Patent application number | Description | Published |
20080254635 | Method for Accelerated Etching of Silicon - A method for the plasma-free etching of silicon using the etching gas ClF | 10-16-2008 |
20080286970 | Method for producing a semiconductor component and a semiconductor component produced according to the method - A method for producing a semiconductor component includes forming an n-doped layer in a p-doped layer of the semiconductor component, wherein the n-doped layer comprises at least one of: a sieve-like layer or a network-like layer. The method also includes porously etching the p-doped layer between the material of the n-doped layer to form a top electrode, and forming a cavity below the n-doped layer. | 11-20-2008 |
20090084182 | MICROMECHANICAL SENSOR ELEMENT - A micromechanical sensor element ( | 04-02-2009 |
20090101997 | Micromechanical Capacitive Pressure Transducer and Production Method - The present invention describes a method for producing a micromechanical capacitive pressure transducer and a micromechanical component produced by this method. First, a first electrode is produced in a doped semiconductor substrate. | 04-23-2009 |
20090127640 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT, AS WELL AS A SEMICONDUCTOR COMPONENT, IN PARTICULAR A MEMBRANE SENSOR - A manufacturing method for a micromechanical semiconductor element includes providing on a semiconductor substrate a patterned stabilizing element having at least one opening. The opening is arranged such that it allows access to a first region in the semiconductor substrate, the first region having a first doping. Furthermore, a selective removal of at least a portion of the semiconductor material having the first doping out of the first region of the semiconductor substrate is provided. In addition, a membrane is produced above the first region using a first epitaxy layer applied on the stabilizing element. In a further method step, at least a portion of the first region is used to produce a cavity underneath the stabilizing element. In this manner, the present invention provides for the production of the patterned stabilizing element by means of a second epitaxy layer, which is applied on the semiconductor substrate. | 05-21-2009 |
20090142873 | Method for Manufacturing a Sensor Array Including a Monolithically Integrated Circuit - A method for producing a sensor array including a monolithically integrated circuit is described as well as a sensor array. This sensor array has a micromechanical sensor structure, in which a first partial structure which is associated with the sensor structure is produced at the same time as a second partial structure which is associated with the circuit, a process variation of the first partial structure being performed in order to adjust a structure property of the sensor structure while the second partial structure remains the same. | 06-04-2009 |
20090189629 | SEMICONDUCTOR WAFER HAVING A MULTITUDE OF SENSOR ELEMENTS AND METHOD FOR MEASURING SENSOR ELEMENTS ON A SEMICONDUCTOR WAFER - In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device. | 07-30-2009 |
20090236610 | Method for Manufacturing a Semiconductor Structure, and a Corresponding Semiconductor Structure - A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided. | 09-24-2009 |
20090256219 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT, AS WELL AS A SEMICONDUCTOR COMPONENT, IN A PARTICULAR A DIAPHRAGM SENSOR - A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces. | 10-15-2009 |
20100035068 | Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type - A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material. | 02-11-2010 |
20100077862 | Workpiece Composite and Use of the Workpiece Composite - A workpiece composite includes a preform part and a gel accommodated in a recess in the preform, the recess being enclosed by at least one edge which serves as a creep barrier to prevent the gel from spreading. The at least one edge of the recess defines a termination point of at least one surface which is provided with a coating made of an oleophobic material in an area adjacent to the at least one edge. | 04-01-2010 |
20100133631 | DIFFERENTIAL-PRESSURE SENSOR SYSTEM AND CORRESPONDING PRODUCTION METHOD - A differential-pressure sensor system and a corresponding production method. The differential-pressure sensor system includes: a differential-pressure sensor chip having a first pressure application region for applying a first pressure, as pressure to be detected, to the differential-pressure sensor chip, and a second pressure application region for applying a second pressure, as reference pressure, to the differential-pressure sensor chip; a housing that partially surrounds the differential-pressure sensor chip; the housing having a through hole, through which the first pressure application region is exposed to the outside; and the housing having an input opening, through which the second pressure application region is exposed to the outside. | 06-03-2010 |
20100139409 | Construction of a pressure sensor - A micromechanical pressure sensor includes a first diaphragm and a second diaphragm accommodated in a shared semiconductor substrate. The two diaphragms facilitate independent pressure sensing of one or more media, by the fact that a respective pressure variable is sensed by way of the deflection of the respective diaphragm. A cap above the first diaphragm defines a hollow space that is connected to the hollow space below the second diaphragm. | 06-10-2010 |
