Patent application number | Description | Published |
20100291545 | ANTIBODY HAVING INHIBITORY ACTIVITY ON INFECTION WITH HEPATITIS C VIRUS (HCV) AND USE THEREOF - The objection of the invention is to provide an antibody that inhibits infection with hepatitis C virus (HCV). To this end, this invention provides an antibody that recognizes the hepatitis C virus (HCV) particle obtained from the hepatitis C virus (HCV) genome comprising the following (i) and (ii) ligated to each other as an antigen and has an inhibitory activity on infection with hepatitis C virus (HCV): (i) (a) the 5′-untranslated region, the core protein-encoding sequence, the E1 protein-encoding sequence, the E2 protein-encoding sequence, and the p7 protein-encoding sequence of the JFH-1 strain of the hepatitis C virus (HCV) or (b) the 5′-untranslated region, the core protein-encoding sequence, the E1 protein-encoding sequence, the E2 protein-encoding sequence, and the p7 protein-encoding sequence of the J6CF strain the hepatitis C virus (HCV); and (ii) the NS2 protein-encoding sequence, the NS3 protein-encoding sequence, the NS4A protein-encoding sequence, the NS4B protein-encoding sequence, the NS5A protein-encoding sequence, the NS5B protein-encoding sequence, and the 3′-untranslated region of the JFH-1 strain. | 11-18-2010 |
20110045020 | NUCLEIC ACID COMPRISING CHIMERIC GENE DERIVED FROM HEPATITIS C VIRUS - This invention provides infectious chimeric HCV particles that can be used for vaccines. This invention further provides a nucleic acid comprising a chimeric gene derived from the hepatitis C virus comprising regions each encoding Core protein, E1 protein, E2 protein and p7 protein derived from a hepatitis C virus strain other than JFH-1 strain; NS2 protein derived from JFH-1 strain or a hepatitis C virus strain other than JFH-1 strain, or a chimeric NS2 protein of NS2 protein derived from JFH-1 strain and NS2 protein derived from a hepatitis C virus strain other than JFH-1 strain; and NS3 protein, NS4A protein, NS4B protein, NS5A protein, and NS5B protein derived from JFH-1 strain in that order in 5′ to 3′ direction, wherein the 328th proline residue from the amino acid residue at N-terminus of the Core protein is substituted with an amino acid residue other than proline. This invention further provides chimeric HCV particles comprising such nucleic acid, and use of such HCV particles for vaccines. | 02-24-2011 |
20120220758 | ANTIBODY HAVING ACTIVITY OF INHIBITING HEPATITIS C VIRUS (HCV) INFECTION AND USE THEREOF - An object of the present invention is to provide an antibody inhibiting infection with hepatitis C virus (HCV). The present invention provides an anti-hepatitis C virus antibody that recognizes a whole or a part of the conformation of a hepatitis C virus particle as an epitope and binds thereto, so as to be able to inhibit the binding of hepatitis C virus to the surface of a host cell and to inhibit HCV infection, a humanized antibody thereof, and an inhibitory agent for infection with hepatitis C virus. | 08-30-2012 |
20120251572 | HEPATITIS C VIRUS VACCINE COMPOSITION - A combination of an HCV antigen for inducing an antibody having the activity of inhibiting HCV infection and an optimum adjuvant is discovered, so as to provide an effective HCV vaccine composition. The hepatitis C virus vaccine composition comprises: inactivated viral particles obtained by inactivating infectious hepatitis C virus particles prepared from hepatitis C virus genome that contains sequences encoding NS3 protein, NS4A protein, NS4B protein, NS5A protein and NS5B protein derived from hepatitis C virus JFH1 strain;
| 10-04-2012 |
Patent application number | Description | Published |
20090127009 | HANDLE STRUCTURE OF WALK-BEHIND WORKING MACHINE - A handle structure of a walk-behind working machine includes: a handle having left and right raised portions extending upward from a handle frame and a cross portion interconnecting the left and right raised portions; and a main clutch lever shiftable from a clutch-OFF position to a clutch-ON position by being pivoted into pressed abutment against the cross portion. The main clutch lever is constructed in such a manner that, when the main clutch lever is in abutment against the cross portion, a space for allowing a human operator to grip the left and right raised portions is secured between the left and right raised portions and the main clutch lever. | 05-21-2009 |
20140075899 | LAWN MOWER - A lawn mower includes: a cutting blade provided in a housing; a cut grass receptacle provided rearward of the housing; and a chute connecting between the housing and the cut grass receptacle, grass cut by the cutting blade being delivered, by cut grass delivering air, to the cut grass receptacle via the chute. The cut grass receptacle has a bottom plate detachably attachable thereto, and the cut grass receptacle is constructed to allow the bottom plate detached from the receptacle to be accommodated within the receptacle. | 03-20-2014 |
