A method of determining an offset includes dividing a current image into a plurality of blocks, determining a category of pixels in each of the plurality of blocks based on values of neighboring pixels, determining an offset value for pixels belonging to the category, and adjusting the offset value based on characteristics of the category and a background pixel value of each of the pixels. The offset value is an average of differences between values of original images and restored images of pixels belonging to one category. The background pixel value is an average of values of pixels in a background pixel block to which the pixels belong among background pixel blocks divided to calculate a background pixel value. | 03-26-2015 |
Patent application number | Description | Published |
20110136334 | METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE - A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad. | 06-09-2011 |
20110293903 | WAVE SOLDERING APPARATUS TO APPLY BUOYANCY, SOLDERING METHOD, AND METHOD OF FORMING SOLDER BUMPS FOR FLIP CHIPS ON A SUBSTRATE - The present general inventive concept includes a wave soldering apparatus, a soldering method using the wave soldering apparatus, and a method of forming a solder bump for a flip chip. The wave soldering apparatus includes a solder bath containing a molten solder. A nozzle is arranged in the solder bath so as to upwardly spout the molten solder toward a bottom surface of a substrate that passes an upper portion of the solder bath. A liquid that is separated from the molten solder is contained in a downstream area of the solder bath, and buoyancy is applied to the molten solder, which is adhered to the substrate, by the liquid. Since the amount of the molten solder adhered to the substrate is increased by the buoyancy, it is possible to form the solder bump to have a height sufficient to use it as a flip chip. | 12-01-2011 |
20110318887 | METHOD OF MOLDING SEMICONDUCTOR PACKAGE - A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding. | 12-29-2011 |
20120028412 | SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor apparatus having a through electrode, a semiconductor package, and a method of manufacturing the semiconductor package are provided. The method of includes preparing a substrate including a buried via, the buried via having a first surface at a first end, and the buried via extending from a first substrate surface of the substrate into the substrate; planarizing a second substrate surface of the substrate opposite the first substrate surface to form a through via by exposing a second via surface at a second end of the buried via opposite the first end; forming a conductive capping layer on the exposed second via surface of the through via; and recessing the second substrate surface so that at least a first portion of the through via extends beyond the second substrate surface. | 02-02-2012 |
20120100668 | METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD - A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed. | 04-26-2012 |
20120115307 | METHODS OF MANUFACTURING SEMICONDUCTOR CHIPS - A method of manufacturing semiconductor chips includes providing a semiconductor substrate including circuit regions, irradiating the semiconductor substrate with a laser beam onto to form a frangible layer, and polishing the semiconductor substrate to separate the circuit regions of the semiconductor substrate from one another into semiconductor chips. The frangible layer may be removed completely during the polishing of the semiconductor substrate. | 05-10-2012 |
20120133048 | SEMICONDUCTOR DEVICE, FABRICATING METHOD THEREOF AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE - In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector. | 05-31-2012 |
20120199968 | SEMICONDUCTOR PACKAGE - A semiconductor package and method of manufacturing thereof are provided. The package includes: a substrate; a first metal wire on a top surface of the substrate; a first semiconductor chip disposed on the substrate; a first insulation layer which covers the first semiconductor chip and at least a part of the substrate; a second metal wire formed on a top surface of the first insulation layer; a first via formed in the first insulation layer, wherein the first via electrically connects the second metal wire and the first metal wire; and a second semiconductor chip disposed on the second metal wire, wherein the second semiconductor chip is electrically connected to the second metal wire. | 08-09-2012 |
20120199981 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE - A semiconductor device includes a first device including a first substrate and a first external connection terminal for connecting outside the first device; a second device stacked on the first device, the second device including a second substrate and a second external connection terminal for connecting outside the second device; an adhesive pattern disposed between the first device and second device, the adhesive pattern disposed in locations other than locations where the first external connection terminal and second external connection terminal are disposed, and the adhesive pattern causing the first device and second device, when stacked, to be spaced apart by a predetermined distance; and a plated layer disposed between and electrically and physically connecting the first external connection terminal and the second external connection terminal. | 08-09-2012 |
