Chen, Tainan County
Alfred Lean-Foo Chen, Tainan County TW
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20080290175 | Layer-built body having hidden barcode and figures thereof - A layer-built body having hidden barcodes and figures thereof is disclosed in the invention, so as to allow barcode scanning devices to read the barcodes, the layer-built body comprising: a lenticular lens sheet divided into a first surface and a second surface, and the first surface has a plurality of convex lens-shaped optical structures disposed thereon; a patterned layer printed with trademarks or figures, and divided into a plurality of striped images; and at least a barcode layer printed with information about barcodes and divided into a plurality of striped images. The striped images of the barcode layer are alternated with the striped images of the patterned layer to make a synthesized image layer, and are combined with the second surface of the lenticular lens sheet; wherein when a viewer looks at the layer-built body from an ordinary angle, the optical structures of the lenticular lens sheet allows the viewer to see contents of the patterned layer completely, and when the layer-built body is tilted at specific angles, the optical structures of the lenticular lens sheet allows barcode scanning devices to read contents of the barcode layer. Therefore, information about barcodes and figures may be provided on a fixed surface area simultaneously. | 11-27-2008 |
Bo-Nan Chen, Tainan County TW
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20110186950 | METHOD OF FABRICATING IMAGE SENSOR AND IMAGE SENSOR THEREOF - A method of fabricating an image sensor and an image sensor thereof are provided. The method comprises: providing a mask; utilizing the mask at a first position to form a first group of micro-lenses having a first height on a first group of color filters of a color filter array on a pixel array; shifting the mask from the first position to a second position, wherein a distance between the first position and the second position is substantially equal to a width of a pixel of the pixel array; and utilizing the mask at the second position to form a second group of micro-lenses having a second height, different from the first height, on a second group of color filters of the color filter array. | 08-04-2011 |
20120075736 | COLOR FILTER AND MANUFACTURING METHOD THEREOF - A method for manufacturing a color filter is provided. The method includes following steps. A substrate is provided. A first filter layer is formed on a first part of a first region and a first part of a second region of the substrate. A second filter layer is formed on a second part of the second region. A third filter layer is formed on a second part of the first region and a third part of the second region. When a white beam is projected on the color filter, the first region and the second region reflect a plurality of color beams. A color filter manufactured through the method is also provided. | 03-29-2012 |
Chao-Hsing Chen, Tainan County TW
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20110312113 | LIGHT-EMITTING DIODE STRUCTURE WITH ELECTRODE PADS OF SIMILAR SURFACE ROUGHNESS AND METHOD FOR MANUFACTURING THE SAME - A light-emitting diode (LED) structure and a method for manufacturing the LED structure are disclosed for promoting the recognition rate of LED chips, wherein a roughness degree of the surface under a first electrode pad of a first conductivity type is made similar to that of the surface under a second electrode pad of a second conductivity type, so that the luster shown from the first electrode pad can be similar to that from the second electrode pad, thus resolving the poor recognition problem of wire-bonding machines caused by different lusters from the first and second electrode pads. | 12-22-2011 |
Chao-Yi Chen, Tainan County TW
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20110222622 | BIT-STUFFING METHOD FOR CROSSTALK AVOIDANCE IN HIGH-SPEED BUSES - This invention discloses a bit-stuffing method for crosstalk avoidance in high-speed buses, which comprises the steps of inputting a plurality of data bit streams in parallel to a data input buffer; the data input buffer sequentially inputting data bits of the data bit streams to a bit-switching unit, and the bit-switching unit switching the data bits to generate bit-switched data; parallelly inputting the bit-switched data to a bit-stuffing encoding unit; the bit-stuffing encoding unit performing bit-stuffing encoding on the bit-switched data to generate encoded data bits and inputting the encoded data bits to an encoded data buffer; and the encoded data buffer outputting the encoded data to a high-speed bus. The encoded data bits passed through the high-speed bus are decoded using a bit-removing method to recover the data bit streams. | 09-15-2011 |
Cheng Chieh Chen, Tainan County TW
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20100288012 | APPARATUS FOR TESTING BONDING STRENGTH OF ELECTRICAL CONNECTIONS AND FRICTIONLESS CALIBRATION DEVICE FOR THE SAME - An apparatus for testing bonding strength of electrical connection comprises a platform including a two-axis drive, a device holder positioned on the two-axis drive and configured to receive an electronic device, a vertical drive positioned on the platform, a cantilever positioned on the vertical drive, and a test head connected in a rotational manner with the cantilever. A frictionless calibration device for shear force testing comprises a base, two supporters positioned on the base, a shaft having two tapering ends positioned between the two supporters, and a calibration member fixed on the shaft, wherein the shaft and the calibration member contact the supporters in a rotational manner. | 11-18-2010 |
Cheng-Heng Chen, Tainan County TW
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20110150449 | OPTICAL ZOOM SYSTEM - An optical zoom system including a photo sensor, a wafer level optical (WLO) lens module and a focusing motor is provided. The WLO lens module is located at the photo sensor. The WLO lens module includes at least one transparent substrate and at least one lens, wherein the lens is disposed on the transparent substrate. The focusing motor is located between the WLO lens module and the photo sensor. The focusing motor drives the WLO lens module to move toward or backward the photo sensor. | 06-23-2011 |
20110222173 | WAFER LEVEL OPTICAL LENS SUBSTRATE AND FABRICATION METHOD THEREOF - A wafer level optical lens substrate including a substrate and at least one lens is provided. The substrate has at least one through hole and at least one flange, wherein each flange is located on a side wall in each through hole. Each lens located in each through hole is embedded with each flange. A method of fabricating a wafer level optical lens substrate and a wafer level optical lens module are also provided respectively. | 09-15-2011 |
Chia-Ming Chen, Tainan County TW
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20080200041 | STORAGE DEVICE - The present disclosure relates to a storage device. The storage device comprises a frame having a hole and a printed circuit board embedded in the frame, wherein the printed circuit board has an extended part for forming a connector. The connector may pass through the hole and is exposed out the frame for interfacing the storage device with a host device. At least one memory device is mounted to the printed circuit board and electrically connected to the printed circuit board. | 08-21-2008 |
Chien-Chun Chen, Tainan County TW
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20090046044 | APPARATUS FOR DRIVING A DISPLAY PANEL - A source driver including a first line buffer, a second line buffer, a third line buffer and an analog-to-digital converter is provided. The first line buffer sequentially latches first data bits of values of pixels. The second line buffer sequentially latches second data bits of the values of the pixels. The third line buffer parallelly transfers all the data bits latched by the first and second line buffers. The analog-to-digital converter generates driving voltages for the pixels according to the first and second data bits transferred by the third line buffer, in which the first and second line buffers operate in parallel. | 02-19-2009 |
Chien-Jung Chen, Tainan County TW
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20080309840 | PIXEL ELEMENT AND LIQUID CRYSTAL DISPLAY - A pixel element and a liquid crystal display with discharge function are disclosed. In each of the pixel elements of the liquid crystal display, a transistor is disposed between the common electrode and the pixel electrode. The transistor will be turned on by a discharge signal sent from the master control unit of the liquid crystal display when the liquid crystal display is turned on or turned off, so as to provide the same common voltage to both the common electrode and the pixel electrode. Therefore, the positive and negative charges accumulated in the common electrode and the pixel electrode can be removed and the liquid crystal display is well protected. | 12-18-2008 |
Chien-Pin Chen, Tainan County TW
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20090295844 | COLOR-SEQUENTIAL DISPLAY METHOD - A display method for driving a color-sequential display of an electronic device is provided. When the electronic device is not at low power mode, a first image is displayed first by using a second color data and a first color data of the first image sequentially to drive the display. Next, a second image is displayed by using a second color data and a third color data of the second image sequentially to drive the display. When the electronic device is at low power mode, the respective luminance of the first and the second images are obtained. Then, the respective luminance of the first image and the second image are sequentially used to drive the display. | 12-03-2009 |
20100264522 | SEMICONDUCTOR DEVICE HAVING AT LEAST ONE BUMP WITHOUT OVERLAPPING SPECIFIC PAD OR DIRECTLY CONTACTING SPECIFIC PAD - A semiconductor device includes a semiconductor chip, a plurality of bumps and at least one electrically conductive component. The semiconductor chip includes an active area having electronic circuits formed therein and a plurality of pads. The plurality of bumps is placed on the semiconductor chip, wherein a location where at least one of the bumps is located on the semiconductor chip does not overlap a location where a specific pad of the pads is located on the semiconductor chip. The electrically conductive component connects a top surface of at least the bump and the specific pad. | 10-21-2010 |
Chin-Jung Chen, Tainan County TW
