Patent application number | Description | Published |
20110008464 | METHODS AND COMPOSITIONS FOR TREATING THYROID-RELATED MEDICAL CONDITIONS WITH REDUCED FOLATES - The present invention provides methods and compositions for treating thyroid-related medical conditions. Many thyroid-related medical conditions exist that go undiagnosed and untreated. These conditions may be prevented and treated with reduced folates and vitamin B12. Administration of reduced folates and vitamin B12 will prevent or treat cerebrospinal folate deficiency, which is linked to thyroid-related medical conditions. Administration of reduced folates and vitamin B12 will also prevent or treat conditions associated with masked megaloblastic anemia and hypothyroidism, and other conditions brought upon through improper thyroid function. Additionally, it is commonplace to treat many thyroid conditions with anti-thyroid drugs or thyroid stimulating drugs. This practice alone is also responsible for causing, or not beneficially addressing, adverse conditions that can be prevented or treated through the methods and compositions discussed herein. | 01-13-2011 |
20130089623 | Methods and Compositions for Treating Thyroid-Related Medical Conditions with Reduced Folates - The present invention provides methods and compositions for treating thyroid-related medical conditions. Many thyroid-related medical conditions exist that go undiagnosed and untreated. These conditions may be prevented and treated with reduced folates and vitamin B12. Administration of reduced folates and vitamin B12 will prevent or treat cerebrospinal folate deficiency, which is linked to thyroid-related medical conditions. Administration of reduced folates and vitamin B12 will also prevent or treat conditions associated with masked megaloblastic anemia and hypothyroidism, and other conditions brought upon through improper thyroid function. Additionally, it is commonplace to treat many thyroid conditions with anti-thyroid drugs or thyroid stimulating drugs. This practice alone is also responsible for causing, or not beneficially addressing, adverse conditions that can be prevented or treated through the methods and compositions discussed herein. | 04-11-2013 |
20140030359 | Methods and Compositions for Treating Thyroid-Related Medical Conditions with Reduced Folates - The present invention provides methods and compositions for treating thyroid-related medical conditions. Many thyroid-related medical conditions exist that go undiagnosed and untreated. These conditions may be prevented and treated with reduced folates and vitamin B12. Administration of reduced folates and vitamin B12 will prevent or treat cerebrospinal folate deficiency, which is linked to thyroid-related medical conditions. Administration of reduced folates and vitamin B12 will also prevent or treat conditions associated with masked megaloblastic anemia and hypothyroidism, and other conditions brought upon through improper thyroid function. Additionally, it is commonplace to treat many thyroid conditions with anti-thyroid drugs or thyroid stimulating drugs. This practice alone is also responsible for causing, or not beneficially addressing, adverse conditions that can be prevented or treated through the methods and compositions discussed herein. | 01-30-2014 |
Patent application number | Description | Published |
20090116190 | Controlling Airflow In A Computer Chassis - Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain. | 05-07-2009 |
20130126145 | HEAT SINK WITH ORIENTABLE FINS - A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis. | 05-23-2013 |
20130133859 | HEAT SINK WITH HEAT BUS AND FIN STRUCTURE - A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. | 05-30-2013 |
20140117906 | DYNAMICALLY MODIFIED FAN SPEED TABLE FOR COOLING A COMPUTER - A computer program product including computer usable program code embodied on a computer usable medium for controlling a temperature within a computer system using a fan. The computer program product includes computer usable program code for monitoring the temperature within the computer system; dynamically selecting a fan speed step in response to the temperature, wherein the fan speed step is selected from a fan speed table defining a finite number of fan speed steps each having an associated fan speed; operating a fan at the dynamically selected fan speed step; measuring a fan output variation is measured over a prescribed time interval; and automatically modifying the fan speed table to change the fan speeds associated with each fan speed step, wherein the fan speeds are changed as a function of the measured fan output variation while continuing to drive the fan. | 05-01-2014 |