20120234497 | DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF - A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit. | 09-20-2012 |
20120282735 | METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE - A method of manufacturing a chip-stacked semiconductor package, the method including preparing a base wafer including a plurality of first chips each having a through-silicon via (TSV); bonding the base wafer including the plurality of first chips to a supporting carrier; preparing a plurality of second chips; forming stacked chips by bonding the plurality of second chips to the plurality of first chips; sealing the stacked chips with a sealing portion; and separating the stacked chips from each other. | 11-08-2012 |
20120309167 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a circuit unit on an upper surface thereof, a metal pad electrically connected to the circuit unit, and a passivation layer that covers the circuit unit and exposes the metal pad, forming a first re-wiring layer that is electrically connected to the metal pad and is formed by a printing method to extend from the metal pad on the passivation layer and forming a second re-wiring layer on the first re-wiring layer using the first re-wiring layer as a seed by using an electro-plating process. | 12-06-2012 |
20130203220 | METHOD OF MOLDING SEMICONDUCTOR PACKAGE - A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding. | 08-08-2013 |
20130208426 | SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME - A semiconductor chip and a first heat dissipation pattern are mounted on a substrate. The first heat dissipation pattern has an opening therein and exposes the semiconductor chip therethrough. A second heat dissipation pattern including a thermal interface material (TIM) is interposed between a side surface of the semiconductor chip and the first heat dissipation pattern. | 08-15-2013 |
20130264706 | Semiconductor Package and Method of Manufacturing the Same - A method of forming a semiconductor package having a large capacity and a reduced or minimized volume includes: attaching a semiconductor substrate on a support substrate using an adhesive layer, wherein the semiconductor substrate includes a plurality of first semiconductor chips and a chip cutting region, wherein first and second ones of the plurality of first semiconductor chips are separated each other by the chip cutting region, and the semiconductor substrate includes a first surface on which an active area is formed and a second surface opposite to the first surface; forming a first cutting groove having a first kerf width, between the first and second ones of the plurality of first semiconductor chips, so that the semiconductor substrate is separated into a plurality of first semiconductor chips; attaching a plurality of second semiconductor chips corresponding to the first semiconductor chips, respectively, to the plurality of first semiconductor chips; forming a molding layer so as to fill the first cutting groove; and forming a second cutting groove having a second kerf width that is less than the first kerf width, in the molding layer, so as to separate the molding layer into individual molding layers covering one of the plurality of first semiconductor chips and corresponding one of the plurality of second semiconductor chips. | 10-10-2013 |
20130292846 | SEMICONDUCTOR PACKAGE - Provided is a semiconductor package including a first semiconductor chip and a second semiconductor chip respectively disposed at a bottom and at a top so that active surfaces thereof face each other. Further includes is a first molding member for sealing the first semiconductor chip and exposing the active surface of the first semiconductor chip through a top surface, a first rewiring formed on the top surface of the first molding member and the active surface of the first semiconductor chip, a second rewiring formed on a bottom surface of the first molding member, a through-via for penetrating through the first molding member and electrically connecting the first and second rewirings, and a first connection member disposed between the first and second semiconductor chips. Also provided are various systems including same and various methods for making same. | 11-07-2013 |