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20100105431 | ELECTRONIC DEVICE HAVING PROJECTION FUNCTIONALITY - An electronic device with a projection functionality includes: a universal serial bus (USB) port, a processing circuit, a storage, a storage controller and a display circuit. The USB port receives USB packets carrying a first pixel data. The processing circuit is coupled to the USB port, and converts the received USB packets into the first pixel data. The storage controller is coupled between the processing circuit and the storage, and stores the first pixel data into the storage. The display circuit is coupled to the storage controller, and generates a display driving signal according to the first pixel data stored in the storage. | 04-29-2010 |
20100295997 | AUTOMATIC WHITE BALANCE SYSTEM AND METHOD THEREOF - An automatic white balance (AWB) system including a luminaire, a light sensing unit, an analog-to-digital converter, a control unit and a driving circuit is provided. In the AWB system of a projection apparatus, the suitable AWB method is applied. The light sensing unit includes a light sensor and a light sensing circuit. The light sensor is coupled to the light sensing circuit for sensing intensity of the color lights emitted from the luminaire, no matter what colors the color lights emitted from the luminaire are. The white balance of the color lights in the AWB system of the projection apparatus is automatically achieved with the light sensor instead of the color sensors. Therefore, the cost of the projection apparatus with the AWB system is reduced. | 11-25-2010 |
20110316890 | DISPLAY AND REAL-TIME AUTOMATIC WHITE BALANCE METHOD THEREOF - A display and a real-time automatic white balance method thereof are provided. The display includes a first color light source and a second color light source. The real-time automatic white balance method includes following steps. A first target luminance of the first color light source and a second target luminance of the second color light source are provided. A luminance of the first color light source is detected to obtain a first current luminance. A second current luminance of the second color light source is calculated according to a ratio of the first target luminance to the first current luminance and the second target luminance. A luminance of the second color light source is adjusted according to the second current luminance. | 12-29-2011 |
Chung-Jen Chen, Tainan County TW
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20090259193 | DISPOSABLE SYRINGE AFTER ONE TIME USAGE - A disposable syringe after one time usage includes an outer tube having an inner teeth set formed on the inner wall of the outer tube and an inner tube having an outer teeth set formed on the outer wall of the inner tube and a safety guide. The inner teeth set of the outer tube meshes with the outer teeth set of the inner tube. The single direction design of the teeth sets allows the outer tube to be pulled away from the inner tube, but not to be pushed back. The pulling force of the outer tube will pull the safety guide to form a damaged groove and the outer tube is adapted to enclose a needle so that the needle is not exposed outwardly, which prevents the needle from poking people accidentally. The syringe is unable to be reused. | 10-15-2009 |
Chun-Hui C. C. Chen, Tainan County TW
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20090196817 | METHOD FOR MAKING A COPPER INDIUM CHALCOGENIDES POWDER - A method for making a copper indium chalcogenides powder, includes: (a) reacting a reactant mixture that contains a Cu-containing material, an In-containing material, and a chalcogenides-containing material in a polar organic solvent at an elevated temperature so as to form a precipitate, the polar organic solvent having a molecular structure containing at least one of nitrogen atom and oxygen atom, each of which having at least one lone electron pair, the polar organic solvent further having a dipole moment greater than 2.3 debye; and (b) separating the polar organic solvent from the precipitate. | 08-06-2009 |
Chun-Lang Chen, Tainan County TW
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20080248404 | Method for Controlling Phase Angle of a Mask by Post-Treatment - A method for controlling phase angle of a mask is provided. A mask comprising a substrate and an absorber is formed. A nitrogen-containing plasma treatment is performed on the mask to reduce the phase angle. Alternatively, a nitrogen-containing plasma treatment is performed on the mask, followed by a vacuum ultraviolet treatment to form a passivated layer on the mask. | 10-09-2008 |
20110318863 | PHOTOVOLTAIC DEVICE MANUFACTURE - A photovoltaic device manufacturing method is disclosed. Methods include manufacturing a photovoltaic cell using nanoimprint technology to define individual cell units of the photovoltaic device. The methods can include providing a substrate; forming a first conductive layer over the substrate; forming first grooves in the first conductive layer using a nanoimprint and etching process; forming an absorption layer over the first conductive layer, the absorption layer filling in the first grooves; forming second grooves in the absorption layer using a nanoimprint process; forming a second conductive layer over the absorption layer, the second conductive layer filling in the second grooves; and forming third grooves in the second conductive layer and the absorption layer, thereby defining a photovoltaic cell unit. | 12-29-2011 |
20120003780 | PHOTOVOLTAIC CELL MANUFACTURE - A photovoltaic cell manufacturing method is disclosed. Methods include manufacturing a photovoltaic cell having a selective emitter and buried contact (electrode) structure utilizing nanoimprint technology. The methods include providing a semiconductor substrate having a first surface and a second surface opposite the first surface; forming a first doped region in the semiconductor substrate adjacent to the first surface; performing a nanoimprint process and an etching process to form a trench in the semiconductor substrate, the trench extending into the semiconductor substrate from the first surface; forming a second doped region in the semiconductor substrate within the trench, the second doped region having a greater doping concentration than the first doped region; and filling the trench with a conductive material. The nanoimprint process uses a mold to define a location of an electrode line layout. | 01-05-2012 |
20120021555 | PHOTOVOLTAIC CELL TEXTURIZATION - A photovoltaic cell texturization method is disclosed. The method includes providing a photovoltaic cell substrate; and texturizing a surface of the photovoltaic cell substrate. The texturizing implements a nanoimprint lithography process to expose a portion of the surface of the photovoltaic cell substrate. An etching process is performed on the exposed portion of the exposed portion of the surface of the photovoltaic cell substrate. | 01-26-2012 |
20140199787 | Semiconductor Mask Blanks with a Compatible Stop Layer - Provided is a method for creating a mask blank that includes a stop layer. The stop layer is optically compatible and process compatible with other layers included as part of the mask blanks. Such blanks may include EUV, phase-shifting, or OMOG masks. The stop layer includes molybdenum, silicon, and nitride in a proportion that allows for compatibility and aids in detection by a residual gas analyzer. Provided is also a method for the patterning of mask blanks with a stop layer, particularly the method for removing semi-transparent residue defects that may occur due to problems in prior mask creation steps. The method involves the detection of included materials with a residual gas analyzer. Provided is also a mask blank structure which incorporates the compatible stop layer. | 07-17-2014 |
Hsin-Cheng Chen, Tainan County TW
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20090323487 | OPTICAL DISK DRIVE AND METHOD FOR DATA RECORDING OF OPTICAL DISK DRIVES - The invention provides a method for data recording of an optical disk drive. First, raw data is encoded to obtain a plurality of recording units of encoded data to be stored in a memory. The encoded data stored in the memory is then recorded to an optical disk. A predetermined number of recording units of the encoded data is then reserved in the memory as reserved data without being recorded onto the optical disk. The recorded data read from the optical disk is then compared to the corresponding encoded data stored in the memory to verify correctness of the recorded data. The reserved data is then recorded to the optical disk after correctness verification of the recorded data is completed. Finally, the aforementioned steps are repeated until there is no more raw data left as a source for encoding. | 12-31-2009 |
Hsin-Chi Chen, Tainan County TW
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20090045456 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating a semiconductor device is provided. The method includes forming a gate structure on a substrate. The gate structure includes a patterned gate dielectric layer, a patterned gate conductor layer, a cap layer and a spacer. Next, a first and a second recesses are formed in the substrate on the two sides of the gate structure. Thereafter, a protection layer is formed on the bottom surfaces of the first and the second recesses, and then a etching process is performed to laterally enlarge first and the second recesses towards the direction of the gate structure. Thereafter, a material layer is respectively formed in the first recess and the second recess. Afterward, two source/drain contact regions are respectively formed in the material layers of the first recess and the second recess. | 02-19-2009 |
Hsing-Ju Chen, Tainan County TW
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20100045200 | Lamp drive circuit - A lamp drive circuit used for driving a number of lamps is provided. The lamps are used in the backlight module. The backlight module is used for providing a light source during a liquid crystal display displays. The lamps are respectively electrically connected to a coil is. The coils substantially have the same coil turns and have the same magnetic circuit, so that the currents flowing through the lamps are balanced. | 02-25-2010 |
Hsin-Hung Chen, Tainan County TW
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20090141209 | Liquid Crystal Display Panel and Liquid Crystal Display Apparatus - A liquid crystal display panel and a liquid crystal display apparatus are disclosed. The apparatus comprises a liquid crystal display panel, a backlight module and a composite tape. The composite tape is assembled to the liquid crystal display panel and the backlight module, wherein the composite tape comprises an insulating layer, a first adhesive layer and an electrically conductive layer. The first adhesive layer is formed at one side of the insulating layer. The electrically conductive layer is formed at another side of the insulating layer, wherein the electrically conductive layer is in touch with an electrically conductive element of the liquid crystal display apparatus to be connected to ground. | 06-04-2009 |
