Patent application number | Description | Published |
20090076480 | Active Ingredient-Containing Silicone Elastomers - The invention relates to compositions comprising silicone elastomers and antimicrobially active substances in homogeneous distribution, a process for their production and their use in medical articles. | 03-19-2009 |
20100099788 | PROCESS FOR THE PREPARATION OF POLYETHER ESTER POLYOLS - The present invention relates to a process for the preparation of polyether ester polyols starting from fatty acid esters and starter compounds having Zerewitinoff-active hydrogen atoms, and to their use in the production of solid or foamed polyurethane materials. | 04-22-2010 |
20130183880 | SLIGHTLY MODIFIED PREPOLYMERS AND THEIR USES - An isocyanate-terminated prepolymer C having an NCO content of from ≧26% by mass to ≦31.0% by mass is obtainable from the reaction of an isocyanate composition A having a viscosity at 25° C. of from ≧60 mPas to ≦800 mPas, comprising from ≧25% by mass to ≦60% by mass MDI and from ≧40% by mass to 75% by mass pMDI, wherein the sum of the amounts of those components is ≦100% by mass, with a bifunctional polyester ether polyol B having an OH number of ≧200 mg(KOH)/g and ≦500 mg(KOH)/g, obtained from the reaction of a dicarboxylic acid/dicarboxylic acid derivative with at least one polyol and with an epoxide, wherein the polyester ether polyol B is used in amounts of from ≧1.5% by mass to ≦6.0% by mass, based on the sum of the masses of A and B. The invention further provides a PUR/PIR polymer produced from the prepolymer C, its use and composite elements based thereon. | 07-18-2013 |
20130289152 | METHOD FOR PRODUCING FOAMED MOLDINGS - A method for producing foamed mouldings comprises the steps of providing a mould ( | 10-31-2013 |
20140162006 | WATER-BLOWN PUR/PIR RIGID FOAM MATERIAL THAT CAN BE SPRAYED - The invention relates to a method for producing a water-blown polyurethane/polyisocyanurate rigid foam material that can be sprayed, by reacting a mixture comprising an aromatic polyester polyol, a first, comparatively short-chain aliphatic polyether polyol, a second, comparatively long-chain aliphatic polyether polyol, an isocyanate component, a blowing agent having water at least as a main component, and a catalyst component. The invention further relates to a rigid foam produced according to the method according to the invention, a composite material composed of said rigid foam and a pipe, and to the use of such a composite material for transporting liquid or gaseous media. | 06-12-2014 |
20140213679 | EMULSIONS AND THEIR USE IN THE PRODUCTION OF FOAMS BASED ON ISOCYANATES - The invention relates to stable emulsions for the production of foams based on isocyanates, comprising at least three polyols A1a, A1b and A1c and at least one physical blowing agent T, wherein A1a is a polyether polyol, obtained by the addition of epoxies to starter compounds selected from carbohydrates and difunctional or higher-functional alcohols, A1b is a polyether polyol started on an aromatic amine and A1c is a polyester polyether polyol, obtained by the addition of epoxies to the esterification product of an aromatic dicarboxylic acid derivative and a difunctional or higher-functional alcohol. The invention further relates to a method for producing foams by reactions of such emulsions with isocyanates and to the foams obtainable in this way and their use for insulating purposes. | 07-31-2014 |
20140234613 | PROCESS FOR PRODUCING A RIGID POLYURETHANE-ISOCYANURATE FOAM - The invention provides a process for producing rigid polyurethane-polyisocyanurate foams using polyols having a high proportion of secondary hydroxyl end groups. The invention further relates to the rigid polyurethane-polyisocyanurate foams thus obtainable and to the use thereof in the production of composite elements from rigid polyurethane-polyisocyanurate foams and suitable outer layers. The invention further provides the composite elements thus obtainable. | 08-21-2014 |
20140242313 | Insulation Moulding and Method for its Manufacture - A cavity between inner and outer walls of an open-box-shaped mould is filled with a polyurethane reaction mixture, containing an isocyanate and an emulsion of an isocyanate-reactive composition with three polyols and a blowing agent, which is cured to a polyurethane containing polymer. The inner and outer wall are a fixed distance from one another and each wall comprises a bottom and sides. The mixture is fed through an inlet in the bottom of the outer wall. Before filling the cavity, the mould is turned downwards so that the mixture foams upwards, filling the cavity. The three polyols are polyether polyol obtained by adding an epoxy to carbohydrates or difunctional or higher-functional alcohols; polyether polyol obtained by adding an epoxy to an aromatic amine; and polyester polyether polyol obtained by adding an epoxy to the esterification product of an aromatic dicarboxylic acid derivative and a difunctional or higher-functional alcohol. | 08-28-2014 |
