Lo, Hsin-Chu
Bin-Hau Lo, Hsin-Chu TW
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20120026818 | Split Bit Line Architecture Circuits and Methods for Memory Devices - Apparatus and methods for providing a high density memory array with reduced read access time are disclosed. Multiple split bit lines are arranged along columns of adjacent memory bit cells. A multiple input sense amplifier is coupled to the multiple split bit lines. The loading on the multiple split bit line is reduced, and the corresponding read speed of the memory array is enhanced over the prior art. The sense amplifier and the memory bit cells have a common cell pitch layout height so that no silicon area penalty arises due to the use of the multiple split bit lines and sense amplifiers. Increased memory array efficiency is achieved. | 02-02-2012 |
Cheng Lo, Hsin-Chu TW
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20100002159 | LIQUID CRYSTAL DISPLAY PANEL AND PIXEL STRUCTURE THEREOF - A pixel structure of a liquid crystal display panel includes a first transparent substrate, a first data line, a second data line, a transparent electrode, and a compensating conducting pattern layer. In a display region, the first side of the transparent electrode and the first data line partially overlap, forming a first parasitic capacitor, the second side of the transparent electrode and the second data line partially overlap, forming a second parasitic capacitor smaller than the first parasitic capacitor. In a non-display region, the first side of the transparent electrode and the first data line partially overlap, forming a third parasitic capacitor, and the second side of the transparent electrode and the compensating conducing pattern layer partially overlap, forming a fourth parasitic capacitor. The total parasitic capacitance of the first and the third parasitic capacitors and the total parasitic capacitance of the second and the fourth parasitic capacitors are substantially equal. | 01-07-2010 |
20100149461 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display device uses a first quarter-wave retardation film and a hybrid aligned nematic film to reduce light leakage in dark state for reaching high contrast ratio, and uses multiple-gamma IC to provide different gamma-curve signals for pixels of different colors to solve color shift problem. In addition, the liquid crystal display device may use a second quarter-wave retardation film to reduce light leakage when viewed in a wide angle so as to further provide higher contrast ratio. | 06-17-2010 |
Cheng-Yao Lo, Hsin-Chu TW
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20090176344 | MOS Devices with Corner Spacers - A MOS device having corner spacers and a method for forming the same are provided. The method includes forming a gate structure overlying a substrate, forming a first dielectric layer over the gate structure and the substrate, forming a second dielectric layer on the first dielectric layer, forming a third dielectric layer on the second dielectric layer, and etching the first, the second and the third dielectric layers using the third dielectric layer as a mask. The remaining first and second dielectric layers have an L-shape. The method further includes implanting source/drain regions, removing remaining portions of the third dielectric layer, blanket forming a fourth dielectric layer, etching the fourth dielectric layer, siliciding exposed source/drain regions, and forming a contact etch stop layer. The remaining portion of the fourth dielectric layer forms corner spacers. | 07-09-2009 |
Che-Sheng Lo, Hsin-Chu TW
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20120140765 | METHOD FOR CONTROLLING IP PHONE AND APPLICATION PROGRAM FOR THE SAME - A method for controlling an IP phone and an application program for the same are disclosed. The application program is installed in a computer for connecting the computer and a proximal IP phone via a wired or wireless network. A subscriber sends data and commands to the proximal IP phone via application programs in the computer for controlling the proximal IP phone. The computer establishes connection with a remote phone via an expanded function of the proximal IP phone controlled by the application program. | 06-07-2012 |
20120148039 | BUSY LAMP FIELD SYSTEM FOR REMOTE TELEPHONES AND METHOD FOR THE SAME - A busy lamp field (BLF) system for remote telephones and a method for the same are disclosed. The busy lamp field system for remote telephones mainly has a plurality of switchboard systems and a XML server interconnected via the internet. Each switchboard system has a PBX and at least a telephone. Each telephone is connected to the XML server via internet and periodically uploads local phone status. The BLF key of each telephone is set to associate with a corresponding specific remote telephone by a subscriber of each telephone. Each telephone periodically retrieves the phone status of the corresponding remote telephone from the XML server displayed on the BLF key of the local telephone. Thus, a subscriber monitors status of a remote telephone and dials out via each PBX in addition to extension telephone of the local switchboard system. | 06-14-2012 |