Hung-Che Chen, Tainan County TW
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20110121323 | Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity - A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two. | 05-26-2011 |
I-Yao Chen, Tainan County TW
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20080217296 | ETCHING APPARATUS FOR SEMICONDUCTOR PROCESSING APPARATUS AND METHOD THEREOF FOR RECYCLING ETCHANT SOLUTIONS - An etching apparatus of a semiconductor processing apparatus and the method thereof for recycling etchant solutions are provided. The method is suitable for a processing apparatus which provides an etchant solution on a wafer so as to perform an etching process. After the etching process is completed, a water solution is added to the etchant solution for maintaining a water content thereof. Then, the mixed etchant solution is recycled. | 09-11-2008 |
Jiann-Fuh Chen, Tainan County TW
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20100308743 | Light Emitting Diode Driving Device - An LED driving device includes: an LED unit outputting a driving current corresponding to an external AC input voltage; and a current limiting unit receiving the driving current from the LED unit, including a parallel connection of a bypass switch and a current limiting circuit, and operable so as to permit flow of the driving current through one of the bypass switch and the current limiting circuit such that the current limiting unit has a first conduction impedance when the bypass switch is in an ON-state, and a second conduction impedance larger than the first conduction impedance when the bypass switch is in an OFF-state. | 12-09-2010 |
20110156602 | LIGHT EMITTING DIODE DRIVING DEVICE - An LED driving device includes: an LED circuit having an input side for receiving a driving current corresponding to an AC input voltage from an external power source when the magnitude of a driving voltage across the input side is greater than a predetermined value; and a clamp circuit coupled between the input side of the LED circuit and the external power source, and permitting the driving current to pass through for clamping the magnitude of the driving current to a predetermined current level and for clamping the magnitude of the driving voltage to a predetermined voltage level. | 06-30-2011 |
Jo Chen, Tainan County TW
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20100054977 | VARIABLE DISPLACEMENT PUMP - A variable displacement pump includes a pump body defining first and second pools for introducing fuel/lubricant oil, and internal and external rotary members rotatably mounted on the pump body and cooperatively defining a space such that, during counterclockwise revolution, the fuel/lubricant oil is taken up from the first pool by sweeping of the space over the first pool, and is delivered to the second pool. A control slider is sleeved on the external rotary member, and has an actuated tooth moved by an expansion force in the second pool to counteract the external rotary member so as to reduce the volume of the space, thereby reducing delivery of the fuel/lubricant oil into the second pool. A biasing member is disposed to bias the actuated tooth towards the second pool. | 03-04-2010 |
Jung-Kuang Chen, Tainan County TW
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20100104351 | WRITING INSTRUMENT - The writing instrument comprises a first hollow tube body, a second hollow tube body and a refill. The first hollow tube body comprises a passing hole. The second hollow tube body comprises a protrusion end to correspondingly, tightly fit with the first hollow tube body, and an air inlet at the other end. The first hollow tube body comprises scale holes, at least two semitone holes near the passing hole, first air outlets, the first air outlets being between the two semitone holes. The second hollow tube body further comprises a second air outlet. Via combination of the first hollow tube body and the second hollow tube body, different tones are generated by covering the scale holes and the semitone holes. The refill can be disposed into the writing instrument, and a nib of the refill can protrude outside of the writing instrument from the passing hole. | 04-29-2010 |
Kai-Ji Chen, Tainan County TW
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20080284502 | CURRENT BIASING CIRCUIT - A current biasing circuit is provided, which is designed to suppress reference current drift caused by temperature variation with a low overall temperature coefficient of a constant-voltage circuit and at least one resistor. The constant-voltage circuit comprises a diode and/or a diode-connected transistor. This current biasing circuit is based on a current mirror architecture, is easy to implement, and is a relatively temperature-independent current source. | 11-20-2008 |
20090207109 | CIRCUIT AND METHOD FOR DRIVING LIGHT EMITTING DIODES - A circuit and a method for driving light emitting diodes (LEDs) are provided. First, an input voltage is converted into an output voltage and the output voltage is transmitted to the anode terminals of LED strings. The output voltage is reduced when the output voltage is greater than a first threshold voltage and the output voltage is reduced when the lowest level among the cathode terminal voltages of all the LED strings is greater than a second threshold voltage. Thus, the output voltage can be maintained at a lower level for driving all the LED strings to reduce unnecessary power wastage. | 08-20-2009 |
20090230881 | LED DRIVER AND CIRCUIT FOR CONTROLLING A POWER SWITCH TO PROVIDE A DRIVING VOLTAGE TO AT LEAST ONE LED - An LED driver circuit and its control circuit for controlling its power switch are provided. The LED driver includes a switch, a PWM controller, a current source and a signal controller. The switch has a first end outputting a driving voltage to at least one LED. The PWM controller provides a PWM signal. The current source provides a driving current flowing through the LED when a dimming control signal is asserted. The signal controller turns off the switch when the dimming control signal is de-asserted and relays the PWM signal from the PWM controller to the switch so that the switch is controlled by the PWM signal when the dimming control signal is asserted. | 09-17-2009 |
Kuan-Hung Chen, Tainan County TW
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20100225822 | DIGITAL RECEIVER AND METHOD THEREOF - A digital receiver includes an analog front-end circuit, an automatic-gain controller, a compensation circuit, and a demodulator. The analog front-end circuit receives an input signal, adjusts an average amplitude of the input signal, and converts the adjusted input signal to generate a digital signal according to a control signal. The automatic-gain controller is coupled to the analog front-end circuit for generating the control signal feedback to the analog front-end circuit according to the digital signal. The compensation circuit is coupled to the analog front-end circuit for detecting an average amplitude of the digital signal to generate a detecting result and for determining whether to compensate the average amplitude of the digital signal to generate a compensated digital signal according to the detecting result. The demodulator is coupled to the compensation circuit for demodulating the compensated digital signal to generate an output signal. | 09-09-2010 |
Kuei-Hsiang Chen, Tainan County TW
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20080266469 | LIQUIID CRYSTAL ON SILICON (LCOS) DISPLAY AND PACKAGE THEREOF - The present invention provides a LCOS display. The display comprises a first PCB, an interface module, a first silicon chip, and a flat cable. The interface module is disposed on the first PCB and used to receive an audio and video signal. The first silicon chip comprises a display area, a processing area, and a metal layer. The display area comprises a pixel array in a LCOS panel formed on the first silicon chip. The processing area comprises a processing unit formed on the first silicon chip. The metal layer is formed on the first silicon chip for electrically connecting the display area with the processing area. The flat cable is used to electrically connect the interface module with the processing unit. | 10-30-2008 |
20110134046 | DISPLAY DEVICE - A display device including a remote control unit and a display panel unit is provided. The display panel unit includes a plurality of optical receivers and a track recognizer. The remote control unit emits a light beam. The optical receivers receive the light beam and convert the light beam into a plurality of sensing voltages. The track recognizer generates a control command according to the sensing voltages so that the display panel unit sets an on-screen display (OSD). | 06-09-2011 |
20110243473 | IMAGE ENHANCEMENT METHOD AND APPARATUSES UTILIZING THE SAME - An image enhancement apparatus is provided. The image enhancement apparatus includes a global tone mapping curve generator, a local tone mapping curve generator, a reference gamma voltage generator and an image generator. The global tone mapping curve generator generates a global tone mapping curve for an input image according to global characteristic(s) of the input image. The local tone mapping curve generator generates a local tone mapping curve for each image partition within the input image according to the global tone mapping curve and further a feature of the image partition. The reference gamma voltage generator generates a plurality of reference gamma voltages for each image partition according to the corresponding local tone mapping curve for the image partition. The image generator generates an output image according to the reference gamma voltages of the image partitions and the input image. | 10-06-2011 |
Kun Tai Chen, Tainan County TW
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20080291120 | HEAD-MOUNTED DISPLAY FOR ADJUSTING THE INTENSITY OF AMBIENT LIGHTS - A head-mounted display includes a body including an optical visualizing device. The optical visualizing device includes a displaying unit, a housing, a polarizing unit and a front cover. The displaying unit is adapted to display an image. The housing is adapted to accommodate the displaying unit and having a front surface. The polarizing unit is disposed in front of the displaying unit accommodated in the housing for adjusting the intensity of ambient lights that enter the displaying unit. The front cover is adapted to cover the front surface of the housing. The polarizing unit is controlled by the viewer to switch between see-through and non-see-through mode. | 11-27-2008 |