20140075901 | RIDING LAWN MOWER - A riding lawn mower includes: a delivery passage for delivering cut grass from a housing to a receptacle; and a shutter mechanism provided on a lower portion of the delivery passage for switching the mower between a bagging mode in which cut grass is delivered from the housing to the receptacle and a mulching mode in which cut grass is discharged downward of the housing. The shutter mechanism includes a horizontal pivot shaft disposed on the lower portion of the delivery passage, and a shutter plate pivotable about the pivot shaft between a fully closed position where the shutter plate closes the delivery passage to place the mower in the mulching mode and a fully opened position where the shutter plate is laid down toward a discharge side of the delivery passage to place the mower in the bagging mode. | 03-20-2014 |
Patent application number | Description | Published |
20100209670 | SHEET FOR PHOTOSEMICONDUCTOR ENCAPSULATION - The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet. | 08-19-2010 |
20110079816 | OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor. | 04-07-2011 |
20110079929 | KIT FOR OPTICAL SEMICONDUCTOR ENCAPSULATION - The present invention relates to a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; a kit for optical semiconductor encapsulation including a sheet-shaped first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; and a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a sheet-shaped second encapsulating material containing a phosphor. | 04-07-2011 |
20110186893 | OPTICAL-SEMICONDUCTOR DEVICE - The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body. | 08-04-2011 |
20120153345 | OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to an optical semiconductor device including: a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, in which the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly. | 06-21-2012 |
20140057374 | OPTICAL-SEMICONDUCTOR DEVICE - The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body. | 02-27-2014 |
20140106487 | OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention relates to a sheet-shaped, optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor. | 04-17-2014 |
Patent application number | Description | Published |
20090014750 | RESIN FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION CONTAINING POLYBOROSILOXANE - The present invention relates to a resin for optical semiconductor element encapsulation containing a polyborosiloxane obtained by reacting a silicon compound with a boron compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the invention exhibits an excellent advantage that it is excellent in all of heat resistance, transparency, and light resistance. | 01-15-2009 |
20090061549 | PROCESS FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life. | 03-05-2009 |
20090242928 | RESIN SHEET FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE - The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like. | 10-01-2009 |
20100053960 | MICROLENS ARRAY - The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): | 03-04-2010 |
Patent application number | Description | Published |
20110122440 | OPERATION APPARATUS, CONTROLLING METHOD AND STORAGE MEDIUM THEREFOR - An operation apparatus is detachable with respect to a plurality of image processing apparatuses and includes a display unit which can display a selection screen for selecting an image processing apparatus as an operation target from among the plurality of image processing apparatuses The operation apparatus includes a control unit configured to display the selection screen on the display unit if the operation apparatus is started up when the operation apparatus is not mounted on any of the plurality of image forming apparatuses, and establish communication with an image processing apparatus selected via the selection screen. The control unit does not display the selection screen on the display unit if the operation apparatus is started up when the operation apparatus is mounted on any of the plurality of image forming apparatuses, and establishes communication with the image processing apparatus on which the operation apparatus is mounted. | 05-26-2011 |
20120080948 | CONNECTION DEVICE FOR CONNECTING BETWEEN ELECTRICAL DEVICES - A connection device for connecting between a multifunction peripheral and USB devices. A hub unit is disconnectably connected to the multifunction peripheral via a first interface for enabling power supply from the multifunction peripheral to the hub unit. The hub unit is also disconnectably connected to the USB devices via a second interface for enabling power supply from the hub unit to the USB devices. A dedicated power supply connector is connected to a power supply section of the multifunction peripheral via wiring for enabling power supply from the multifunction peripheral to the hub unit. A hub circuit relays data between the multifunction peripheral and one of the USB host connectors of the hub unit. Power from the first interface to the hub circuit is supplied through a first power path, and power from the multifunction peripheral to the USB devices is supplied through a second power path. | 04-05-2012 |