Chi-Chung Lo, Hsin-Chu TW
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20080198601 | Backlight Module and a Wire Positioning Device Thereof - A backlight module and a wire positioning/holding device for the frame structure thereof are disclosed. The backlight module mainly includes a frame and a light source module. The light source module is disposed on the lateral side or on the bottom of the frame. The wire holding device mainly includes a main body and a winding pillar. A first guide slot is disposed on the main body, and the first guide slot has an inlet end and an outlet end. The winding pillar extends from the main body and is situated at one side of the first guide slot. The winding pillar and the main body together form a wire holding portion. The wire holding portion is disposed corresponding to the outlet end of the first guide slot to receive the wires of the light source module coming out of the outlet end. Moreover, the wire holding portion and the outlet end of the first guide slot are situated on opposite sides of the winding pillar. | 08-21-2008 |
20120140512 | Backlight Module and a Wire Positioning Device Thereof - A backlight module and a wire positioning/holding device for the frame structure thereof are disclosed. The backlight module mainly includes a frame and a light source module. The light source module is disposed on the lateral side or on the bottom of the frame. The wire holding device mainly includes a main body and a winding pillar. A first guide slot is disposed on the main body, and the first guide slot has an inlet end and an outlet end. The winding pillar extends from the main body and is situated at one side of the first guide slot. The winding pillar and the main body together form a wire holding portion. The wire holding portion is disposed corresponding to the outlet end of the first guide slot to receive the wires of the light source module coming out of the outlet end. | 06-07-2012 |
Chi-Jang Lo, Hsin-Chu TW
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20130020686 | PACKAGE STRUCTURE AND PACKAGE PROCESS - A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided. | 01-24-2013 |
20140183591 | OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME - An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip. | 07-03-2014 |
20140315354 | PACKAGE PROCESS - A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided. | 10-23-2014 |
Chi-Ming Lo, Hsin-Chu TW
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20100283402 | BACKLIGHT MODULE FOR LCD DEVICE - A backlight module includes a connector capable of performing voltage conversion or a voltage converter capable of transmitting signals. The connector or the voltage converter, disposed between an inverter and a lamp set, receives low-voltage signals generated by the inverter, performs voltage conversion, and outputs high-voltage signals for driving the lamp set. | 11-11-2010 |
Ching-Kai Lo, Hsin-Chu TW
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20140307430 | TRANSPARENT DISPLAY DEVICE AND TRANSPARENT DISPLAY PANEL - A transparent display device includes at least a first transparent display panel and a second transparent display panel, each of which has transparent regions and display regions. The arrangements of the transparent regions and display regions of the first transparent display panel and the second transparent display panel are opposite to each other. The transparent display device can apply a high transparency display mode or a lower transparency display mode by arranging the relative position of the first and second transparent display panels. In the lower transparency display mode, the first and second transparent display panels are at least partial overlapped with each other so as to display clear image with high definition. | 10-16-2014 |
Ching-Yu Lo, Hsin-Chu TW
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20110006428 | Liner Formation in 3DIC Structures - An integrated circuit structure includes a semiconductor substrate; a through-semiconductor via (TSV) opening extending into the semiconductor substrate; and a TSV liner in the TSV opening. The TSV liner includes a sidewall portion on a sidewall of the TSV opening and a bottom portion at a bottom of the TSV opening. The bottom portion of the TSV liner has a bottom height greater than a middle thickness of the sidewall portion of the TSV liner. | 01-13-2011 |
20120289062 | Liner Formation in 3DIC Structures - An integrated circuit structure includes a semiconductor substrate; a through-semiconductor via (TSV) opening extending into the semiconductor substrate; and a TSV liner in the TSV opening. The TSV liner includes a sidewall portion on a sidewall of the TSV opening and a bottom portion at a bottom of the TSV opening. The bottom portion of the TSV liner has a bottom height greater than a middle thickness of the sidewall portion of the TSV liner. | 11-15-2012 |
Chun-Yen Lo, Hsin-Chu TW