20140323605 | STABLE EMULSIONS AND THEIR USE IN THE PRODUCTION OF FOAMS BASED ON ISOCYANATE - The invention relates to stable emulsions for the production of foams based on isocyanate, at least comprising three polyols A1a, A1b and A1c as well as at least one physical blowing agent T, wherein A1a is a polyether polyol obtained by addition of epoxides to starter compounds selected from carbohydrates and di- or higher-functional alcohols, A1b is a polyether polyol started on an aromatic amine, and A1c is a polyester polyol obtained by esterification of a polycarboxylic acid component and a polyalcohol component, wherein the total amount of aromatic dicarboxylic acid derivatives used in the esterification, calculated on the basis of the free aromatic dicarboxylic acids and based on the total mass of polyalcohol component and polycarboxylic acid component, is less than or equal to 48.5% by mass. | 10-30-2014 |
20150051301 | METHOD FOR PRODUCING A HARD POLYURETHANE-POLYISOCYANURATE FOAMED MATERIAL - The present invention relates to a process for producing a rigid polyurethane-polyisocyanurate foam C, comprising the step of reacting (i) an isocyanate-terminated prepolymer B with (ii) an activator component A comprising at least one trimerisation catalyst A1 and at least one blowing agent A3 in a reaction mixture to form a foam, characterised in that—there is used an isocyanate-terminated prepolymer B obtained from a reaction of an isocyanate B1 having a mean isocyanate functionality of from ≧2.3 to ≦2.9 with a polyol component B2, and—the activator component A comprises water as the blowing agent A3 in an amount of from ≧5 wt. % to ≦50 wt. %,—the isocyanate index in the reaction mixture is in a range of from ≧400 to ≦500, and—the isocyanate content of the prepolymer B is in a range of from ≧21 wt. % to ≦30 wt. %, based on the total mass of the prepolymer B, and—wherein in the reaction of the prepolymer B and the activator component A a conversion contribution to polyisocyanurate of ≦75% is achieved. Rigid foams C so produced have good flame retarding properties while at the same time having good insulating properties and stability properties. The present invention relates further to a rigid polyisocyanurate foam C produced by the process according to the invention, to the use of such a rigid polyisocyanurate foam C in the production of heat-insulating structural components, and to a heat-insulating structural component comprising such a rigid polyurethane-polyisocyanurate foam. | 02-19-2015 |
20150133573 | METHOD FOR PRODUCING FOAMED MOLDED BODIES - The invention relates to a method for producing foamed molded bodies comprising the steps of
| 05-14-2015 |
20150183143 | METHOD FOR THE VACUUM-ASSISTED PRODUCTION OF A PUR/PIR FOAM BODY - The present invention relates to a method for producing a PUR/PIR foam body, comprising the steps of providing a mold adapted for applying an underpressure to the interior of the mold; introducing a reaction mixture comprising an isocyanate-reactive component A and an isocyanate B into the mold, and applying an underpressure to the interior of the mold, so the underpressure acts on the introduced reaction mixture. The underpressure is applied to the interior of the mold no later than the reaction mixture has started to set in the mold, and the isocyanate index of the reaction mixture is ≧300. | 07-02-2015 |
20150197611 | VACUUM-SUPPORTED METHOD FOR THE PRODUCTION OF POLYURETHANE FOAM - The present invention is related to a method for the production of polyurethane foam, comprising the steps of:
| 07-16-2015 |
Patent application number | Description | Published |
20100295094 | ESD Protection Apparatus and Electrical Circuit Including Same - An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate. | 11-25-2010 |
20140015131 | STACKED FAN-OUT SEMICONDUCTOR CHIP - A stacked semiconductor device and method of manufacturing a stacked semiconductor device are described. The semiconductor device may include a reconstituted base layer having a plurality of embedded semiconductor chips. A first redistribution layer may contact the electrically conductive contacts of the embedded chips and extend beyond the boundary of one or more of the embedded chips, forming a fan-out area. Another chip may be stacked above the chips embedded in the base layer and be electrically connected to the embedded chips by a second redistribution layer. Additional layers of chips may be included in the semiconductor device. | 01-16-2014 |
20140197530 | SEMICONDUCTOR DEVICE WITH CHIP HAVING LOW-K-LAYERS - A semiconductor device is described having at least one semiconductor chip, the chip having an active area on a top side thereof, the active area formed at least in part of low-k material, said low-k material defining a low-k subarea of said active area; an embedding material, in which said at least one semiconductor chip is embedded, at least part of the embedding material forming a coplanar area with said active area; at least one contact area within the low-k subarea; a redistribution layer on the coplanar area, the redistribution layer connected to said contact areas; at least one first-level interconnect, located outside said low-k subarea, the first-level interconnect electrically connected to at least one of said contact areas via the redistribution layer. | 07-17-2014 |