Lien-Hsiang Chen, Tainan County TW
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20110175897 | PIXEL STRUCTURE, DISPLAY PANEL, DISPLAY AND DRIVING METHOD THEREOF - A pixel structure, a display panel, a display and a driving method thereof are disclosed. The pixel structure comprises an organic light emitting diode, a driving transistor, a storage capacitance, and a switch transistor. A first terminal of the driving transistor receives an image retention cancellation signal. The image retention cancellation signal changes to a second level from a first level before the driving transistor drives the organic light emitting diode so that the driving transistor is operated in a forward curve. A second terminal of the driving transistor is coupled to the light emitting diode. One terminal of the storage capacitance receives a common voltage, and the other terminal of the storage capacitance is coupled to a control terminal of the driving transistor. The switch transistor is controlled by a scan signal to output a data signal to the control terminal of the driving transistor. | 07-21-2011 |
Li-Yi Chen, Tainan County TW
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20080284354 | LIGHT EMITTING DIODE BACKLIGHT MODULE AND A DRIVING METHOD THEREOF - A light emitting diode (LED) backlight module includes a light emitting matrix, M row signal lines, N column signal lines, a row driver and a column driver. The light emitting matrix has multiple LED units arranged in M rows and N columns. The row driver in use outputs M row-driving signals to sequentially enable M rows of the LED units via the M row signal lines. The column driver in use sequentially outputs 1 | 11-20-2008 |
Lung-Hsien Chen, Tainan County TW
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20080259606 | Light fixture for house number plates - A light fixture for house number plates has a control circuit to automatically detect light in response the light intensity of sunshine to control timing of activation of the light fixture to illuminate a house number plate. It has a lamp which can be driven by electric power converted through a solar energy panel to meet environmental protection requirement. An overload protection circuit is provided to increase the life span of the light fixture. The light fixture is coupled with the house number plate to provide effective illumination and environmental protection. | 10-23-2008 |
Mei-Ying Chen, Tainan County TW
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20100134722 | BACKLIGHT MODULE AND DISPLAY DEVICE USING THE SAME - A backlight module includes: a light guide plate including a light-entering surface; a light source module disposed beside the light-entering surface; and a reflector including an opening adjacent to the light-entering surface. The light source module is disposed in the reflector and emits light toward the light-entering surface through the opening. A height of the opening is less than a thickness of the light guide plate. | 06-03-2010 |
Meng Chun Chen, Tainan County TW
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20110115638 | METHOD FOR CONTROLLING CLEANING DEVICE - A method for controlling a cleaning device is presented, which includes the following steps. A cleaning device includes a control unit, a fan module, an optical emitter, and an optical sensor. The optical emitter and the optical sensor are located in an air inlet of the fan module. The control unit is preset with a first impedance value (Z1), a second impedance value (Z2), and a threshold, where 005-19-2011 | |
Ming-Yeong Chen, Tainan County TW
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20090074118 | Front-end for digital video receiver and method for automatic gain control thefeof - A method for automatic gain control of a front-end for a digital video receiver is provided. The method includes the following steps. First, a radio frequency signal is received and converted to an intermediate frequency signal. Then, the IF signal is amplified according to a gain. Next, the amplified IF signal is demodulated into a base-band signal, and the base-band signal is encoded into a transport stream. After that, a DC level of a pulse width modulation signal is controlled by at least one variable resistor to adjust the gain, the PWM signal being related to a setting of the gain. Afterwards, a BER measurement at each potential setting of the gain and the variable resistor under one or more power levels of the RF signal is read, and an optimum setting of the gain and the variable resistor is selected according to the BER measurements. | 03-19-2009 |
Pei Chun Chen, Tainan County TW
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20080303167 | DEVICE HAVING HIGH ASPECT-RATIO VIA STRUCTURE IN LOW-DIELECTRIC MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a device having a via structure includes the following steps. A seed metallic layer is formed on a substrate. A patterned metallic-trace layer is formed on the seed metallic layer. A positive-type photoresist layer is formed on the patterned metallic-trace layer and seed metallic layer. The photoresist layer is patterned for defining a through hole which exposes a part of the patterned metallic-trace layer, wherein the through hole has a high aspect ratio. A metallic material is electroplated in the through hole so as to form a metallic pillar. The photoresist layer is removed. A part of the seed metallic layer is etched, whereby traces of the patterned metallic-trace layer are electrically isolated from each other. A dielectric material layer is formed on the substrate for sealing the patterned metallic-trace layer and a part of the metallic pillar and exposing a top surface of the metallic pillar. | 12-11-2008 |
Peng-Chi Chen, Tainan County TW
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20090322441 | CHIP ON FILM TRACE ROUTING METHOD FOR ELECTRICAL MAGNETIC INTERFERENCE REDUCTION - A chip on film (COF) trace routing method for EMI reduction includes: providing a flexible circuit board; mounting a chip that has a first signal pad, a second signal pad and a ground pad on the flexible circuit board; and forming a first signal trace, a second signal trace, a first ground trace and a second ground trace on the flexible circuit board. The first signal trace and the second signal trace are electrically connected to the first signal pad and the second signal pad respectively. The first ground trace and the second ground trace are both electrically connected to the ground pad. The first signal trace and the second signal trace are disposed between the first ground trace and the second ground trace. The first ground trace and the second ground trace are immediately adjacent to the first signal trace and the second signal trace respectively. | 12-31-2009 |
Peng-Fang Chen, Tainan County TW
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20100238672 | LIGHT-EMITTING DIODE LIGHT BULB AND APPLICATION THEREOF - A light-emitting diode (LED) light bulb and an application thereof are described. The light-emitting diode light bulb comprises: a light-emitting diode light source module; a base, wherein the light-emitting diode light source module is disposed on the base; and a driver portion to drive the light-emitting diode light source module, comprising a rotation shaft, wherein the driver portion is connected to the base via the rotation shaft, such that the light-emitting diode light source module can rotate relative to the driver portion. | 09-23-2010 |
Pen-Hsin Chen, Tainan County TW
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20090058835 | METHOD FOR TRANSMITTING IMAGE DATA TO DRIVER OF DISPLAY - A method for transmitting image data to a driver of a display is provided, in which the image data include pixel values each represented by a number of bits. The method includes the steps of sequentially transmitting at least two bits of one of the pixel values during a first period through a data line; and sequentially transmitting at least two bits of another one of the pixel values during a second period next to the first period through the data line, in which an order of the last bit transmitted during the first period is the same as that of the first bit transmitted during the second period. | 03-05-2009 |
20110043493 | METHOD FOR DETERMINING AN OPTIMUM SKEW AND ADJUSTING A CLOCK PHASE OF A PIXEL CLOCK SIGNAL AND DATA DRIVER UTILIZING THE SAME - A data driver including a receiver, a skew adjusting circuit and a processing device is provided. The receiver samples image data on a data bus according to a processed pixel clock signal. The image data includes pixel data during active periods and a test pattern repeatedly inserted in the image data during blanking periods. The skew adjusting circuit receives a pixel clock signal and adjusts a clock phase of the pixel clock signal by delaying the pixel clock signal with a controllable skew according to a feedback control signal so as to generate the processed pixel clock signal. The processing device stores a predetermined test pattern synchronized with the inserted test pattern, determines an optimum skew by comparing the sampled test patterns with the predetermined test pattern, and generates the feedback control signal including information indicating the optimum skew. | 02-24-2011 |
Ping-Po Chen, Tainan County TW
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20080303773 | POWER CONTROL METHOD AND SYSTEM FOR POLARITY INVERSION IN LCD PANELS - A power control method for polarity inversion in an LCD panel comprises the step of providing a storage capacitor on a circuit board. Thereafter, the storage capacitor is charged to a first middle voltage. Next, the voltage of the VCOM channel is pulled up by a common output amplifier, only from the first middle voltage to a first upper voltage during a positive polarity period. Also, the voltage of the VCOM channel is pulled down by the common output amplifier, only from the first middle voltage to a first lower voltage during a negative polarity period. | 12-11-2008 |
20090134901 | INTEGRATED CIRCUIT DIE STRUCTURE SIMPLIFYING IC TESTING AND TESTING METHOD THEREOF - By adding multiplexing units to selectively transmit signals associated with a functional circuitry of an IC die to test pads, a probe card with less pin counts than the pad number of the IC die can be utilized for testing the functional circuitry. Therefore, the pad number/pad pitch of the IC die is not limited by the pitch of the conventional probe card. A high pin count IC die design is thereby available. | 05-28-2009 |