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20080251916 | UBM structure for strengthening solder bumps - A novel UBM structure for improving the strength and performance of individual UBM layers in a UBM structure is disclosed. In one aspect, a UBM structure for disposal onto an electrically conductive element comprised of aluminum is disclosed. In one embodiment, the UBM structure comprises a tantalum layer disposed over the aluminum electrically conductive element, and a copper layer disposed over the tantalum layer, where the UBM structure is configured to receive a solder ball thereon. | 10-16-2008 |
Cp Lo, Hsin-Chu TW
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20100151639 | METHOD FOR MAKING A THERMALLY-STABLE SILICIDE - Provided is a method of fabrication a semiconductor device that includes providing a semiconductor substrate, forming a gate structure over the substrate, the gate structure including a gate dielectric and a gate electrode disposed over the gate dielectric, forming source/drain regions in the semiconductor substrate at either side of the gate structure, forming a metal layer over the semiconductor substrate and the gate structure, the metal layer including a refractory metal layer or a refractory metal compound layer; forming an alloy layer over the metal layer; and performing an annealing thereby forming metal alloy silicides over the gate structure and the source/drain regions, respectively. | 06-17-2010 |
Dar-Win Lo, Hsin-Chu TW
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20130025915 | ARESISTIVE DEVICE WITH FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed. | 01-31-2013 |
Hsiao Yun Lo, Hsin-Chu TW
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20150054174 | Interconnection Structure with Confinement Layer - An interconnection structure and method disclosed for providing an interconnection structure that includes conductive features having reduced topographic variations. The interconnection structure includes a contact pad disposed over a substrate. The contact pad includes a first layer of a first conductive material and a second layer of a second conductive material over the first layer. The first conductive material and the second conductive material are made of substantially the same material and have a first average grain size and a second average grain size that is smaller than the first average grain size. The interconnection structure also includes a passivation layer covering the substrate and the contact pad, and the passivation layer has an opening exposing the contact pad. | 02-26-2015 |
20150206846 | Interconnect Structure and Method of Forming Same - An apparatus comprises a dielectric layer formed on a first side of a substrate, a first side interconnect structure comprising a first metal line and a pad formed in the dielectric layer, wherein the pad comprises a bottom portion formed of a first conductive metal and an upper portion formed of a second conductive metal, and wherein sidewalls of the upper portion are surrounded by the bottom portion and a top surface of the pad is coplanar with a top surface of the first metal line and a passivation layer formed over the dielectric layer, wherein the first metal line is embedded in the passivation layer. | 07-23-2015 |
Hung Chuan Lo, Hsin-Chu TW
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20110316907 | INKJET PRINTING SYSTEM - An inkjet printing system comprises: a liquid supply tank; a print device with at least one print cartridge, wherein there is an altitude difference between the print cartridge and the liquid supply tank; an internal pressure-adjusting device connecting to the liquid supply tank and the print cartridge; and working software for calculating a preliminary altitude, and a predetermined liquid supplementing altitude of the print cartridge. When a liquid level of a liquid inside the print cartridge is lower than the preliminary altitude and below an lower limit of the predetermined liquid supplementing altitude, the working software controls the internal pressure-adjusting device to suck partial gas from the print cartridge into the liquid supply tank to increase a negative pressure inside the print cartridge, and the liquid stored in the liquid supply tank is introduced into the print cartridge to balance the negative pressure inside the print cartridge. | 12-29-2011 |
20120182342 | HIGH-SPEED PAGE WIDE MULTIPLE-PASS PRINTING METHOD AND A PRINTING DEVICE ADAPTIVE TO THE HIGH-SPEED PAGE WIDE MULTIPLE-PASS PRINTING METHOD - The present invention relates to a high-speed page wide multiple-pass printing method, comprising the steps of: (a) providing a printing device and a medium, wherein the printing device comprises a control unit, a printing module and a storing module; (b) the control unit receiving and grouping the data into an odd-number group and an even-number group, then storing the grouped data in the storing module and transmitting a printing order; (c) the printing module receiving the printing order, extracting the data grouped into the odd-number group, and executing a first ink-jet printing operation to a printing region of the medium; (d) the printing module extracting the data grouped into the even-number group and executing a second ink-jet printing operation to the printing region; and (e) the printing module completing the second ink-jet printing operation for forming a complete printing image on the medium. | 07-19-2012 |