20140252632 | SEMICONDUCTOR DEVICES - A semiconductor device includes: a semiconductor chip; an extension layer extending laterally from a boundary of the semiconductor chip; a redistribution layer disposed over at least one side of the extension layer and the semiconductor chip, wherein the redistribution layer electrically couples at least one contact of the semiconductor chip to at least one contact of an interface, wherein at least a part of the interface extends laterally beyond the boundary of the semiconductor chip. | 09-11-2014 |
20140264832 | CHIP ARRANGEMENTS - A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip. | 09-18-2014 |
20140264914 | Chip package-in-package and method thereof - An electronic package includes an interposer, a die attached to a first side of the interposer, an embedded electronic package attached to a second side of the interposer, an encapsulation compound, a set of vias providing electrical paths from a first side of the electronic package to the interposer through the encapsulation compound, and a redistribution layer electrically redistributing the set of vias to form a set of interconnect-pads. Either the die or the embedded electronic package, or both, are electrically connected to the interposer. | 09-18-2014 |
20150028478 | SEMICONDUCTOR DEVICES - A semiconductor device includes: a chip having at least one electrically conductive contact at a first side of the chip; an extension layer extending laterally from one or more sides of the chip; a redistribution layer on a surface of the extension layer and the first side, and coupled to the contact; an interposer having at least one electrically conductive contact at a first surface of the interposer and coupled to the redistribution layer, and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface; a molding material at least partially enclosing the chip and the redistribution layer, and in contact with the interposer. Another semiconductor device includes: an interposer; a redistribution layer over the interposer; a circuit having first and second circuit portions, wherein the redistribution layer includes the first circuit portion, and the interposer includes the second circuit portion. | 01-29-2015 |
20150048520 | MAGNETIC CONTACTS - Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed. | 02-19-2015 |
20150084165 | STACKED MICROELECTRONIC DICE EMBEDDED IN A MICROELECTRONIC SUBSTRATE - Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material. | 03-26-2015 |
20150084202 | DIE EDGE SIDE CONNECTION - An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die. | 03-26-2015 |
20150214188 | FLEXIBLY-WRAPPED INTEGRATED CIRCUIT DIE - Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate. | 07-30-2015 |
Patent application number | Description | Published |
20110017309 | PUMP WITH INTEGRAL CAISSON DISCHARGE - A caisson for submersible pumps and method of operating a pump that is fluidly cooperative with the caisson. The pump discharge and the caisson are fluidly coupled to one another such that upon discharge of a fluid being pumped, the caisson acts as the fluid conduit, thereby removing the need for redundant riser pipes. In one form, the pump is a seawater lift pump for use with floating production storage and offloading (FPSO), offshore platforms or related structures. | 01-27-2011 |
20110070099 | RADIAL BEARINGS FOR DEEP WELL SUBMERSIBLE PUMPS - A bearing assembly for use in a deepwell submersible pump, the pump and a method of pumping a geothermal fluid. The bearing assembly is constructed to include a lubricant conveying mechanism, a bearing sleeve and a multilayer bushing. The lubricant is forced between the bushing and a bearing sleeve by the lubricant conveying mechanism that cooperates with the rotation of a shaft used to connect a power-providing motor with one or more pump impellers. In this way, there exists a substantially continuous lubricant environment between the sleeve and bushing to act in a hydrodynamic fashion. | 03-24-2011 |
20110123374 | COMPENSATOR ASSEMBLY FOR SUBMERSIBLE PUMP SYSTEM - A submersible pump system with a pump, motor and compensator assembly. In one embodiment, the compensator assembly is made up of multiple elastomeric compensators and a housing. The elastomeric compensators, which are made up of an engaging end, a floating end and a series of alternating crests and grooves, may contain motor cooling liquid. The crests and grooves extend along the compensator's longitudinal axis. The compensators possess a degree of elasticity sufficient for a width of at least one of the respective grooves to expand and contract along with the motor cooling liquid. The crests slide along an interior wall of the housing, while the floating end moves within the housing in cooperation with expansion and contraction of the width of at least one of the grooves. | 05-26-2011 |