20100164027 | METHOD FOR PRODUCING A COMPONENT, AND SENSOR ELEMENT - A method for producing a component having at least one diaphragm formed in the upper surface of the component, which diaphragm spans a cavity, and having at least one access opening to the cavity from the back side of the component, at least one first diaphragm layer and the cavity being produced in a monolithic semiconductor substrate from the upper surface of the component, and the access opening being produced in a temporally limited etching step from the back side of the substrate. The access opening is placed in a region in which the substrate material comes up to the first diaphragm layer. The etching process for producing the access opening includes at least one anisotropic etching step and at least one isotropic etching step, in the anisotropic etching step, an etching channel from the back side of the substrate being produced, which terminates beneath the first diaphragm layer in the vicinity of the cavity, and at least the end region of this etching channel being expanded in the isotropic etching step until the etching channel is connected to the cavity. | 07-01-2010 |
20100267183 | METHOD FOR MANUFACTURING CAPPED MEMS COMPONENTS - A simple and economical method for manufacturing very thin capped MEMS components. In the method, a large number of MEMS units are produced on a component wafer. A capping wafer is then mounted on the component wafer, so that each MEMS unit is provided with a capping structure. Finally, the MEMS units capped in this way are separated to form MEMS components. A diaphragm layer is formed in a surface of the capping wafer by using a surface micromechanical method to produce at least one cavern underneath the diaphragm layer, support points being formed that connect the diaphragm layer to the substrate underneath the cavern. The capping wafer structured in this way is mounted on the component wafer in flip chip technology, so that the MEMS units of the component wafer are capped by the diaphragm layer. The support points are then cut through in order to remove the substrate. | 10-21-2010 |
20100283147 | METHOD FOR PRODUCING A PLURALITY OF CHIPS AND A CHIP PRODUCED ACCORDINGLY - A production method for chips, in which as many method steps as possible are carried out in the wafer composite, that is, in parallel for a plurality of chips disposed on a wafer. This is a method for producing a plurality of chips whose functionality is implemented on the basis of the surface layer of a substrate. In this method, the surface layer is patterned and at least one cavity is produced below the surface layer, so that the individual chip regions are connected to each other and/or to the rest of the substrate by suspension webs only, and/or so that the individual chip regions are connected to the substrate layer below the cavity via supporting elements in the region of the cavity. The suspension webs and/or supporting elements are cut when the chips are separated. The patterned and undercut surface layer of the substrate is embedded in a plastic mass before the chips are separated. | 11-11-2010 |
20110002359 | SENSOR AND METHOD FOR PRODUCING THE SAME - A sensor, in particular for the spatially resolved detection, includes a substrate, at least one micropatterned sensor element having an electric characteristic whose value varies as a function of the temperature, and at least one diaphragm above a cavity, the sensor element being disposed on the underside of the at least one diaphragm, and the sensor element being contacted via connecting lines, which extend within, on top of or underneath the diaphragm. In particular, a plurality of sensor elements may be formed as diode pixels within a monocrystalline layer formed by epitaxy. Suspension springs, which accommodate the individual sensor elements in elastic and insulating fashion, may be formed within the diaphragm. | 01-06-2011 |
20110072906 | SENSOR SYSTEM AND METHOD FOR MANUFACTURING A SENSOR SYSTEM - A sensor system, in particular a pressure sensor system, having a substrate having a main extension plane, the substrate having at least one trench on a first side, and the trench being provided to produce a diaphragm area on a second side of the substrate diametrically opposite to the first side perpendicularly to the main extension plane, and a decoupling element further being integrated in the material of the diaphragm area. | 03-31-2011 |
20110073969 | SENSOR SYSTEM AND METHOD FOR MANUFACTURING SAME - An assembly and connection technology for a sensor system, including a sensor element having circuit elements integrated into the top side and a carrier for the sensor element, which is simple and robust and which does not require any further packaging measures for protecting the circuit elements and electrical terminals of the sensor elements after the isolation of the sensor elements. For this purpose, the carrier is provided with through contacts. In addition, the sensor element is installed in flip-chip technology on the carrier, so that the top side of the sensor element is at least regionally capped by the carrier and the circuit elements of the sensor element can be electrically contacted from the rear side of the carrier via the through contacts. | 03-31-2011 |