20090251403 | LIQUID CRYSTAL DISPLAY PANEL - A liquid crystal display panel. The liquid crystal display panel comprises a first display matrix, a second display matrix, a first gate electrode group, a second gate electrode group and a data electrodes group. The first display matrix comprises first display cells arranged in N rows and M columns; the second display matrix comprises second display cells arranged in N rows and M columns. The first gate electrode group comprises first gate electrodes respectively coupled to the first display matrix and the second gate electrode group comprises second gate electrodes respectively coupled to the second display matrix. The data electrodes group comprises data electrodes respectively coupled to the first display matrix and the second display matrix, wherein an m-th data electrode is coupled to an m-th column of the first display cells and an m-th column of the second display cells. | 10-08-2009 |
20110063279 | DISPLAY AND SOURCE DRIVER THEREOF - A pixel circuit has a light emitting diode, a first driving transistor, a second driving transistor, a capacitor, and a switch unit. When a scan signal is asserted, the switch unit couples sources/drains of the second driving transistor respectively to a first and a second source/drain of the first driving transistor, and couples a gate and second source/drain of the first driving transistor together. When the scan signal is de-asserted, the switch unit decouples one of the sources/drains of the second driving transistor from the first/second source/drain of the first driving transistor, and decouples the gate from the second source/drain of the first driving transistor. | 03-17-2011 |
Ping Yu Chen, Tainan County TW
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20090132737 | REMOTE INTERFACE APPARATUS, CONTROL SYSTEM, AND THE METHOD THEREOF - A remote interface apparatus comprises a network interface, a peripheral device interface, an interface-providing mechanism and a network address setting mechanism. The network interface is configured to communicate with a remote host. The peripheral device interface is configured to connect to a peripheral device. The interface-providing mechanism cooperates with the network interface to transfer the peripheral device interface into a remote peripheral device connection port of the host. The network address setting mechanism is configured to automatically obtain a network address upon a connection to the network, and to broadcast information of the peripheral device interface. | 05-21-2009 |
Pi-Tsung Chen, Tainan County TW
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20110081758 | Semiconductor device including I/O oxide nitrided core oxide on substrate, and method of manufacture - A semiconductor device includes a semiconductor substrate, wherein the semiconductor substrate includes a core area for core circuits and a peripheral area for peripheral circuits. The semiconductor device includes a core oxide on the semiconductor substrate in the core area, a portion of the core oxide being nitrided, a first polysilicon pattern on the core oxide, an I/O oxide including pure oxide on the semiconductor substrate in the peripheral area, and a second polysilicon pattern on the I/O oxide. | 04-07-2011 |
Po-Wen Chen, Tainan County TW
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20110276158 | AUDIO DATA TRANSMITTING APPARATUS FOR WEBCASTING AND AUDIO REGULATING METHODS THEREFOR - A webcasting system and the audio data regulating methods to be used in the webcasting system are presented. The webcasting system includes a host and an audio playing apparatus. The host, which is loaded with an operating system and drivers, determines the audio data output according to an expected data received by the operating system. The drivers provide the expected data according to the audio data received and transform the audio data for network transmission. The audio playing apparatus receives the network data and processes the network data for audio playing. | 11-10-2011 |
Shih-Wen Chen, Tainan County TW
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20110160319 | ORGANIC/INORGANIC HYBRID COMPOSITE PROTON EXCHANGE MEMBRANE - An organic/inorganic hybrid composite proton exchange membrane is provided. The proton exchange membrane includes an inorganic material of about 0.5-30 parts by weight and an organic material of about 99.5-70 parts by weight per 100 parts by weight of the proton exchange membrane. A surface area of the inorganic material is about 50-3000 m | 06-30-2011 |
Shiming Chen, Tainan County TW
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20100127294 | SIDE VIEW TYPE LIGHT-EMITTING DIODE PACKAGE STRUCTURE, AND MANUFACTURING METHOD AND APPLICATION THEREOF - A side view type light-emitting diode package structure, and a manufacturing method and an application thereof are described. The side view type light-emitting diode package structure includes a silicon base, a first and a second conductive leads and at least one light-emitting diode chip. The silicon base includes a first cavity defining a light-extracting surface of the package structure. The first and the second conductive leads are respectively disposed at least on a portion and another portion of the first cavity and extend to an outer surface of the silicon base. The first and the second conductive leads are electrically isolated from each other. The light-emitting diode chip includes a first and second electrodes electrically connected to the first and the second conductive leads respectively, wherein the surface on the outer side of the silicon base is substantially perpendicular to the light-extracting surface. | 05-27-2010 |
Shi-Ming Chen, Tainan County TW
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20090159899 | LIGHT- EMITTING DEVICE - A light-emitting device includes a substrate having an epitaxial-forming surface and a back surface opposite to the epitaxial-forming surface, the substrate being formed with a recess indented from the back surface, the back surface having a recessed portion that defines the recess, and a planar portion extending outwardly from the recessed portion; an epitaxy layer; a continuous heat-dissipating layer formed on the planar portion and the recessed portion of the back surface of the substrate; and first and second electrodes coupled electrically to the epitaxy layer. | 06-25-2009 |
20100207142 | LIGHT-EMITTING DIODE LIGHT SOURCE MODULE - A light-emitting diode (LED) light source module is described, comprising: a heat conduction substrate, wherein a surface of the heat conduction substrate includes a plurality of recesses; a plurality of light-emitting diode chips respectively disposed in the recesses; an insulation layer disposed on the surface of the heat conduction substrate outside of the recesses; an electric conduction layer disposed on the insulation layer, wherein the light-emitting diode chips are electrically connected to the electric conduction layer; and an encapsulation layer covering the light-emitting diode chips, the electric conduction layer and the insulation layer. | 08-19-2010 |
Shin-Chi Chen, Tainan County TW
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20090294927 | SEMICONDUCTOR-DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREBY - A manufacturing method for a semiconductor-device isolation structure comprises providing a substrate with at least one shallow trench isolation structure, performing a salicide process that forms a recess on the surface of the shallow trench isolation structure, forming a cap film covering the substrate and filling the recess, performing an etching process to remove the cap film outside the recess, and forming a contact etch stop layer covering the substrate and filling the recess. Due to the filling recess with the cap film first, the contact etch stop layer covering the substrate and filling the recess does not have seams or voids. | 12-03-2009 |
20100213554 | GATE STRUCTURE AND METHOD FOR TRIMMING SPACERS - A gate structure includes a gate disposed on a substrate, a first spacer disposed on the substrate and surrounding the gate and a second spacer disposed on the first spacer and surrounding the gate, the second spacer is lower than the first spacer. | 08-26-2010 |
20110294075 | PATTERNING METHOD - A patterning method of the present invention is described as follows. A mask layer and a patterned photoresist layer are formed on a target layer in sequence, wherein an etching rate of the mask layer is different from an etching rate of the target layer. A plurality of spacers is formed on sidewalls of the patterned photoresist layer respectively, wherein an etching rate of the spacers is different from the etching rate of the mask layer. The patterned photoresist layer is removed to form an opening between any two adjacent spacers. A portion of the mask layer is removed by using the spacers as a mask so as to form a patterned mask layer. A portion of the target layer is removed by using the patterned mask layer as a mask. | 12-01-2011 |
20120070952 | REMOVING METHOD OF A HARD MASK - A removing method of a hard mask includes the following steps. A substrate is provided. At least two MOSFETs are formed on the substrate. An isolating structure is formed in the substrate and located between the at least two MOSFETs. Each of the MOSEFTs includes a gate insulating layer, a gate, a spacer and a hard mask on the gate. A protecting structure is formed on the isolating structure and the hard mask is exposed from the protecting structure. The exposed hard mask is removed to expose the gate. | 03-22-2012 |
20120129337 | DUAL DAMASCENE PROCESS - A dual damascene process is disclosed. The process includes the steps of: forming a dielectric layer on a substrate; forming a first patterned mask on the dielectric layer, wherein the first patterned mask comprises an opening; forming a material layer on the dielectric layer and covering the first patterned mask; forming a second patterned mask on the dielectric layer, wherein the second patterned mask comprises a first aperture; forming a second aperture in the second patterned mask, wherein the second aperture and the first aperture comprise a gap therebetween; and utilizing the second patterned mask as etching mask for partially removing the material layer and the dielectric layer through the first aperture and the second aperture. | 05-24-2012 |
20120132996 | STRAINED SILICON STRUCTURE - A strained silicon substrate structure includes a first transistor and a second transistor disposed on a substrate. The first transistor includes a first gate structure and two first source/drain regions disposed at two sides of the first gate structure. A first source/drain to gate distance is between each first source/drain region and the first gate structure. The second transistor includes a second gate structure and two source/drain doped regions disposed at two side of the second gate structure. A second source/drain to gate distance is between each second source/drain region and the second gate structure. The first source/drain to gate distance is smaller than the second source/drain to gate distance. | 05-31-2012 |