20110176941 | POWER PLUG SYSTEM FOR SUBMERSIBLE PUMP SYSTEM - A power plug system for use with a submersible pump. One embodiment comprises a male plug end, a female plug end, and a plurality of seals. The male plug end comprises a housing and a conductive sleeve. The housing receives an electrically conductive cable and conducts an electric current from the cable to the conductive sleeve. The female plug end comprises a housing, a conductive pin, and a female plug sleeve. The conductive sleeve is radially sealable within the female plug end through a plug end seal of the plurality of seals. The conductive sleeve and the conductive pin are conductively connectable. The female plug sleeve is radially sealable within a complementary plug end through a female plug sleeve seal of the plurality of seals. The conductive pin conductively connects to a conductive lead of the complementary plug end with insertion of the female plug sleeve therein. | 07-21-2011 |
20110211979 | COOLING SYSTEM FOR A MULTISTAGE ELECTRIC MOTOR - A multistage electric motor includes a plurality of motor stages connected in series, each motor stage comprising a stator, and a rotor; a plurality of cooling fluid paths, each cooling fluid path forming a recirculating loop independent of the other cooling fluid paths, each cooling fluid path in communication with the stator of one of motor stages; and a cooling fluid flowing through each cooling fluid path, the cooling fluid removing heat from the stator of each motor stage. A submersible pump including the multistage electric motor, and a method of cooling the multistage electric motor are also described. | 09-01-2011 |
20140050594 | RADIAL BEARINGS FOR DEEP WELL SUBMERSIBLE PUMPS - A bearing assembly for use in a deepwell submersible pump, the pump and a method of pumping a geothermal fluid. The bearing assembly is constructed to include a lubricant conveying mechanism, a bearing sleeve and a multilayer bushing. The lubricant is forced between the bushing and a bearing sleeve by the lubricant conveying mechanism that cooperates with the rotation of a shaft used to connect a power-providing motor with one or more pump impellers. In this way, there exists a substantially continuous lubricant environment between the sleeve and bushing to act in a hydrodynamic fashion. | 02-20-2014 |
Patent application number | Description | Published |
20100006006 | Water-Soluble Silicates and Use Thereof - Modified silicates are described which are obtained by reacting a waterglass solution with alkylsilanes of the general formula R—(CH | 01-14-2010 |
20100261798 | Glycerol Ether Mixture, Cosmetic Composition Containing this Mixture and Process for its Production - The invention relates to a glycerol ether mixture which consists essentially of a) at least one C | 10-14-2010 |
20110118168 | Cleaning Composition Comprising Graft Copolymers - Disclosed is the use of water-soluble graft copolymers prepared by free-radically initiated graft polymerization of 40 to 90% by weight of component (A), selected from the group consisting of monosaccharides, oligosaccaharides, polysaccharides and derivatives thereof, with 5 to 40% by weight of monomers (B), selected from the group consisting of ethylenically unsaturated C3-C10 monocarboxylic acids or the alkali or ammonium salts thereof, and 10 to 50% by weight of monomers (C), selected from the group consisting of ethylenically unsaturated N-containing monomers and/or ethylenically unsaturated monomers containing sulfo-groups, in cleaning compositions which, as well as the graft polymer, comprise at least one surfactant component, for hydrophilization and/or improvement of shine retention of hard surfaces which have been brought into contact with these cleaning compositions. | 05-19-2011 |
Patent application number | Description | Published |
20120252712 | Gel-Form Preparations - The invention relates to gel-form agents, containing, based on the total weight of the agent, from 45 to 90 wt % of water; from 5 to 35 wt % of emulsifiers and from I to 25 wt % of surfactants as well as optionally further auxiliaries and additives. The gel-form agents have a viscous damping factor Q | 10-04-2012 |
20130012423 | Use Of Cleaning Agents Containing Microemulsions That Contain Wax - The invention relates to the use of microemulsions, containing (a) at least one alkyl(oligo)glycoside, (b) at least one co-surfactant different from (a), (c) at least one water-insoluble organic oil component, (d) at least one wax, and (e) water, to produce cleaning agents, and aqueous hand dishwashing detergents, containing anionic and amphoteric surfactants and, in amounts from 0.2 to 10 wt % relative to the total weight of the hand dishwashing detergents, a microemulsion according to the description in claim | 01-10-2013 |