20110108932 | Micromechanical Capacitive Sensor Element - A manufacturing method for producing a micromechanical sensor element which may be produced in a monolithically integrable design and has capacitive detection of a physical quantity is described. In addition to the manufacturing method, a micromechanical device containing such. a sensor element, e.g., a pressure sensor or an acceleration sensor, is described. | 05-12-2011 |
20110115095 | METHOD FOR MANUFACTURING A PLURALITY OF THIN CHIPS AND CORRESPONDINGLY MANUFACTURED THIN CHIP - In a method is for producing through contacts in thin chips, whose functionality is implemented in a layer structure starting from the surface layer of a semiconductor substrate, to separate these chips, the surface layer is structured using the layer structure and at least one cavity is produced below the surface layer, so that the individual chips are defined by trenches opening into the cavity and the individual chips are connected via support elements in the area of the cavity to the substrate below the cavity. The chips are provided with through contacts, in that firstly a contact hole, which extends through the entire layer structure of the chip and opens into a support element, is produced for each through contact. At least one dielectric layer is applied to the thus structured layer structure and in particular to the wall of the contact holes and structured in accordance with the electrical connections to be created between areas of the chip surface and at least one through contact. A metal plating, which extends in particular to the wall of the contact holes and the surface areas of the layer structure which adjoin the contact holes, is applied thereon and structured. Finally, the contact holes which are thus metal-plated are also filled using a solder. | 05-19-2011 |
20110147862 | MICROMECHANICAL COMPONENT HAVING AN INCLINED STRUCTURE AND CORRESPONDING MANUFACTURING METHOD - In a micromechanical component having an inclined structure and a corresponding manufacturing method, the component includes a substrate having a surface; a first anchor, which is provided on the surface of the substrate and which extends away from the substrate; and at least one cantilever, which is provided on a lateral surface of the anchor, and which points at an inclination away from the anchor. | 06-23-2011 |
20110147864 | Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate - A method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate includes: n-doping at least one contiguous lattice-type area of a p-doped silicon substrate surface; porously etching a substrate area beneath the n-doped lattice structure; producing a cavity in this substrate area beneath the n-doped lattice structure; growing a first monocrystalline silicon epitaxial layer on the n-doped lattice structure; at least one opening in the n-doped lattice structure being dimensioned in such a way that it is not closed by the growing first epitaxial layer but instead forms an access opening to the cavity; an oxide layer being created on the cavity wall; a rear access to the cavity being created, the oxide layer on the cavity wall acting as an etch stop layer; and the oxide layer being removed in the area of the cavity. | 06-23-2011 |
20110151620 | METHOD FOR MANUFACTURING CHIPS - A method for manufacturing chips ( | 06-23-2011 |
20110163396 | Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component - The present invention relates to a manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component. The method has the following steps: providing a first composite (W | 07-07-2011 |
20110169107 | Method for manufacturing a component, method for manufacturing a component system, component, and component system - A process for manufacturing a component is described. In a first manufacturing step a base structure having a substrate, a diaphragm, and a cavern region is provided. The diaphragm is oriented substantially parallel to a main plane of extension of the substrate. The cavern region is situated between the substrate and the diaphragm, and has an access opening. In a second manufacturing step, a first conductive layer is provided at least partially in the cavern region, in particular on a second side of the diaphragm facing the substrate, perpendicularly to the main plane of extension. | 07-14-2011 |
20110209555 | Micromechanical pressure-sensor element and method for its production - A very robust sensor element for an absolute-pressure measurement is described, which is suitable for high temperatures and able to be miniaturized to a large extent. The micromechanical pressure-sensor element includes a sensor diaphragm having a rear-side pressure connection and at least one dielectrically insulated piezo resistor for signal acquisition. Furthermore, the pressure-sensor element has a front-side reference volume, which is sealed by a cap structure spanning the sensor diaphragm. The cap structure is realized as thin-film structure. | 09-01-2011 |
20110220471 | Micromechanical component and method for manufacturing a micromechanical component - A micromechanical component, e.g., a switch, includes a substrate having at least one recess, at least two electrically conductive contact surfaces provided in the region of the recess, and an actuator. The contact surfaces are able to be brought into contact with one another for electrical conduction with the aid of the actuator. | 09-15-2011 |