20130330881 | DOUBLE-SIDED ADHESIVE TAPE, SEMICONDUCTOR PACKAGES, AND METHODS OF FABRICATING THE SAME - Provided are a double-sided adhesive tape, semiconductor packages, and methods of fabricating the packages. A method of fabricating semiconductor packages includes providing a double-sided adhesive tape on a top surface of a carrier, the double-sided adhesive tape including a first adhesive layer and a second adhesive layer stacked on the first adhesive layer, the first adhesive layer of the double-sided adhesive tape being in contact with the top surface of the carrier, adhering active surfaces of a plurality of semiconductor chips onto the second adhesive layer of the double-sided adhesive tape, separating the first adhesive layer from the second adhesive layer such that the second adhesive layer remains on the active surfaces of the semiconductor chips, patterning the second adhesive layer to form first openings that selectively expose the active surfaces of the semiconductor chips, and forming first conductive components on the second adhesive layer to fill the first openings. | 12-12-2013 |
20140057430 | SEMICONDUCTOR DEVICE, FABRICATING METHOD THEREOF AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE - In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector. | 02-27-2014 |
20140196280 | METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD - A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed. | 07-17-2014 |
Patent application number | Description | Published |
20120042334 | DISPLAY APPARATUS AND DISPLAY METHOD THEREOF - A display method and apparatus are disclosed. The display method includes selecting a broadcasting channel to display a broadcast program, accessing an outside server to receive a SNS (Social Network Service) message corresponding to at least one of the broadcasting channel and the broadcast program among SNS messages registered with the outside server, and displaying the received SNS message on a picture displaying the broadcast program. The display apparatus includes a receiving unit for selecting a broadcasting channel to receive a broadcast program; a signal processing unit for processing the received broadcast program for display, a communication unit for accessing an outside server for receiving a SNS (Social Network Service) message registered with the outside server; said SNS message corresponding to at least one of the broadcasting channel and the broadcast program among SNS messages registered with the outside server; and a control unit to control the signal processing unit to display the received SNS message on the picture displaying the broadcast program. | 02-16-2012 |
20120085819 | METHOD AND APPARATUS FOR DISPLAYING USING IMAGE CODE - A display method using an image code is provided, which can provide various types of information related to a moving image content. The display method includes perceiving the image code inserted in image forms in moving image information of a moving image content, analyzing the information included in the image code related to the moving image content, by decoding the image code, and displaying the information contained in the image code. | 04-12-2012 |
20140117407 | POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a power semiconductor device including: a base substrate having one surface and the other surface and formed of a first conductive type drift layer; a first conductive type diffusion layer formed on one surface of the base substrate and having a concentration higher than that of the first conductive type drift layer; and a trench formed so as to penetrate through the second conductive type well layer and the first conductive type diffusion layer from one surface of the base substrate including the second conductive type well layer in a thickness direction. | 05-01-2014 |
20140312383 | POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A power semiconductor device may include: abase substrate including a first conductive type drift layer; a second conductive type semiconductor substrate disposed on the other surface of the base substrate; a first conductive type diffusion layer disposed in the base substrate and having an impurity concentration higher than that of the drift layer; a second conductive type well layer disposed inside of one surface of the base substrate; a trench formed from one surface of the base substrate including the well layer so as to penetrate through the diffusion layer in a depth direction; a first insulation film disposed on a surface of the base substrate; and a first electrode disposed in the trench. A peak point of an impurity doping concentration of the diffusion layer in a transverse direction may be positioned in a region contacting a side surface of the trench. | 10-23-2014 |
20140337890 | DISPLAY APPARATUS CAPABLE OF PROVIDING A SOCIAL NETWORK SERVICE (SNS) MESSAGE AND DISPLAY METHOD THEREOF - A display method and apparatus are disclosed. The display method includes selecting a broadcasting channel to display a broadcast program, accessing an outside server to receive a SNS (Social Network Service) message corresponding to at least one of the broadcasting channel and the broadcast program among SNS messages registered with the outside server, and displaying the received SNS message on a picture displaying the broadcast program. The display apparatus includes a receiving unit for selecting a broadcasting channel to receive a broadcast program; a signal processing unit for processing the received broadcast program for display, a communication unit for accessing an outside server for receiving a SNS (Social Network Service) message registered with the outside server; said SNS message corresponding to at least one of the broadcasting channel and the broadcast program among SNS messages registered with the outside server; and a control unit to control the signal processing unit to display the received SNS message on the picture displaying the broadcast program. | 11-13-2014 |