Shin-Huei Chen, Tainan County TW
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20100123900 | Plasmon resonance sensing apparatus and sensing system thereof - A plasmon resonance sensing system includes a light source, a waveguide component and a photon detector. The light source provides an incident light. The waveguide component has a tubular internal wall and a noble metal nanoparticle layer disposed on the tubular internal wall and contacted with a desired testing matter. The waveguide component is made of a light transmitting material for guiding the incident light to have an interaction with the noble metal nanoparticle layer. The photon detector detects an emergent light exiting the waveguide component after the interaction of the noble metal nanoparticle layer with the desired testing matter. The system further includes a first optical fiber installed between the light source and the waveguide component for transmitting the incident light to the waveguide component, a lens and a second optical fiber. The lens collects and transmits the emergent light to the photon detector through the second optical fiber. | 05-20-2010 |
Szu-Wen Chen, Tainan County TW
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20100173157 | NANOCOMPOSITE MATERIAL APPARATUS, NANOCOMPOSITE MATERIAL AND METHOD FOR FABRICATING THEREOF, NANO MATERIAL APPARATUS AND NANO MATERIAL - A nanocomposite material apparatus suitable for fabricating a nanocomposite material from different materials is provided. The nanocomposite material apparatus includes an acceleration inner tube and a collection outer tube. The acceleration inner tube disposed along a rotation axis has a top surface, a bottom surface and an outer peripheral surface. Pipes for accelerating different materials is distributed within the acceleration inner tube. Each pipe includes an inlet, an outlet opening at the outer peripheral surface and a spiral trench connecting the inlet and the outlet. Nano materials having electricity are emitted from the corresponding outlets by accelerating different materials within the corresponding pipes. The collection outer tube disposed surroundingly on the acceleration inner tube is suitable for moving oppositely thereto, so that the nano-materials emitted from the outer peripheral surface are combined with one another and form a nanocomposite material on the inner wall of the collection outer tube. | 07-08-2010 |
Tian-Hau Chen, Tainan County TW
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20090066707 | SOURCE DRIVER FOR IMAGE SCROLLING - A source driver comprising a frame memory, a first line buffer, and a second line buffer. The frame memory stores bits of pixel values of an image. The first line buffer then sequentially latches the bits of the pixel values from the frame memory with a first address index. The second line buffer then sequentially latch the bits of the pixel values from the first line buffer with a second address index, which is different from the first address index, and writes the bits of the pixel values back to the frame memory, such that the image is scrolled. The present invention also provides a method of refreshing the frame memory in a source driver. | 03-12-2009 |
Tsung Lung Chen, Tainan County TW
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20100207268 | SEMICONDUCTOR PACKAGING SUBSTRATE IMPROVING CAPABILITY OF ELECTROSTATIC DISSIPATION - A semiconductor packaging substrate with improved capability of electrostatic dissipation comprises a dielectric layer, a plurality of leads, a plurality of first electrostatic guiding traces, a plurality of second electrostatic guiding traces and a solder mask. The first electrostatic guiding traces and the second electrostatic guiding traces are formed in pairs in a plurality of electrostatic dissipation regions on the dielectric layer, where each pair of the first and second electrostatic guiding traces are disposed in equal line spacing and are electrically isolated from each other. The solder mask partially covers the leads but exposes the first electrostatic guiding traces and the second electrostatic guiding traces. The first electrostatic guiding traces are connected to some of the leads to enhance protection against electrostatic discharge. | 08-19-2010 |
Tsung-Wen Chen, Tainan County TW
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20090032900 | METHOD OF PROTECTING SHALLOW TRENCH ISOLATION STRUCTURE AND COMPOSITE STRUCTURE RESULTING FROM THE SAME - A method of protecting a shallow trench isolation structure is described, which is applied to a semiconductor device process that includes a first process causing a recess in the STI structure and a second process after the first process. The method includes forming a silicon nitride layer in the recess along the profile of the same during the second process. | 02-05-2009 |
Tung-Yang Chen, Tainan County TW
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20090059511 | DOCK STATION AND MINI-PROJECTOR BEING MUTUALLY INTEGRATED - A dock station and a mini-projector being mutually integrated is provided. The dock station includes a dock station body, a projector interface and a power management unit. The dock station body is employed for connecting at least an electronic apparatus. The projector interface is employed for connecting the mini-projector and the dock station body. The power management unit is disposed in the dock station body. The dock station uses the mini-projector to play AV data in the electronic apparatus. | 03-05-2009 |
20090086392 | POWER-RAIL ESD PROTECTION CIRCUIT WITHOUT LOCK-ON FAILURE - An ESD protection circuit including a discharge device, a first detection circuit, and a second detection circuit. The discharge device provides a discharge path between a first power rail and a second power rail when the discharge device is activated. The discharge device stops providing the discharge path when the discharge device is de-activated. The first detection circuit is coupled between the first and the second power rails. The first detection circuit activates the discharge device when an ESD event occurs in the first power rail. The second detection circuit de-activates the discharge device when the ESD event does not occur in the first power rail. | 04-02-2009 |
20090187361 | TRANSIENT DETECTION CIRCUIT FOR ESD PROTECTION - A transient detection circuit including a detecting unit, a setting unit, and a memory unit. The transient detection circuit provides an information signal to an external instrument when an electrostatic discharge (ESD) event occurs. The detecting unit is coupled between a first power line and a second power line for detecting the ESD event. The setting unit sets a level of a first node according to the detection result. The memory unit controls the information signal according to the level of the first node. The information signal is at a first level when the ESD event occurs in the first power line. | 07-23-2009 |
20090231765 | TRANSIENT TO DIGITAL CONVERTERS - A digital converter including a first adjustment unit and a first transient detection unit. The first adjustment unit adjusts amplitude of an electrostatic discharge (ESD) pulse to generate a first adjustment signal when an ESD event occurs in a first power line and a second power line is at a complementary level. The first transient detection unit generates a first digital code according to the first adjustment signal. | 09-17-2009 |
20090267584 | TRANSIENT DETECTION CIRCUIT - A transient detection circuit coupled between a first power line and a second power line and including a first control unit, a setting unit, and a voltage regulation unit. The first control unit generates a first control signal. The first control signal is at a first level when an electrostatic discharge (ESD) event occurs. The first control signal is at a second level when the ESD event does not occur. The setting unit sets a first node. The first node is set at the second level when the first control signal is at the first level. The voltage regulation unit regulates the first node. The voltage regulation unit regulates the level of the first node at the second level when the first control signal is at the second level. | 10-29-2009 |
20100235798 | METHOD FOR PREDICTING AND DEBUGGING EMI CHARACTERISTICS IN IC SYSTEM AND RELATED MACHINE-READABLE MEDIUM - A method for predicting and debugging electromagnetic interference (EMI) characteristics of an integrated circuit (IC) system includes the following steps: selecting a frequency domain range according to transformed raw data of the IC system to generate a blocking frequency analysis result, wherein the transformed raw data are transformed by a time-frequency waveform transformation; setting criteria data; comparing the blocking frequency analysis result with the criteria data to generate at least one comparison result; and generating a pass analysis report when a processing unit determines that each comparison result is passed; otherwise, executing an EMI design time-frequency analysis. | 09-16-2010 |
20110128086 | CIRCUIT BOARD WITH DECREASED CROSSTALK - A circuit board includes a signal line plane and a reference plane. The signal line plane has at least a first transmission line and a second transmission line formed thereon. The reference plane has a conductive region and at least a non-conductive region. The first transmission line and the second transmission line overlap the conductive region in a thickness direction of the circuit board. The non-conductive region includes at least a first part and a second part connected to the first part, where the second part is positioned between the projection of the first transmission line on the reference plane and the projection of the second transmission line on the reference plane, and has no intersection with at least one of the projection of the first transmission line and the projection of the second transmission line. | 06-02-2011 |
20110156211 | SEMICONDUCTOR STRUCTURE FOR REALIZING ESD PROTECTION CIRCUIT - The semiconductor structure of the present invention comprises: a P-well, a first N+ diffusion region, a first P+ diffusion region, a second P+ diffusion region, a first N-well, and a second N+ diffusion region. The semiconductor structure of the present invention comprises: a N-well, a first P+ diffusion region, a first N+ diffusion region, a second N+ diffusion region, a first P-well, and a second P+ diffusion region. Compared with the conventional semiconductor structure for realizing an ESD protection circuit, the semiconductor structure of the present invention requires a smaller area by utilizing the parasitic BJT to have the same ESD protection function. Brief summarized, the semiconductor structure disclosed by the present invention can be utilized for realizing an ESD protection circuit in a smaller area to reduce cost. | 06-30-2011 |