20120257231 | IMAGE READING APPARATUS, CONTROL METHOD FOR IMAGE READING APPARATUS, AND STORAGE MEDIUM - An image reading apparatus includes a conveyance unit, a reading unit, a detection unit, and a control unit. The conveyance unit conveys a document via a conveyance path. The reading unit reads an image of a first surface or a second surface of the document conveyed by the conveyance unit. The detection unit detects a conveyance state of the document on the conveyance path. The control unit performs control to display, on a display unit, a position of the document, and front information or back information indicating, respectively, the first surface and the second surface of the document according to the conveyance state of the document detected by the detection unit. | 10-11-2012 |
20140071477 | IMAGE FORMING APPARATUS AND CONTROL METHOD THEREOF - A CPU of a multifunction peripheral which stores unprocessed data (e.g., untransmitted facsimile transmission data, unprinted facsimile reception data etc.) in a RAM is configured not to perform auto shutdown processing if unprocessed data is stored in the RAM, even if an auto shutdown has been set. | 03-13-2014 |
20140317424 | POWER SUPPLY APPARATUS, POWER SUPPLY METHOD, AND STORAGE MEDIUM - A power supply apparatus includes a receiving unit configured to receive a power supply request and a power supply condition from a power receiving apparatus, and a power supply control unit configured to instruct a power supply unit to perform a test power supply to a target power receiving apparatus which is a transmission source of the power supply request, and instruct the power supply unit to perform actual power supply according to the power supply condition when the receiving unit receives a success notification of the test power supply from the target power receiving apparatus after performing the test power supply. | 10-23-2014 |
Patent application number | Description | Published |
20130224262 | TRANSDERMAL PREPARATION - The invention provides a transdermal absorption preparation showing sufficient adhesiveness on adhesion to the skin, causing low skin irritation, and capable of well controlling releaseability of lidocaine. The transdermal absorption preparation contains a support and an adhesive layer formed on the support. The adhesive layer contains a drug, as well as a thermoplastic elastomer, more than 300 parts by weight of liquid paraffin per 100 parts by weight of the elastomer, not more than 10 wt % of a tackifier, lidocaine, and an organic acid. | 08-29-2013 |
20140303189 | PATCH - The invention provides a patch containing a support and, formed thereon, an adhesive layer retaining a drug. The adhesive layer contains a thermoplastic elastomer, a liquid component in an amount exceeding 300 parts by weight relative to 100 parts by weight of the elastomer, and risperidone or a salt thereof, and optionally a tackifier of not more than 10 wt %. | 10-09-2014 |
20140308335 | TRANSDERMAL PREPARATION - The present invention provides transdermal absorption preparation having a support, and a drug-containing adhesive layer formed on the support, wherein a drug-containing adhesive layer contains donepezil or a salt thereof, and a higher fatty acid salt. | 10-16-2014 |
Patent application number | Description | Published |
20110003893 | AQUEOUS LOXOPROFEN-CONTAINING PATCHES - An aqueous loxoprofen-containing patch is provided, which has good stability and excellent transdermal absorption of loxoprofen. The aqueous patch includes loxoprofen or a salt thereof and triacetin. Specifically, the aqueous patch includes, based on the weight of the adhesive gel base, 0.1 to 5% by weight of loxoprofen or a salt thereof, 0.5 to 5% by weight of triacetin, 1 to 30% by weight of a water-soluble polymer, 0.01 to 5% by weight of a cross-linking agent, 10 to 90% by weight of purified water, and 0 to 20% by weight of an inorganic powder. | 01-06-2011 |
20130226112 | PERCUTANEOUS ABSORBENT AND ADHESIVE SHEET FOR SKIN PATCH - The invention provides an adhesive sheet for adhesion to the skin, as well as a transdermal absorption preparation containing the adhesive sheet and a drug or a pharmaceutically acceptable salt thereof in the adhesive layer of the adhesive sheet. The adhesive sheet comprises a support and an adhesive layer formed on the support, wherein the adhesive layer contains at least a thermoplastic elastomer, and more than 300 parts by weight of liquid paraffin per 100 parts by weight of the elastomer, and wherein the adhesive layer contains not more than 10 wt % of a tackifier. | 08-29-2013 |