20150041884 | POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a power semiconductor device including: a first semiconductor region of a first conductivity type; second semiconductor regions formed in the first semiconductor region and being of a second conductivity type; a well region formed above the second semiconductor regions and being of the second conductivity type; and a source region formed in the well region and being of the first conductivity type, wherein the second semiconductor regions include 1 to n layers formed from a lower portion of the device extending a in a direction of height of the device, and in the case that the widest width of the of the second semiconductor region of the n | 02-12-2015 |
20150087117 | POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a power semiconductor device including: a base substrate having one surface and the other surface and formed of a first conductive type drift layer; a first conductive type diffusion layer formed on one surface of the base substrate and having a concentration higher than that of the first conductive type drift layer; and a trench formed so as to penetrate through the second conductive type well layer and the first conductive type diffusion layer from one surface of the base substrate including the second conductive type well layer in a thickness direction. | 03-26-2015 |
Patent application number | Description | Published |
20080297903 | METHOD FOR DRIVING PIEZOELECTRIC ELEMENT OR OPTICAL MODULATOR INCLUDING PIEZOELECTRIC ELEMENT - Disclosed are a method for driving a piezoelectric element or an optical modulator including a piezoelectric element and a recorded medium recorded with a program for executing the same. In accordance with an embodiment of the present invention, the method for driving a piezoelectric element causing a displacement object to be displaced by being contracted or expanded according to a supplied driving voltage, including supplying a driving signal to the piezoelectric element during a first driving period in a first voltage range; supplying a control signal for controlling a polarization hysteresis of the piezoelectric element according to a driving, performed during the first driving period, to the piezoelectric element; and supplying the driving signal to the piezoelectric element during a second driving period in a second voltage range. | 12-04-2008 |
20090027752 | PROJECTION DISPLAY APPARATUS FOR REMOVING NOISE - A projection type of display apparatus for removing a noise is disclosed. In accordance with an embodiment of the present invention, the projection type of display apparatus includes: a light source; an optical board, incidenting a beam of light emitted from the light source; and an optical modulator, being fixed on one surface of the optical board and modulating and emitting the beam of light that passed through the optical board. The blocking layer is formed on the optical board. With the present invention, it is possible to remove the noise of the image and display the image more clearly by enhancing the contrast. | 01-29-2009 |
20090067034 | MEMS STRUCTURE AND OPTICAL MODULATOR HAVING TEMPERATURE COMPENSATION LAYER - An optical modulator can be provided that includes a substrate; an insulation layer positioned on the substrate; a ribbon layer such that its center portion is spaced apart from the insulation layer; a piezoelectric actuator positioned on either end of the ribbon layer that provides the driving force which moves the center portion of the ribbon layer vertically; and a temperature compensation layer, which is made of a thermally contracting material having a negative coefficient of expansion, and which is formed on at least one position of an upper portion of the piezoelectric actuator, a lower portion of the piezoelectric actuator, and a lower surface of the ribbon layer corresponding to a position of the piezoelectric actuator. In the optical modulator, the problem of thermal deformation due to rises in temperature can be resolved, whereby the accuracy and reliability of operation of the component can be increased. | 03-12-2009 |