Jih-Shun Lo, Hsin-Chu TW
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20090310234 | Calibrating Apparatus, Calibrating Method and Moving Method for Lens Carrier - A calibrating apparatus for lens carrier, includes a carrier, a driving unit, a first-dimension detector, and a control unit. The driving unit is capable of moving the carrier in a first-dimension direction. The first-dimension detector is capable of generating a corresponding first-dimension positional signal for the carrier according to a condition of whether detecting the carrier. The control unit is capable of receiving the first-dimension positional signal. The control unit determines whether the driving unit performing a first-predetermined driving operation based on the first-dimension positional signal for the carrier received when starting to calibrate. Finally, a position of the carrier in the first-dimension direction is adjusted based on the first-dimension positional signal for the carrier received after performing the first-predetermined driving operation. | 12-17-2009 |
Jui-Chi Lo, Hsin-Chu TW
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20120113070 | GATE DRIVER CIRCUIT AND ARRANGEMENT METHOD OF THE SAME - An arrangement method, applied to a plurality of gate driver modules coupled in series and arranged on two sides of a panel, includes steps of: placing a first gate driver module on a first side of the panel; placing a gate driver set on a second side of the panel; and placing a fourth gate driver module on the first side of the panel. The gate driver set includes a second gate driver module and a third gate driver module serially connected. The output terminal of the first gate driver module is electrically coupled to the second gate driver module and the output terminal of the third gate driver module is electrically coupled to the fourth gate driver module. A gate driver circuit and an arrangement method applied to a plurality of shift register sets coupled in series and arranged on two sides of a panel are also disclosed. | 05-10-2012 |
20120133392 | MULTIPLEX GATE DRIVING CIRCUIT - A multiplex gate driving circuit includes plural driving modules. In comparison with the prior art, each driving stage of the driving module has less number of transistors. From the first to the seventh example, each driving stage is implemented by only four transistors. In the eighth example and the ninth example, each driving stage is implemented by only two transistors. In other words, the driving stage of the multiplex gate driving circuit has less number of transistors, thereby reducing the layout area of the invisible zone of the LCD panel. | 05-31-2012 |
Kuan Teng Lo, Hsin-Chu TW
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20150241876 | Clustering for Prediction Models in Process Control and for Optimal Dispatching - A first embodiment is a method for semiconductor process control comprising clustering processing tools of a processing stage into a tool cluster based on processing data and forming a prediction model for processing a semiconductor wafer based on the tool cluster. A second embodiment is a method for semiconductor process control comprising providing cluster routes between first stage tool clusters and second stage tool clusters, assigning a comparative optimization ranking to each cluster route, and scheduling processing of wafers. The comparative optimization ranking identifies comparatively which cluster routes provide for high wafer processing uniformity. Further, wafers that require high wafer processing uniformity are scheduled to be processed along one cluster route that has a high comparative optimization ranking that identifies the one cluster route to have a highest wafer processing uniformity, and wafers that do not require high wafer processing uniformity are scheduled to be processed along another cluster route. | 08-27-2015 |
Shih-Hsun Lo, Hsin-Chu TW
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20120105512 | METHOD FOR CONTROLLING GATE SIGNALS AND DEVICE THEREOF - A method for controlling gate signals of a liquid crystal display (LCD), including generating gate signal with a modulated pulse width according to the gate signal with a default pulse width; when the LCD is booting up, outputting the gate signal with the modulated pulse width; and when a backlight module of the LCD is turned on, switching the gate signal with the modulated pulse width to the gate signal with the default pulse width. This way, the pulse width of the gate signal is increased after the LCD is boot up and before the backlight module is turned on, enabling the LCD to be boot properly in low temperature, without the need to raise the voltage level of the gate signal. | 05-03-2012 |