20150030666 | ADHESIVE SKIN PATCH - The present invention provides an adhesive skin patch containing a support and an adhesive layer containing a drug which is formed on the support, wherein the adhesive layer comprises a thermoplastic elastomer, a liquid component in an amount exceeding 300 parts by weight per 100 parts by weight of the thermoplastic elastomer, a therapeutic drug having an anticholinergic activity or a salt thereof for overactive bladder as a drug, (A) a non-volatile hydrocarbon oil as a liquid component, and one or more kinds selected from the group consisting of (B) an amide solvent, (C) an alcohol solvent and (D) a liquid organic acid as a liquid component, or a fatty acid salt, and optionally comprises a tackifier at a content of not more than 10 wt % of the adhesive layer. | 01-29-2015 |
Patent application number | Description | Published |
20090014843 | MANUFACTURING PROCESS AND STRUCTURE OF THROUGH SILICON VIA - A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions. | 01-15-2009 |
20090309218 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - When a through-hole electrode and a rear-surface wire are formed on a rear surface of a chip, a convex portion is formed on the rear surface of the chip due to a rear-surface wiring pad which is a part of the through-hole electrode and the rear-surface wire. This causes the air leakage when the chip is sucked, and therefore, the reduction of the sucking force of the chip occurs. A concave portion is formed in advance in a region where a rear-surface wiring pad and a rear-surface wire are formed. The rear-surface wiring pad and the rear-surface wire are provided inside the concave portion. Thus, a flatness of the rear surface of the chip is ensured by a convex portion caused by thicknesses of the rear-surface wiring pad and the rear-surface wire, so that the reduction of the sucking force does not occur when the chip is handled. | 12-17-2009 |
20100155940 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface-electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode. | 06-24-2010 |
20100258948 | Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device - A semiconductor wafer comprising: a tubular trench formed at a position to form a through-hole electrode of a wafer; an insulating member buried inside the trench and on an upper surface of the trench; a gate electrode film and a metal film formed on an upper surface of the insulating member; a multilevel columnar wiring via formed on an upper surface of the metal film; and an external connection electrode formed electrically connected to the metal film via the multilevel columnar wiring via. In this manner, it is unnecessary to have a new process of dry etching to form a through-hole electrode after thinning the wafer and equipment development. Moreover, introduction of a specific design enables formation of through-hole electrodes with significantly reduced difficulties of respective processes. | 10-14-2010 |
20110233773 | MANUFACTURING PROCESS AND STRUCTURE OF THROUGH SILICON VIA - A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions. | 09-29-2011 |
20120091583 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode. | 04-19-2012 |
Patent application number | Description | Published |
20110280637 | CLEANING DEVICE AND IMAGE-FORMING DEVICE - A cleaning device comprises: a rotational brush disposed to touch an image holder and a lubricant, the brush which scrapes the lubricant and applies the scraped lubricant to the image holder, the brush including: a rotational axis; and a plurality of looped bristles disposed around the rotational axis, wherein a contact length of the bristles to the lubricant is longer than a contact length of the bristles to the image holder. | 11-17-2011 |
20120141178 | LUBRICANT SUPPLYING DEVICE AND IMAGE FORMING APPARATUS - A lubricant supplying device that supplies a lubricant to the surface of an image carrier has a cloud generating section that generates a cloud in which particles of the lubricant are mixed with air and a conveying section that classifies the particles of the lubricant present in the cloud generated by the cloud generating section into small particles with sizes smaller than a prescribed size and large particles with sizes larger than or equal to the prescribed size, and conveys the classified small particles toward the image carrier, and has a lubricant supplying member that holds a lubricant, a contacting member that contacts the lubricant supplying member and causes the lubricant carried by the lubricant supplying member to fly off in the direction of the image carrier, and a leveling member that contacts the image carrier and levels the adhered lubricant. | 06-07-2012 |
20140169851 | LUBRICANT COATING DEVICE AND IMAGE FORMING APPARATUS - A lubricant coating device includes a photoconductor and a leveling blade that levels a lubricant applied on a surface of the photoconductor, the leveling blade configured to abut the photoconductor in a trail direction with respect to a rotational direction of the photoconductor, wherein a hardness of a tip of the leveling blade, the tip being positioned on a side that abuts the surface of the photoconductor, is higher than hardness of a non-abutting portion that does not abut the surface of the photoconductor. | 06-19-2014 |
Patent application number | Description | Published |