20090141339 | OPTICAL MODULATOR, OPTICAL MODULATOR MODULE AND SCANNING DISPLAY APPARATUS INCLUDING THE SAME - Disclosed are an optical modulator and an optical modulator module that can reduce a laser speckle. The optical modulator module can include an optical modulator, modulating an incident beam of light incident according to a driving signal and outputting the modulated beam of light; and a light transmissive substrate, placed in the optical modulator and formed with a phase control pattern, the incident beam of light and the outputted beam of light passing through the light transmissive substrate and the phase control pattern being formed in a part of a surface that is a light path of the incident beam of light and the outputted beam of light. Here, the phase control pattern, a central peak of an autocorrelation function can have a width that is smaller than a width of the phase control pattern, and a side lobe level is smaller than a level of the central peak. | 06-04-2009 |
20090310202 | TILT MIRROR - A tilt mirror is disclosed. The tilt mirror can include: a reflection portion, which may reflect incident light; a first cantilever, which may be formed on either end of the reflection portion, and which may generate a stress in one direction; a second cantilever, which may be formed on either end of the reflection portion beside the first cantilever, and which may generate a stress in the other direction; and a connector portion, which may connect the reflection portion with one end of the first cantilever and with one end of the second cantilever such that the stress generated in the one direction and the stress generated in the other direction are transferred to the reflection portion. The tilt mirror provides a simple composition that can be utilized to alter the path for rays of light. | 12-17-2009 |
Patent application number | Description | Published |
20120057180 | Image forming apparatus and method for controlling the same - An image forming apparatus and a method for controlling the same are disclosed. The image forming apparatus includes an input unit to generate an administrator scan profile and establish a scan profile policy, and allows the administrator of the apparatus to apply a specific scan profile policy to all users sharing the apparatus using the input unit. The image forming apparatus includes an input unit to perform at least one of generation of a first scan profile and establishment of a scan profile policy, and a controller to perform a scanning operation according to at least one of the first scan profile and the scan profile policy. | 03-08-2012 |
20120066584 | HOST APPARATUS AND METHOD OF DISPLAYING CONTENT BY THE SAME - Disclosed are a host apparatus and a method of displaying a web content by the same, the method of displaying a (web) content by a host apparatus, the method including: executing a (web) browser and displaying a (web) page including at least one web content; selecting a (web) content clipping menu in the (web) browser; displaying a scrap board in one portion of the (web) browser through a plug-in; selecting the at least one (web) content from the displayed webpage; clipping and displaying the selected (web) content on a scrap board; storing the clipped (web) content as (web) clipped data in a predetermined format; displaying the stored (web) clipped data; and updating the displayed clipped data with data corresponding to a current uniform resource locator (URL). | 03-15-2012 |
20120072833 | Host apparatus and screen capture control method thereof - A host apparatus which controls screen capture using a web capture application or a capture application, and a screen capture control method thereof. The host apparatus shares capture areas or saved files using a web capture application through which a screen of a web browser is captured and is compatibly saved or using a capture application through which a desktop screen is captured and is compatibly saved. | 03-22-2012 |
20130021641 | HOST DEVICE, MANAGEMENT SERVER, AND METHOD OF SOLVING ERROR OF IMAGE FORMING APPARTUS - A host device includes a communication interface unit to receive status information from an image forming apparatus, an error processing unit to control the communication interface unit to transmit error information including the status information to the management server if it is determined that the image forming apparatus has an error according to the received status information, and a user interface unit to display a video manual if a URL address providing a video manual to solve an error of the image forming apparatus is received from the management server. | 01-24-2013 |
20130055069 | METHOD AND APPARATUS FOR INSERTING IMAGE INTO ELECTRONIC DOCUMENT - A method of inserting an image into an electronic document, the method including receiving setting information and identification information regarding the image; determining whether the image included in image data corresponds to the identification information by using a result of analysis of the image data; and according to a result of the determination, inserting the image corresponding to the identification information into a position of the electronic document, according to the setting information. | 02-28-2013 |