20120162278 | DISPLAY PANEL - An exemplary display panel includes a plurality of monochrome pixels, a plurality of data lines and a plurality of control lines. Each monochrome pixel provides a specific color on the display panel. The data lines are electrically coupled to the monochrome pixels for providing the display data. The data lines includes a first data line electrically coupled to a part of the monochrome pixels, and the specific colors provided by the part of the monochrome pixels are of the same color. Besides, each of the control lines is electrically coupled to a part of the monochrome pixels for controlling the part of the monochrome pixels electrically coupled thereto whether to receive the display data from the data lines. | 06-28-2012 |
Su Lo, Hsin-Chu TW
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20110235364 | Panel Display Module and Manufacturing Method Thereof - A panel display module and a manufacture method thereof are disclosed. The panel display includes a backlight module, a display panel, a clear cover, and reinforced glue. The backlight module has a light source module and a frame that positions the light source module and other elements to provide structural protection. The display panel is disposed on the light exiting side of the light source module. The clear cover is disposed on one side of the display panel opposite to the light source module. The reinforced glue is distributed encircling the frame and adheres respectively to the frame and to the portion of the clear cover protruding over the display panel. The reinforced glue has a first side adhering onto the frame and a second side adhering onto the clear cover. | 09-29-2011 |
20120070607 | IMPACT-RESISTIVE DISPLAY DEVICE - A display device includes a display panel, a polarizing sheet, a transparent adhesive layer and a transparent protective layer. The polarizing sheet is attached onto a surface of the display panel and has a cut corner. The transparent adhesive layer covers a surface of the polarizing sheet distal from the display panel. The transparent protective layer is attached to the polarizing sheet through the transparent adhesive layer and completely covers the polarizing sheet. Area of the polarizing sheet is smaller than that of the transparent protective plate. | 03-22-2012 |
20130300973 | DISPLAY MODULE - A display module, which includes a display panel, a backlight unit and a bezel. The backlight unit is disposed opposite to the display panel. The bezel includes a bottom, a plurality of sidewalls and a plurality of extension structures. The bottom is configured to support the backlight unit. These sidewalls are configured to corporately enclose the display panel and the backlight unit, and each sidewall has a first end and a second end opposite to each other; wherein the first end is connected to the bottom. The extension structures each extend from the second end of the respective sidewall and include a supporting portion, disposed between the backlight unit and the display panel and opposite to the bottom, configured to support the display panel. | 11-14-2013 |
Sut-I Lo, Hsin-Chu TW
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20140021583 | PACKAGE STRUCTURES INCLUDING A CAPACITOR AND METHODS OF FORMING THE SAME - A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side. | 01-23-2014 |
20140127866 | Package Structures Including a Capacitor and Methods of Forming the Same - A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side. | 05-08-2014 |
Su-Wu Lo, Hsin-Chu TW
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20140181492 | METHOD OF BOOTING AN ELECTRONIC SYSTEM AND AN ELECTRONIC SYSTEM APPLYING THE SAME - In a method of booting an electronic system, a processor generates a booting request signal in response to an external control signal, and a memory controller enables the processor to read and execute a first boot program stored in a first memory in response to the booting request signal. The processor generates a booting success signal when booting using the first boot program is successful. The memory controller enables the processor to change, from reading and executing the first boot program stored in the first memory to reading and executing a second boot program stored in a second memory for booting of the electronic system, according to at least one of the booting request signal and the booting success signal. | 06-26-2014 |
Sylvia Lo, Hsin-Chu TW
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20130285244 | Through Silicon Via with Embedded Barrier Pad - A system and method are disclosed for providing a through silicon via (TSV) with a barrier pad deposited below the top surface of the TSV, the top surface having reduced topographic variations. A bottom TSV pad is deposited into a via and then polished so the top surface is below the substrate top surface. A barrier pad is then deposited in the via, and a top TSV pad deposited on the barrier pad. The top TSV barrier pad is polished to bring the top surface of the top TSV pad about level with the substrate. The barrier pad may be less than about 1 microns thick, and the top TSV pad may be less than about 6 microns thick. The barrier pad may be a dissimilar metal from the top and bottom TSV pads, and may be selected from a group comprising titanium, tantalum, cobalt, nickel and the like. | 10-31-2013 |