20120188684 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges. | 07-26-2012 |
20120320495 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes curved surface portions provided in an outer surface of a ceramic element assembly, and internal conductors provided within the ceramic element assembly that are exposed in the curved surface portions and principal surfaces to define starting points for plating deposition. A base layer, in an external conductor, which is defined by a plating film is arranged so as to directly cover the exposed portions of the internal conductors. | 12-20-2012 |
20130033154 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a monolithic ceramic electronic component, given that an interval between outer-layer dummy conductors adjacent to each other in an outer layer portion is d1, and that an interval between first and second inner electrodes adjacent to each other in an inner layer portion is d2, 1.7d2≦d1 is satisfied. By reducing a density of the outer-layer dummy conductors in the outer layer portion on that condition, pressing of the inner electrodes through the outer-layer dummy conductors is relieved in a pressing step before firing. As a result, a distance between the inner electrodes can be prevented from being locally shortened. It is hence possible to effectively reduce and prevent degradation of reliability of the monolithic ceramic electronic component, e.g., a reduction of BDV. | 02-07-2013 |
20140133063 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a monolithic ceramic electronic component, given that an interval between outer-layer dummy conductors adjacent to each other in an outer layer portion is d1, and that an interval between first and second inner electrodes adjacent to each other in an inner layer portion is d2, 1.7d2≦d1 is satisfied. By reducing a density of the outer-layer dummy conductors in the outer layer portion on that condition, pressing of the inner electrodes through the outer-layer dummy conductors is relieved in a pressing step before firing. As a result, a distance between the inner electrodes can be prevented from being locally shortened. It is hence possible to effectively reduce and prevent degradation of reliability of the monolithic ceramic electronic component, e.g., a reduction of BDV. | 05-15-2014 |
20140146438 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges. | 05-29-2014 |
Patent application number | Description | Published |
20090004590 | TONER AND METHOD OF MANUFACTURING THE SAME, TWO-COMPONENT DEVELOPER, DEVELOPING DEVICE, AND IMAGE FORMING APPARATUS - in a toner at least containing a binder resin and a colorant, a value obtained by dividing a particle size D | 01-01-2009 |
20090029280 | TONER, METHOD OF MANUFACTURING THE SAME, TWO-COMPONENT DEVELOPER, DEVELOPING DEVICE, AND IMAGE FORMING APPARATUS - A toner includes toner particles containing at least binder resin and colorant. The toner particles contain a large-sized toner particle group of particles and a small-sized toner particle group of particles having a volume average particle size smaller than that of the large-sized toner particle group. In the toner, a volume average particle size D | 01-29-2009 |
20090098475 | TONER, METHOD OF MANUFACTURING THE SAME, TWO-COMPONENT DEVELOPER, DEVELOPING DEVICE, AND IMAGE FORMING APPARATUS - There are provided a toner, a method of manufacturing the toner, a two-component developer, a developing device, and an image forming apparatus, which are excellent in a charge rising property, environmental stability, and life stability during printing and which cause less fogging. The toner contains a core particle containing binder resin and colorant, and a coating layer which contains resin and a charge control agent and is formed on a surface of the core particle. At least a part of the resin contained in the coating layer is melt-bonded to the core particle, and the charge control agent is dispersed and immobilized in the coating layer. The dispersed charge control agent has a dispersion diameter of less than 1 μm. | 04-16-2009 |
20090142687 | TONER AND METHOD FOR MANUFACTURING THE TONER, TWO-COMPONENT DEVELOPER, DEVELOPING DEVICE AND IMAGE FORMING APPARATUS - A toner which takes into account preservation of the global environment and which is excellent in fixability and storage stability and moreover, good in light transmittance and a method for manufacturing the toner, a two-compartment developer, a developing device and an image forming apparatus are provided. In toner including at least a binder resin and a colorant, the binder resin includes a resin which is a major component and a biomass-containing crystalline resin; and the crystalline resin is contained in an amount of 1 part by weight or more and 50 parts by weight or less based on 100 parts by weight of the binder resin, and a melting point of the crystalline resin is higher by a temperature of from 5° C. to 10° C. than a temperature at which a loss modulus G″ of the toner at a frequency of 1 Hz is 10 | 06-04-2009 |