20130063771 | APPARATUS AND METHOD FOR UPLOADING IMAGE FILE OF APPARATUS TO SOCIAL NETWORK SERVICE - An apparatus and a method for uploading an image file of the apparatus to a social network service (SNS) site are provided. The method includes displaying history information on a user interface (UI) screen, which is displayed on a display unit of the apparatus, through an application executed in the apparatus, selecting an image file displayed in the history information, selecting an SNS site, and uploading the selected image file to the selected SNS site. The history information is generated by the application so as to correspond to an image file. The image file may be generated through the image scanning apparatus and uploaded to the SNS site, generated through the image scanning apparatus and not uploaded to the SNS site, or stored in a storage unit of the apparatus and uploaded to the SNS site. | 03-14-2013 |
20140111820 | USER TERMINAL APPARATUS AND METHOD OF CONTROL THEREOF - A user terminal apparatus is provided, which connects to an image forming apparatus, which is driven by an operating system (O/S, and which includes a storage to store the image forming apparatus and a metro application to perform a job. A display displays a background screen of the including a user interface (UI) area corresponding to a job option, a controller implements the metro application, if the UI area is selected, and a communication interface transmits a command to perform the job to the image forming apparatus according to the job option corresponding to the UI area, by using the metro application. | 04-24-2014 |
20140111821 | USER TERMINAL APPARATUS AND METHOD OF CONTROLLING THEREOF - A user terminal apparatus to connect to an image forming apparatus having a scan function to be driven on an operating system of Windows 8™ includes a storage to store a metro application which displays a user interface window to receive a command to perform a scan job and a V4 driver to communicate with the image forming apparatus, a user interface to perform the scan job of the image forming apparatus by utilizing the user interface window provided by the metro application, if the metro application implements, a communicating interface to request and receive address information of the image forming apparatus by utilizing the V4 driver, and a controller to control the communicating interface to transmit the command to perform the scan job to the image forming apparatus based on the received address information and to receive the scan data corresponding to the command to perform the scan job. | 04-24-2014 |
20140111823 | USER TERMINAL APPARATUS AND METHOD OF CONTROLLING THEREOF - A user terminal apparatus to connect to an image forming apparatus and which is driven by an operating system (O/S), and which includes a storage to store a metro application to provide a user interface window including status information of the image forming apparatus and a V4 driver to communicate with the image forming apparatus, a communicating interface to receive a first status message and address information of the image forming apparatus by using the V4 driver, a controller to control the communicating interface to request a second status message that is more detailed than a first status message to the image forming apparatus by using the metro application and the address information, and a display to display at least one of the first status message and the second status message on a user interface window provided by the metro application. | 04-24-2014 |
20140380220 | METHOD AND APPARATUS FOR PROVIDING USER INTERFACE FOR MEDICAL IMAGING - A method for providing a UI for medical imaging of an object includes: generating UIs respectively corresponding to processes for imaging the object; determining a display order of the UIs; receiving a UI completion input of the medical professional regarding the first UI; and displaying the second UI in response to the receiving the UI completion input. The UIs corresponding to the processes for imaging the object may be automatically provided to the medical professional, based on the order. | 12-25-2014 |
Patent application number | Description | Published |
20080309224 | Organic light emitting display apparatus - An organic light emitting display apparatus includes: a substrate; a display unit including a plurality of subpixels arranged on the substrate, the plurality of subpixels respectively emitting different colored light; a sealing substrate arranged on the display unit; a micro lens unit including a plurality of micro lenses arranged on a surface of the sealing substrate facing the display unit; barrier ribs arranged between the sealing substrate and the substrate to define a space between the micro lens unit and the display unit; and a black matrix arranged under the barrier ribs. | 12-18-2008 |