20140287581 | Through Silicon Via with Embedded Barrier Pad - A system and method are disclosed for providing a through silicon via (TSV) with a barrier pad deposited below the top surface of the TSV, the top surface having reduced topographic variations. A bottom TSV pad is deposited into a via and then polished so the top surface is below the substrate top surface. A barrier pad is then deposited in the via, and a top TSV pad deposited on the barrier pad. The top TSV barrier pad is polished to bring the top surface of the top TSV pad about level with the substrate. The barrier pad may be less than about 1 microns thick, and the top TSV pad may be less than about 6 microns thick. The barrier pad may be a dissimilar metal from the top and bottom TSV pads, and may be selected from a group comprising titanium, tantalum, cobalt, nickel and the like. | 09-25-2014 |
Te-Hen Lo, Hsin-Chu TW
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20110007523 | Backlight Module - This present invention discloses a backlight module including a frame and a light guide plate. The frame includes a base plane and a side wall, wherein the side wall is disposed at the edge of the base plane and encloses a disposition space. The side wall includes a first inner surface and an outer surface, wherein a distance between the first inner surface and the outer surface is decreased as the first inner surface comes closer to a bottom of the side wall. The light guide plate is disposed on the base plane and within the disposition space, wherein the first inner surface sinks toward the outer surface and a recessed space is formed between the first inner surface and a lateral side of the light guide plate. | 01-13-2011 |
20130120993 | Circuit Board Circuit Apparatus and Light Source Apparatus - A circuit board circuit apparatus and a light source apparatus including a substrate, a circuit layer, and at least one electronic component are disclosed. The circuit layer is formed on a surface of the substrate. The circuit layer includes a first circuit and a second circuit which are coplanar-disposed. The at least one electronic component is disposed on the circuit layer and connected with the circuit layer. Each electronic component has a first contact and a second contact. At least a part of the second circuit is disposed between the at least one electronic component and the first circuit. The at least one electronic component crosses over the second circuit, so that the second circuit penetrates through the bottom of the electronic component between the first contact and the second contact. | 05-16-2013 |
20130127743 | DISPLAY APPARATUS - A display apparatus includes a panel module, an assembly member, a glue layer, and a touch module. The assembly member is engaged with a sidewall of the panel module. The glue layer is disposed on the panel module and at least one portion of the glue layer is disposed on the assembly member. The touch module is disposed on the glue layer. The panel module and the assembly member are adhered to a first side of the glue layer. The touch module is adhered to a second side of the glue layer opposite to the first side. | 05-23-2013 |
20130128619 | Backlight Module and Light Source Module Thereof - A backlight module and a light source module thereof are disclosed. The light source module includes a substrate, at least one first light source, and at least one second light source. The substrate includes a first substrate portion and a second substrate portion. The first substrate portion extends along a length direction, and the second substrate portion bends an acute angle corresponding to an extending surface of the first substrate portion. The at least one first light source and the at least one second light source are disposed on the first substrate portion and the second substrate portion respectively. The acute angle is existed between the light-emitting directions of the first light source and the second light source, and the light-emitting directions are parallel to the first substrate portion. | 05-23-2013 |
20130155654 | DISPLAY DEVICE AND RESILIENT FRAME THEREOF - A display device includes a display module and a frame. The frame is made of a resilient material. The frame includes a sidewall, a first securing portion and a second securing portion. The first securing portion extends from a top end of the sidewall. The second securing portion extends from a bottom end of the sidewall, and the second securing portion is opposite to the first securing portion. A containing space enclosed by the first securing portion, the second securing portion and the sidewall is configured to contain sides of the display module. The frame secures the display module through resilience of the resilient material. | 06-20-2013 |