20110259109 | SENSOR SYSTEM, METHOD FOR OPERATING A SENSOR SYSTEM, AND METHOD FOR MANUFACTURING A SENSOR SYSTEM - A sensor system, e.g., a pressure sensor system, includes a substrate having at least one trench on a first side. The trench is provided for forming a first diaphragm region on a second side opposite from the first side. In addition, a second diaphragm region and a cavern are integrated into the material of the first diaphragm region. | 10-27-2011 |
20120068356 | Component having a VIA - A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap. | 03-22-2012 |
20120073379 | Sensor system for detecting high pressures - A sensor system for detecting high pressures includes a micromechanical sensor element which is situated on a support and is mounted via this support. A diaphragm is formed in the upper surface of the sensor element, the diaphragm spanning a cavern having a rear opening. The support has a passage opening and is connected to the rear side of the sensor element in such a way that the passage opening opens into the rear opening of the cavern. An annular recess is formed in the rear side of the sensor element, the annular recess being situated above the edge area of the passage opening, so that the joining surface between the sensor element and the support does not extend to the edge of the passage opening. | 03-29-2012 |
20120132925 | METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE, AND A CORRESPONDING SEMICONDUCTOR STRUCTURE - A method for manufacturing a semiconductor structure is provided which includes the following steps: a crystalline semiconductor substrate ( | 05-31-2012 |
20120248552 | Method for creating monocrystalline piezoresistors - An electrically insulating sheathing for a piezoresistor and a semiconductor material are provided such that the piezoresistor is able to be used in the high temperature range, e.g., for measurements at higher ambient temperatures than 200° C. A doped resistance area is initially laterally delineated by at least one circumferential essentially vertical trench and is undercut by etching over the entire area. An electrically insulating layer is then created on the wall of the trench and the undercut area, so that the resistance area is electrically insulated from the adjacent semiconductor material by the electrically insulating layer. | 10-04-2012 |
20130001711 | MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT, CORRESPONDING COMPOSITE COMPONENT, AND CORRESPONDING MICROMECHANICAL COMPONENT - A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component. | 01-03-2013 |
20130257420 | SENSOR, METHOD FOR PRODUCING A SENSOR AND METHOD FOR MOUNTING A SENSOR - A sensor includes a body having a sensor surface and an oblique surface. A sensor element is arranged on the sensor surface and configured to pick up a direction component of a directional measurement variable. At least one contact-making surface configured to make contact with the sensor element is arranged on the oblique surface. The oblique surface is at an angle with respect to a lattice structure of carrier material of the sensor and is oriented in a different direction than the sensor surface. | 10-03-2013 |
20140097511 | INTEGRATED DIODE ARRAY AND CORRESPONDING MANUFACTURING METHOD - An integrated diode array and a corresponding manufacturing method are provided. The integrated diode array includes a substrate having an upper side, and a plurality of blocks of several diodes, which are positioned in a planar manner and are suspended at the substrate above a cavity situated below them in the substrate. The blocks are separated from one another by respective gaps, and within a specific block, the individual diodes are electrically insulated from one another by first STI trenches situated between them. | 04-10-2014 |
20140151885 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate which has at least one doped contact area and at least one line which is formed on the substrate and which is electrically connected to the at least one contact area, and at least one diffusion barrier, which includes at least one metal applied on a contact surface of the associated contact area, being formed between the at least one line and the at least one associated contact area, the at least one metal forming multiple metal-plated subareas which contact the contact surface of the same contact area and which are separated from one another. Furthermore, a manufacturing method for a semiconductor device is described. | 06-05-2014 |
20150047430 | INTEGRATED HUMIDITY SENSOR AND METHOD FOR THE MANUFACTURE THEREOF - An integrated humidity sensor includes at least one measuring capacitor and one humidity-sensitive polymer as a dielectric that is also suited for use in a dirty, i.e., particle-laden measurement environment. The measuring capacitor of the humidity sensor is in the form of a plate capacitor in the layered structure of the sensor element, the outer of two electrodes being located at the surface of the layered structure. Disposed between the two electrodes of the measuring capacitor is a humidity-sensitive polymer layer that is in direct contact with the measurement environment via humidity-permeable paths in the outer electrode of the measuring capacitor. These humidity-permeable paths extend from the surface of sensor element to the polymer layer, and are so small in lateral extent that they do not significantly affect the electrical conductivity within the outer electrode. | 02-19-2015 |
20150059485 | MICROMECHANICAL SENSOR SYSTEM AND CORRESPONDING MANUFACTURING METHOD - A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing. | 03-05-2015 |