20140117908 | DYNAMICALLY MODIFIED FAN SPEED TABLE FOR COOLING A COMPUTER - A computer-implemented fan control method includes measuring a temperature within a computer system and dynamically selecting a fan speed step in response to the temperature received, wherein the fan speed step is selected from a fan speed table defining a finite number of fan speed steps each having an associated fan speed. A fan is operated at the dynamically selected fan speed step, wherein the fan is positioned to drive air through the computer system where the temperature is being measured. The fan output variation is measured over a prescribed time interval and the fan speed table is automatically modified to change the fan speeds associated with each fan speed step, wherein the fan speeds are changed as a function of the measured fan output variation while continuing to drive the fan. | 05-01-2014 |
20150153113 | HEAT SINK WITH AIR PATHWAYS THROUGH THE BASE - A heat sink includes a heat sink base having a central area for contacting a heat-generating component and a perimeter area extending beyond the central area, wherein the perimeter area of the heat sink base includes air pathways through the heat sink base and the central area does not. The heat sink further includes heat sink fins extending from the heat sink base across the central area and the perimeter area. Airflow across the heat sink removes heat from the heat-generating component, such as a processor. The central area may be secured in contact with a surface of a processor operably secured to a circuit board. The heat sink is particularly beneficial in circuit board configurations having a component immediately upstream or downstream of the processor. | 06-04-2015 |
Patent application number | Description | Published |
20080304229 | AIR-PRESSURE-DEPENDENT CONTROL OF COOLING SYSTEMS USING A SHARED AIR PRESSURE SENSOR - Systems and methods provide altitude-dependent fan control for a plurality of electronic subsystems using a shared air pressure sensor. Each server or multi-server chassis of a rack system is a subsystem of the rack system. Each subsystem receives its own on-board fan or blower module. The shared air pressure sensor senses air pressure and outputs a signal to all of the subsystems. Each subsystem then independently regulates its own fan speed according to the signal output by the shared air pressure sensor. Other fan operational parameters, such as the number of fans recruited, may also be controlled according to altitude according to the invention. A variety of other performance parameters, such as internal air or component temperature, ambient air temperature, server workload, and processor activity level, may also be factored into control of these fan operational parameters. | 12-11-2008 |
20090207565 | Ducted Air Temperature Sensor - A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system, wherein the fan system draws air through the chassis in an airflow direction, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet, wherein the hot air duct has a length to width aspect ratio of greater than four. A first thermal sensor is secured within, or direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a first temperature signal. A controller is in electronic communication with the first thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal. Optionally, the hot air duct may extend through, over or around a second component on the circuit board to avoid thermal effects of the second component. | 08-20-2009 |
20090213544 | VARIABLE POSITION DAMPERS FOR CONTROLLING AIR FLOW TO MULTIPLE MODULES IN A COMMON CHASSIS - An apparatus comprising a chassis providing a plurality of module bays, one or more modules received in the module bays, wherein each module has at least one damper actuator extending from a distal end of the module. A fan assembly and a plurality of air flow dampers are secured in a distal end of the chassis, wherein each damper is aligned with one module bay to control air flow through the aligned module bay. Each damper is biased to close in the absence of contact with a damper actuator and opens in response to contact with a damper actuator. Each damper opens to a variable extent determined by the profile of the contacting damper actuator. The damper actuator of a particular module has a profile corresponding to the thermal load of that module, such that installing a module into the chassis automatically opens the aligned damper to the desired extent. | 08-27-2009 |
20090249862 | System and Method for Determining Air Density Based on Temperature Sensor Data - A computer system and method for measuring air density in a computer chassis. The computer chassis includes a fan, an ambient air temperature sensor, and a heat-generating device with a heat sink, a heat sink temperature sensor, and a controller. The controller controls the fan speed and applies a known amount of thermal energy to the heat sink, then determines the air density from the difference in temperature between the ambient air and the heat sink. The controller may then use the air density determination to adjust the air flow rate through the computer chassis to provide a proper air flow rate for cooling. | 10-08-2009 |
20090256512 | PLURALITY OF CONFIGURABLE INDEPENDENT COMPUTE NODES SHARING A FAN ASSEMBLY - A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings. | 10-15-2009 |
20090262497 | Duct System For High Power Adapter Cards - Method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet. | 10-22-2009 |