20130170213 | LIGHT-EMITTING DIODE MODULE - An LED module includes a single-sided circuit board, a plurality of LED strings and signal wires. The single-sided circuit board has a surface defined with a first and second areas. A long edge of the surface has a wiring outlet located at a position corresponding to a boundary of the first and second areas. The LED strings are divided into a first and second groups disposed in the first and second areas, respectively. The signal wires each are disposed on the surface and routed to have its one end joined to the wiring outlet, and its another end electrically connected to a first end of one LED string or a second end of one LED string. In addition, some signal wires each are further routed to have a segment thereof passed through a gap formed between the two groups of LED strings. | 07-04-2013 |
Ting-Fang Lo, Hsin-Chu TW
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20100177031 | Flat Panel Display and its Combinative Outer Frame - A combinative outer frame for a flat panel display (FPD) and a FPD and a manufacturing method of the FPD are provided. The outer frame for the FPD includes a front frame, a support frame, and an elastic pad. The support frame is disposed opposite to the front frame and includes a ridge which protrudes upon it; two sides of the elastic pad are joined to the front frame and the support frame respectively so that the ridge is pressed into it. This design causes tighter joining between different components of a frame, so as to prevent dust from invading FPD modules. | 07-15-2010 |
Tseng Chin Lo, Hsin-Chu TW
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20090181314 | Reverse Dummy Insertion Algorithm - A method of inserting dummy patterns includes providing a window area comprising a main pattern. The main pattern includes first patterns of a first type of features, and second patterns of a second type of features. The first and the second types are different types. The method further includes globally inserting first dummy patterns throughout the window area, wherein the first dummy patterns are dummy patterns of the first type of features; enlarging the main pattern to generate an enlarged main pattern, wherein the enlarged main pattern occupies an enlarged region of the window area; removing the portion of the first dummy patterns in the enlarged region from the first dummy patterns to generate first inversed dummy patterns; and combining the first patterns in the main pattern with the first inversed dummy patterns to generate first mask patterns for the first type of features. | 07-16-2009 |
20100045325 | Test Pad Design for Reducing the Effect of Contact Resistances - An integrated circuit structure includes a semiconductor wafer; integrated circuit devices in the semiconductor wafer; and a plurality of test pads on a top surface of the semiconductor wafer and connected to the integrated circuit devices. Test pads are grouped in pairs, with the test pads in a same pair are interconnected. | 02-25-2010 |
Wan-Yu Lo, Hsin-Chu TW
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20110122052 | DISPLAY DEVICE - A display device includes a plurality of gate lines, data lines, first external gate tracking lines, and second external gate tracking lines. The first external gate tracking lines are substantially disposed in a border region of a substrate, and electrically connected with corresponding gate lines. The second external gate tracking lines are substantially disposed in the border region of the substrate, and electrically connected with corresponding gate lines. One of the first external gate tracking lines and a corresponding second external gate tracking line at least partially overlap with each other. | 05-26-2011 |
Wei-Hung Lo, Hsin-Chu TW
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20130094243 | Sheetless Backlight Module, A Light Guide Plate for the Sheetless Backlight and Manufacturing Method Thereof - A sheetless backlight module and a light guide plate thereof are provided. The light guide plate includes a body and a plurality of light scattering units. The body has a bottom and a plurality of microstructures formed on the bottom and recessed in the body from the bottom. The pluralities of light scattering units are disposed in a plurality of spaces formed due to the plurality of microstructures recessed in the body. A manufacturing method of the light guide plate mentioned above includes forming the plurality of microstructures on the bottom of the body; preparing a fluid solution containing at least a diffusive reflective material; distributing the fluid solution on the bottom; driving the fluid solution to flow into the microstructures; removing the part of the fluid solution outside the microstructures; and solidifying the fluid solution to form the plurality of light scattering units. | 04-18-2013 |
Wei-Jen Lo, Hsin-Chu TW
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20140213153 | Wafer Polishing Tool Using Abrasive Tape - An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process. | 07-31-2014 |
Wen-Bin Lo, Hsin-Chu TW