20080309230 | Full color organic electroluminescence display devices by thermal patterning using laser and method for manufacturing the same - An organic electroluminescence display device made by a laser induced thermal imaging process has a substrate having first and second electrode layers, and an organic layer having red, green, and blue light-emitting layers between the electrode layers. Thermosetting light-emitting materials are used to form the red, green, and blue light-emitting layers, and a laser is then selectively irradiated onto a light-to-heat conversion layer formed on the substrate to deliver heat energy converted from light energy through the light-to-heat conversion layer to the thermosetting light-emitting materials so that curing is progressed to form patterned light-emitting layers. In accordance with the fabrication method of the present invention, the light-emitting materials may be patterned using a laser, thereby fabricating a large scaled organic electroluminescence display device and simplifying the process by not using a mask when the light-emitting layers are formed. | 12-18-2008 |
20090072729 | Flat Panel Display - A flat panel display capable of reducing element defects by decreasing taper angles of contact holes and a via hole. The flat panel display includes a thin film transistor having at least source and drain electrodes formed over an insulating substrate, an insulating layer having a via hole for exposing one of the source and drain electrodes, and an anode connected to said one of the source and drain electrodes through the via hole. The via hole and the anode are tapered with taper angles of 60° or less. The source and drain electrodes are connected respectively to source and drain regions of the thin film transistor through the contact holes. The contact holes are also tapered with taper angles of 60° or less. | 03-19-2009 |
20090179565 | Organic electroluminescent display and method for fabricating the same - An organic electro luminescent display with auxiliary layers on a cathode contact and an encapsulating junction region to easily remove polymer organic layers of the junction. The organic electro luminescent display has the first electrode formed on a lower insulating substrate, a pixel defining layer formed to make some portions of the first electrode opened over the entire surface of the lower insulating substrate, an organic emission layer formed on an opening of the first electrode, the second electrode formed on the organic emission layer, an upper substrate for encapsulating the first electrode, the organic emission layer and the second electrode, and auxiliary layers formed on the cathode contact and the encapsulating junction region of the lower insulating substrate. | 07-16-2009 |
20100231124 | ORGANIC LIGHT EMITTING DISPLAY AND METHOD OF FABRICATING THE SAME - An organic light emitting display and a method of fabricating the same, in which the resistance of a cathode electrode is reduced by applying a conductive ink material on the cathode electrode. A pixel defining layer is formed on a substrate, with a recess or depression in a non-light emitting region of the pixel defining layer. An electrode on the substrate includes a portion within the recess of the pixel defining layer. The conductive ink is in the portion of the electrode in the recess. | 09-16-2010 |
Patent application number | Description | Published |
20090057709 | NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE - A nitride semiconductor light emitting diode (LED) comprises an n-type nitride semiconductor layer; an electron emitting layer formed on the n-type nitride semiconductor layer, the electron emitting layer being composed of a nitride semiconductor layer including a transition element of group III; an active layer formed on the electron emitting layer; and a p-type nitride semiconductor layer formed on the active layer. | 03-05-2009 |
20090090921 | NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE - A nitride semiconductor light emitting diode (LED) comprises an n-type nitride semiconductor layer; an electron emitting layer formed on the n-type nitride semiconductor layer, the electron emitting layer being composed of a nitride semiconductor layer including a transition element of group III; an active layer formed on the electron emitting layer; and a p-type nitride semiconductor layer formed on the active layer. | 04-09-2009 |
20090095965 | NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE - A nitride semiconductor light emitting diode (LED) comprises an n-type nitride semiconductor layer; an electron emitting layer formed on the n-type nitride semiconductor layer, the electron emitting layer being composed of a nitride semiconductor layer including a transition element of group III; an active layer formed on the electron emitting layer; and a p-type nitride semiconductor layer formed on the active layer. | 04-16-2009 |
20120119249 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - An LED and manufacturing method therefor. The LED comprises a compound semiconductor structure having first and second compound layers and active layer, first and second electrode layers atop the second compound semiconductor layer and connected to the two compound. An insulating layer is coated in regions other than where the first and second electrode layers are located. A conducting adhesive layer is formed atop the non-conductive substrate, connecting the same to the first electrode layer and insulating layer. Formed on one side surface of the non-conductive substrate and adhesive layer is a first electrode connection layer connected to the conducting adhesive layer. A second electrode connection layer on the other side surface is connected to the second electrode layer. | 05-17-2012 |