20110185336 | IMPEDANCE DESIGN METHOD - The invention discloses an impedance design method for a power network of a core chip within a chipset having N input/output (I/O) ports coupled to a voltage source which have an observation I/O port. The method includes calculating a first set of impedances at a predetermined frequency or the observation I/O port, if the voltage source is internally coupled to the N I/O ports within the chipset, and calculating a second set of impedances at the predetermined frequency for the observation I/O port, if the voltage source is externally coupled to the N I/O ports through a carrier coupling the core chip to the voltage source. The first set of impedances to the second set of impedances are compared, and the impedance of the power network or the impedance of the carrier is adjusted according to the comparison result. | 07-28-2011 |
20110213604 | SIGNAL ANALYZING METHOD FOR ELECTRONIC DEVICE HAVING ON-CHIP NETWORK AND OFF-CHIP NETWORK - The present invention provides a signal analyzing method for an electronic device having an on-chip network and an off-chip network. Compared with the conventional signal analyzing method for an electronic device having an on-chip network and an off-chip network, the signal analyzing method of the present invention is able to provide a complete electrical connection and accurate electrical characteristics for an electronic device having an on-chip network and an off-chip network. | 09-01-2011 |
20120176150 | MEASURING EQUIPMENT FOR PROBE-EFFECT CANCELLATION AND METHOD THEREOF - A measuring equipment, such as a vector network analyzer, is provided. The measuring equipment includes a first port and a second port, a probe connected to the first port, an antenna connected to the second port, and a test board corresponding to a type of a device-under-test. A probe-effect is obtained by measuring the test board via the probe and the antenna. | 07-12-2012 |
Wei-Chih Chen, Tainan County TW
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20080251931 | MULTI CAP LAYER AND MANUFACTURING METHOD THEREOF - A method for manufacturing a multi cap layer includes providing a substrate, forming a multi cap layer comprising a first cap layer and a second cap layer formed thereon on the substrate, forming a patterned metal hard mask layer on the multi cap layer, and performing an etching process to etch the multi cap layer through the patterned hard mask layer and to form an opening in the second cap layer. | 10-16-2008 |
20090283310 | MULTI CAP LAYER AND MANUFACTURING METHOD THEREOF - A method of manufacturing a cap layer includes providing a substrate having at least a conductive layer, a base layer and a dielectric layer; forming a tensile stress cap layer on the substrate; forming a patterned hard mask layer o the tensile stress cap layer; and performing an etching process to each the tensile stress cap layer through the patterned metal hard mask layer to form at least an opening in the tensile stress cap layer. | 11-19-2009 |
20100260992 | MULTI CAP LAYER - A multi-layer structure for forming damascene interconnects includes a substrate having at least a conductive layer and a base layer a dielectric layer formed on the substrate and covering the conductive layer and the base layer, a protecting layer covering the dielectric layer and a tensile stress layer covering the protecting layer. | 10-14-2010 |
Wei-Hsiao Chen, Tainan County TW
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20080291374 | STRUCTURE OF A DISPLAY PANEL - Residual direct-current charges may be accumulated and distributed non-uniformly on the built-in color filters in a displaying panel such as the liquid-crystal-on-silicon displaying device, and thus results in the non-uniformity of the internal electric field that controls the arrangement of liquid crystal molecules. To reduce residual direct-current charges so as to cause the internal electric field to be substantially uniform, the present invention provides a structure of the display panel including a plurality of shields for respectively enclosing a plurality of color filters, wherein each shield is connected to a corresponding pixel electrode by a conductive wire. | 11-27-2008 |
20100066767 | LCOS INTEGRATED CIRCUIT AND ELECTRONIC DEVICE USING THE SAME - A liquid crystal on silicon integrated circuit (LCOS IC) and electronic device using the same is provided. The electronic device comprises an LCOS IC, a processor and a cooler. The LCOS IC comprising a temperature sensor embedded in the LCOS IC for sensing a temperature and outputting a temperature sensing signal according to the temperature. The processor is coupled to the LCOS IC for receiving the temperature sensing signal and outputting a cooler control signal according to the temperature sensing signal. The cooler is coupled to the processor for receiving the cooler control signal and adjusting the cooler accordingly. | 03-18-2010 |
20110097654 | COLOR FILTER AND MANUFACTURING METHOD THEREOF - A color filter including a substrate, a plurality of first single-layer filter units and a plurality of first multilayer filter units is provided. The substrate has a plurality of first regions and a plurality of second regions. The first single-layer filter units is disposed on the substrate and located in the first regions respectively. The first multilayer filter units is disposed on the substrate and located in the second regions respectively. A manufacturing method for a color filter is also provided. | 04-28-2011 |
Weisen Chen, Tainan County TW
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20090033827 | OPTICAL FILM SUPPORT ARRANGEMENT, AND BACKLIGHT MODULE AND LCD USING THE SAME - A backlight module includes a rear plate, at least one light source disposed on the rear plate, at least two support elements respectively disposed on two opposite sides of the rear plate, and at least one optical film disposed above the light source. The optical film includes at least two fixing holes respectively corresponding to the support elements. The support elements respectively engage with the fixing holes to tension the optical film with at least one pair of tensile forces oriented in opposite directions. | 02-05-2009 |
20100226119 | BACK LIGHT MODULE AND FLAT DISPLAY DEVICE USING THE SAME - A back light module and a flat display device using the same are provided. The back light module includes a reflector, at least two light sources and at least one partition. The light sources are disposed above the reflector. The partition is disposed at a substantially central location between the two light sources and is substantially perpendicular to a line connecting the two light sources. The partition is a plate having a uniform thickness, and surfaces of the partition that face the two light sources are reflective. | 09-09-2010 |
Wen-Cheng Chen, Tainan County TW
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20100313791 | CALCIUM PHOSPHATE BONE CEMENT, PRECURSOR THEREOF AND FABRICATION METHOD THEREOF - The invention provides a calcium phosphate bone cement, a precursor and a fabrication method thereof. The fabrication method comprises: (a) dissolving a calcium phosphate with a low Ca/P atomic ratio in an acid solution, wherein the Ca/P atomic ratio is less than 1.33; (b) adding a calcium phosphate compound into the acid solution to obtain a reaction solution; (c) allowing the reaction solution to stand to grow nanocrystallites on surfaces of the calcium phosphate with low Ca/P atomic ratio; (d) filtering and drying the solution of step (c) to obtain a calcium phosphate powder with low Ca/P atomic ratio having nanocrystallites on the surface; and (e) mixing the powder of step (d) and a calcium phosphate powder with a high Ca/P atomic ratio. | 12-16-2010 |
20110318835 | Implant Surface Treatment Method Having Tissues Integrated - The present disclosure uses different kinds of surface treatment processes on titanium-made dental implants. The growth and attachment conditions of bone cells (MC3T3-E), fibroblasts(NIH 3T3) and epidermal cells (XB-2) on the metal surface of titanium slices with different surface treatments are observed. Tetra-calcium phosphate is used to perform secondary sand-blasting process to clean up the metal surface and provide calcium ions for osteoblastoma physiology. Thus, by adjusting the cells adhesive and proliferative abilities, the success rate of the clinical applications in dental implant is improved. | 12-29-2011 |
Ya-Chi Chen, Tainan County TW
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20090321918 | CHIP PACKAGE - A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved. | 12-31-2009 |
Yan Jou Chen, Tainan County TW
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20100073065 | INTEGRATED GATE DRIVER CIRCUIT AND DRIVING METHOD THEREFORE - An integrated gate driver circuit receives a plurality of clocks and includes a plurality of driving units cascaded in series. Each driving unit is for driving a load and includes an input terminal, an output terminal, a first switch and a second switch. The first switch has a first terminal coupled to the input terminal, a second terminal coupled to a first node, and a control terminal receiving a first clock, and the first switch is turned on when the first clock is at high level. The second switch has a first terminal receiving a second clock, a second terminal coupled to the output terminal, and a control terminal coupled to the first node, wherein the second clock charges and discharges the load through the second switch when the first node is at high level; wherein the output terminal of each driving unit is coupled to the input terminal of the immediately succeeding driving unit. | 03-25-2010 |
20100259530 | GATE DRIVE CIRCUIT AND DRIVING METHOD THEREOF - A gate driving circuit receives a plurality of clock signals in a sequence and includes a plurality of cascaded drive units sequentially outputting an output signal, wherein a first-stage drive unit of the gate driving circuit receives a scan start signal or a scan end signal while a last-stage drive unit thereof receives a scan end signal or a scan start signal; wherein a driving direction of the gate driving circuit is reversed by reversing the sequence of the clock signals and exchanging the scan start signal and the scan end signal. The present invention further provides a driving method of a gate driving circuit. | 10-14-2010 |
20100289535 | INTEGRATED GATE DRIVER CIRCUIT - An integrated gate driver circuit includes an output drive circuit and a voltage stabilizing circuit. The voltage stabilizing circuit is configured to stabilize an output voltage outputted by the output drive circuit thereby reducing the ripple of the output voltage. | 11-18-2010 |