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20120162181 | DISPLAY PANEL, PIXEL CIRCUIT AND DRIVING METHOD OF DIFFERENTIAL VOLTAGE DRIVEN DEVICE THEREIN - A display panel, a pixel circuit and a driving method of a differential voltage driving device are disclosed. The driving method includes: respectively supplying an alternating common voltage in a first polarity and a first display data in a second polarity to two terminals of the differential voltage driven device in a first frame; disconnecting the differential voltage driven device from the alternating common voltage, thereby keeping one terminal of the differential voltage driving device at the first polarity of the alternating common voltage; converting the alternating common voltage to the second polarity in a second frame which is consecutive to the first frame; and respectively supplying the alternating common voltage in the second polarity and a second display data in the first polarity to the two terminals of the differential voltage driving device in the second frame, here the first polarity is inverse to the second polarity. | 06-28-2012 |
20130050618 | PIXEL STRUCTURE, LIQUID CRYSTAL DISPLAY PANEL AND TRANSPARENT LIQUID CRYSTAL DISPLAY DEVICE - A pixel structure, which may be used in a liquid crystal display panel, includes a plurality of display pixel units and a plurality of control devices. Each of the display pixel units includes a first sub-pixel adapted to provide a first color, a second sub-pixel adapted to provide a second color, a third sub-pixel adapted to provide a third color, a first white sub-pixel, a second white sub-pixel, and a third white sub-pixel. Each of the control devices is employed for respectively controlling each of the sub-pixels. The liquid crystal display panel is normally white when the first sub-pixel, the second sub-pixel, the third sub-pixel, the first white sub-pixel, the second white sub-pixel, and the third white sub-pixel are not driven by the control devices. | 02-28-2013 |
Wen-Chin Lo, Hsin-Chu TW
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20090273729 | Polarizing plate, manufacturing method thereof and display device using the same - A polarizing plate, a manufacturing method thereof and a display device using the same are provided. The polarizing plate comprises a brightness-enhancement film, a diffuser layer and a polarizing film. The diffuser layer is formed on one surface of the brightness-enhancement film, and the polarizing film is disposed on another surface of the brightness-enhancement film. | 11-05-2009 |
20140004652 | METHOD OF FABRICATING SOLAR CELL | 01-02-2014 |
Wen-Hsin Lo, Hsin-Chu TW
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20130286679 | LIGHT GUIDE PLATE AND BACKLIGHT MODULE USING THE SAME - A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface. | 10-31-2013 |
Wen-Kuo Lo, Hsin-Chu TW
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20120044617 | PANEL MODULE WITH SIMPLIFIED SUPPORTING STRUCTURE AND PORTABLE ELECTRONIC APPARATUS THEREWITH - A panel module with simplified supporting structure and a portable electronic apparatus with the panel module are disclosed. The portable electronic apparatus includes a casing where the panel module is disposed. The panel module includes a frame and a bracket. The frame includes a reverse U-shaped passage. A display panel is fixed on the frame. The bracket includes a reverse U-shaped body and a plurality of fixing parts connected to the reverse U-shaped body. The reverse U-shaped body is accommodated in the reverse U-shaped passage. The fixing parts protrude out of the frame. The panel module is fixed on the casing by the fixing parts. Therefore, the invention uses the bracket with the reverse U-shaped structure to directly provide required fixedness and structure rigidity for the frame, so that an additional metal frame in the prior art for fixing a display panel together with a plastic frame can be omitted. | 02-23-2012 |
20130021727 | Display and Frame Structure Thereof - A display and a frame structure thereof are disclosed. The frame structure includes a first sidewall, at least one first convex, and at least one second convex. The first sidewall includes at least one first wall section and at least one second wall section. The first wall section and the second wall section are closely distributed along an extension direction of the first sidewall. The at least one first convex protrudes on a part of an inner surface of the first wall section. The at least one second convex protrudes on a part of an inner surface of the second wall section. A protruding position of the first convex is closer to a wall foot of the first sidewall than a protruding position of the second convex. | 01-24-2013 |
Wen-Ting Lo, Hsin-Chu TW
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20120206932 | WEAVE UNIT WITH UNIFORM ILLUMINATION AND MANUFACTURING METHOD THEREOF - A weave unit includes a plurality of opaque wires; a plurality of transparent wires alternatively weaved with the opaque wires to form a weave structure, wherein a plurality of interweave points is defined on the crossing portions of the opaque wires and the transparent wires; a lighting module disposed on one side of the transparent wires; wherein the density of the interweave point on each of the transparent wires increases in the direction of being away from the lighting module; thereby, the light of the lighting module transmits inside the transparent wires for generating uniform illumination. | 08-16-2012 |