20140231849 | SEMICONDUCTOR LIGHT-EMITTING DEVICES - Semiconductor light-emitting devices including a semiconductor region that includes a light-emitting structure; and an electrode layer including a first reflection metal layer that contacts a first portion of the semiconductor region and being configured to reflect light from the light-emitting structure and a second reflection metal layer that contacts a second portion of the semiconductor region and being configured to reflect light from the light-emitting structure, wherein the second reflection metal layer is spaced apart from the first reflection metal layer and at least partially covers the first reflection metal layer. | 08-21-2014 |
20140252390 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a semiconductor region having a light-emitting structure, an electrode layer formed on the semiconductor region, and a reflective protection structure extending exposing the upper surface of the electrode layer and covering the semiconductor region adjacent to the electrode layer. | 09-11-2014 |
20140374772 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor light-emitting device, and a method of manufacturing the same. The semiconductor light-emitting device includes a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked on a substrate, a first contact that passes through the substrate to be electrically connected to the first electrode layer, and a second contact that passes through the substrate, the first electrode layer, and the insulating layer to communicate with the second electrode layer. The first electrode layer is electrically connected to the first semiconductor layer by filling a contact hole that passes through the second electrode layer, the second semiconductor layer, and the active layer, and the insulating layer surrounds an inner circumferential surface of the contact hole to insulate the first electrode layer from the second electrode layer. | 12-25-2014 |
Patent application number | Description | Published |
20100197821 | ADHESIVE COMPOSITION AND ADHESIVE FILM MADE THEREFROM - Disclosed is an adhesive composition including a compound having a multi-functional urethane (meth)acrylate group and an adhesive film prepared by using it. The adhesive composition includes compounds represented by Chemical Formulae 1 to 3. The compound represented by Chemical Formulae 1 to 3 includes an urethane (meth)acrylate group represented by the Chemical Formula 1-1 or 1-2. | 08-05-2010 |
20100197876 | PHOTOCURABLE COMPOUND - Disclosed is a compound having a photocurable urethane (meth)acrylate group, its manufacturing method, and a photocurable composition including the compound. The compound is represented by Chemical Formulae 1 to 6. Each of Chemical Formulae 1 to 6 includes a urethane (meth)acrylate group represented by Chemical Formula 1-1 or 1-2. | 08-05-2010 |
20110091811 | DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAME, AND METHOD OF FORMING PATTERNABLE ADHESIVE LAYER USING THE SAME - A patternable adhesive film is formed in a double-layered structure of an adhesive layer having patternability and an adhesive layer having both adhesion and developability. Thus, the double-layered patternable adhesive film can effectively have both patternability and adhesion. | 04-21-2011 |
20110251319 | DIELECTRIC PASTE COMPOSITION, METHOD OF FORMING DIELECTRIC LAYER, DIELECTRIC LAYER, AND DEVICE INCLUDING THE DIELECTRIC LAYER - A dielectric paste composition including: a plurality of inorganic dielectric particles, a binder, a solvent, and a halogenated hydrocarbon. Also disclosed is a method of forming a dielectric layer, a dielectric layer, and a device including the dielectric layer. | 10-13-2011 |
20120172194 | DIELECTRIC CERAMIC AND METHOD OF MANUFACTURING THE SAME - A method for manufacturing a dielectric ceramic, the method including: combining a ferroelectric compound having a perovskite structure and a halide to provide a mixture; heat treating the mixture; and removing the halide from the heat treated mixture to manufacture the dielectric ceramic. | 07-05-2012 |
20120264963 | PHOTOCURABLE COMPOUND - Disclosed is a compound having a photocurable urethane(meth)acrylate group, its manufacturing method, and a photocurable composition including the compound. The compound is represented by Chemical Formulae 1 to 6. Each of Chemical Formulae 1 to 6 includes a urethane(meth)acrylate group represented by Chemical Formula 1-1 or 1-2. | 10-18-2012 |
20130296594 | PHOTOCURABLE COMPOUND - Disclosed is a compound having a photocurable urethane (meth)acrylate group, its manufacturing method, and a photocurable composition including the compound. The compound is represented by Chemical Formulae 1 to 6. Each of Chemical Formulae 1 to 6 includes a urethane (meth)acrylate group represented by Chemical Formula 1-1 or 1-2. | 11-07-2013 |