20120256899 | GATE DRIVING CIRCUIT AND DRIVING METHOD THEREOF - A gate driving circuit receives a plurality of clock signals in a sequence and includes a plurality of cascaded drive units sequentially outputting an output signal, wherein a first-stage drive unit of the gate driving circuit receives a scan start signal or a scan end signal while a last-stage drive unit thereof receives a scan end signal or a scan start signal; wherein a driving direction of the gate driving circuit is reversed by reversing the sequence of the clock signals and exchanging the scan start signal and the scan end signal. The present invention further provides a driving method of a gate driving circuit. | 10-11-2012 |
Yao-Chien Chen, Tainan County TW
Yen-Chun Chen, Tainan County TW
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20090053260 | ALGAE ESSENCE NUCLEIC ACID FLUID CONCENTRATION PREPARATION METHOD - The present invention discloses an alga essence nucleic acid fluid concentration method, to apply the leaching function principle with the operation of freezes defreeze to achieve the goal of extract nucleic acid from the concentrated | 02-26-2009 |
Yi Cheng Chen, Tainan County TW
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20100164929 | SOURCE DRIVER - The invention discloses a source driver. The source driver comprises a plurality of channels and a control module. Each of the plurality of channels comprises an output buffer, an output pad, a driving switch, and a charge sharing switch. The control module is used to control a gate signal of the driving switch or the charge sharing switch in each channel to be changed linearly. By doing so, a peak current generated by the source driver can be lowered to reduce the electromagnetic interference (EMI). | 07-01-2010 |
Ying-Chih Chen, Tainan County TW
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20090057900 | Stacked Chip Package With Redistribution Lines - A chip package comprises a first chip having a first side and a second side, wherein said first chip comprises a first pad, a first trace, a second pad and a first passivation layer at said first side thereof, an opening in said first passivation layer exposing said first pad, said first trace being over said first passivation layer, said first trace connecting said first pad to said second pad; a second chip having a first side and a second side, wherein said second chip comprises a first pad at said first side thereof, wherein said second side of said second chip is joined with said second side of side first chip; a substrate joined with said first side of said first chip or with said first side of said second chip; a first wirebonding wire connecting said second pad of said first chip and said substrate; and a second wirebonding wire connecting said first pad of said second chip and said substrate. | 03-05-2009 |
20090111261 | Over-passivation process of forming polymer layer over IC chip - A method for forming a semiconductor chip or wafer includes following steps. A semiconductor substrate is provided, and then a polymer layer is deposited over the semiconductor substrate, wherein the polymer layer comprises polyimide. The polymer layer with a temperature profile having a peak temperature between 200 and 320 degrees Celsius. Alternatively, the temperature profile may comprises a period of time with a temperature higher than 320 degree Celsius, wherein the period of time is shorter than 45 minutes. | 04-30-2009 |
20110241183 | STACKED CHIP PACKAGE WITH REDISTRIBUTION LINES - A chip package comprises a first chip having a first side and a second side, wherein said first chip comprises a first pad, a first trace, a second pad and a first passivation layer at said first side thereof, an opening in said first passivation layer exposing said first pad, said first trace being over said first passivation layer, said first trace connecting said first pad to said second pad; a second chip having a first side and a second side, wherein said second chip comprises a first pad at said first side thereof, wherein said second side of said second chip is joined with said second side of side first chip; a substrate joined with said first side of said first chip or with said first side of said second chip; a first wirebonding wire connecting said second pad of said first chip and said substrate; and a second wirebonding wire connecting said first pad of said second chip and said substrate. | 10-06-2011 |
Ying-Hsiu Chen, Tainan County TW
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20080290175 | Layer-built body having hidden barcode and figures thereof - A layer-built body having hidden barcodes and figures thereof is disclosed in the invention, so as to allow barcode scanning devices to read the barcodes, the layer-built body comprising: a lenticular lens sheet divided into a first surface and a second surface, and the first surface has a plurality of convex lens-shaped optical structures disposed thereon; a patterned layer printed with trademarks or figures, and divided into a plurality of striped images; and at least a barcode layer printed with information about barcodes and divided into a plurality of striped images. The striped images of the barcode layer are alternated with the striped images of the patterned layer to make a synthesized image layer, and are combined with the second surface of the lenticular lens sheet; wherein when a viewer looks at the layer-built body from an ordinary angle, the optical structures of the lenticular lens sheet allows the viewer to see contents of the patterned layer completely, and when the layer-built body is tilted at specific angles, the optical structures of the lenticular lens sheet allows barcode scanning devices to read contents of the barcode layer. Therefore, information about barcodes and figures may be provided on a fixed surface area simultaneously. | 11-27-2008 |
Yu Chi Chen, Tainan County TW
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20100200969 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion. | 08-12-2010 |
Yu-Mou Chen, Tainan County TW
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20110049521 | ACTIVE DEVICE ARRAY MOTHER SUBSTRATE AND METHOD OF FABRICATING DISPLAY PANEL - An active device array mother substrate including a substrate, pixel arrays, and a polymer-stabilized alignment curing circuit is provided. The substrate has panel regions, a circuit region, a first cutting line, and a second cutting line. The first cutting line is disposed on the circuit region between an edge of the substrate and the second cutting line. The active devices of the pixel arrays have a semiconductor layer. The polymer-stabilized alignment curing circuit disposed on the circuit region includes curing pads disposed between the edge of the substrate and the first cutting line and curing lines having an upper conductive layer connected to the corresponding curing pads and the corresponding pixel array. The upper conductive layer is in the same layer as the source/drain conductor. Therefore, the curing lines are capable of preventing problems such as peeling, so as to keep the polymer-stabilized alignment curing circuit operating normally. | 03-03-2011 |
20110199562 | TRANSFLECTIVE PIXEL STRUCTURE - A transflective pixel structure including a reflective region and a transmittance region is provided. The pixel structure includes an active device, a covering layer, a reflective electrode layer, a reflective electrode pattern and a transparent electrode layer. The covering layer is disposed in the reflective region and the transmittance region and covers the active device, where the covering layer has a contact opening at least disposed in the transmittance region. The reflective electrode layer is disposed in the reflective region. The reflective electrode pattern is disposed within the contact opening and extends onto a top surface of the covering layer surrounding the contact opening. The transparent electrode layer is disposed on a surface of the covering layer in the transmittance region. The transparent electrode layer is electrically connected to the reflective electrode layer and the transparent electrode layer is electrically connected to the active device through the contact opening. | 08-18-2011 |
Yung Fa Chen, Tainan County TW
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20080255347 | Process for making galantamine - A novel process for the preparation of N-methyl-N-(2-[4-hydroxyphenyl]ethyl)-5-hydroxy-4-methoxy benzene carboxamide, which is useful as an intermediate in the synthesis of (−)-galantamine, comprises the reaction of a 5-hydroxy-4-methoxy benzoic acid derivative with N-methyl-N-(2-[4-hydroxyphenyl]ethyl)amine. | 10-16-2008 |
20090259058 | Process for the Preparation of Prostaglandin Analogues and Intermediates Thereof - The present application provides intermediates for preparing prostaglandin analogues and processes for preparing prostaglandin analogues and intermediates thereof. The intermediates include: A compound of formula (6): | 10-15-2009 |
20100036112 | Process for Making 5-Azacytosine Nucleosides and Their Derivatives - A process of synthesizing a 5-azacytosine nucleoside, such as azacitidine and decitabine, comprises coupling a silylated 5-azacytosine with a protected D-ribofuranose of formula in the presence of a sulfonic acid catalyst. | 02-11-2010 |
20100056771 | Process of Making 2-Deoxy-2,2-Difluoro-D-Ribofuranosyl Nucleosides and Intermediates Therefor - A compound of formula (A) or salt thereof: | 03-04-2010 |
20110130577 | Process for the Preparation of Prostaglandin Analogues and Intermediates Thereof - The present application provides intermediates for preparing prostaglandin analogues and processes for preparing prostaglandin analogues and intermediates thereof. The intermediates include: A compound of formula (6): | 06-02-2011 |
Yu-Ren Chen, Tainan County TW
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20090189296 | FLIP CHIP QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE STRUCTURE - A manufacturing method for a Flip Chip Quad Flat Non-leaded package structure is provided. A lead frame having a plurality of leads is provided at first in the manufacturing method. A dielectric layer is formed on the lead frame and exposes a top surface and a bottom surface of the leads. A redistribution layer including a plurality of pads and a plurality of conductive lines connected the pads and the top surface of the leads is formed on the dielectric layer. A solder resist layer is formed to cover the redistribution layer, the dielectric layer and the leads, and expose the surface of the pads. An adhesive layer is formed on the solder resist layer. A chip having a plurality of bumps is provided. The chip is adhered on the solder resist layer with the adhesive layer and each bump is electrically connected with one of the pads. | 07-30-2009 |
20090321918 | CHIP PACKAGE - A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved. | 12-31-2009 |