Patent application number | Description | Published |
20110000378 | DISPOSABLE BREW BASKET FOR ELECTRIC COFFEE MAKER - An apparatus for use in a beverage brewing machine includes a filter pack containing an amount of grinds to brew approximately only a single serving of brewed beverage, a single serving disposable brew basket including a body defining a brewing reservoir. The body is formed with a disposable rigid construction. The body has an opening therethrough to permit a brewed beverage to flow from the brewing reservoir of the disposable brew basket into a beverage container. The body extends upwardly from a bottom of the brewing reservoir to an open top that is configured to receive heated water from the brewing machine. The heated water flows through the open top during a brewing operation. The brewing reservoir has a size dimensioned appropriate to make approximately only a single serving of beverage during a single brewing operation. The brewing area is sufficiently large to hold the filter pack and the heated water while brewing without a level of the heated water rising above and overflowing the open top. | 01-06-2011 |
20120040064 | DISPOSABLE BREW BASKET FOR ELECTRIC COFFEE MAKER - A method comprises the steps of: providing an electric coffee brewing machine; providing a single-use, disposable brew basket, inserting the disposable brew basket into the electric coffee brewing machine; brewing a single cup of coffee with the electric coffee brewing machine; and discarding the disposable brew basket after the single cup of coffee has been brewed. The electric coffee brewing machine has a cold water reservoir, an electric heating element for heating the water, and a basket receiving recess. The disposable brew basket has a bottom wall and at least one side wall extending generally upwardly from the bottom wall to define a brewing reservoir for receiving heated water from the electric coffee brewing machine. The bottom wall of the basket has at least one port located in a central portion thereof to permit brewed coffee to flow from the disposable brew basket. The disposable brew basket is inserted into the basket receiving recess of the electric coffee brewing machine before brewing. | 02-16-2012 |
20140290030 | METHOD OF SUPPLYING DISPOSABLE BREW BASKETS TO A BEVERAGE DISPENSER - A method comprises the steps of: providing an electric coffee brewing machine; providing a single-use, disposable brew basket, inserting the disposable brew basket into the electric coffee brewing machine; brewing a single cup of coffee with the electric coffee brewing machine; and discarding the disposable brew basket after the single cup of coffee has been brewed. The electric coffee brewing machine has a cold water reservoir, an electric heating element for heating the water, and a basket receiving recess. The disposable brew basket has a bottom wall and at least one side wall extending generally upwardly from the bottom wall to define a brewing reservoir for receiving heated water from the electric coffee brewing machine. The bottom wall of the basket has at least one port located in a central portion thereof to permit brewed coffee to flow from the disposable brew basket. The disposable brew basket is inserted into the basket receiving recess of the electric coffee brewing machine before brewing. | 10-02-2014 |
Patent application number | Description | Published |
20090242126 | EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER - The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer. | 10-01-2009 |
20090246444 | EDGE ETCHED SILICON WAFERS - The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer. | 10-01-2009 |
20090247055 | METHODS FOR ETCHING THE EDGE OF A SILICON WAFER - The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer. | 10-01-2009 |
20090298399 | SEMICONDUCTOR WAFER POLISHING APPARATUS AND METHOD OF POLISHING - A wafer polishing apparatus has a base and a turntable having a polishing pad thereon and mounted on the base for rotation of the turntable and polishing pad relative to the base about an axis perpendicular to the turntable and polishing pad. The polishing pad includes a work surface engageable with a front surface of a wafer for polishing the front surface of the wafer. A drive mechanism is mounted on the base for imparting rotational motion about an axis substantially parallel to the axis of the turntable. A polishing head is connected to the drive mechanism for driving rotation of the polishing head. The polishing head has a pressure plate adapted to hold the wafer for engaging the front surface of the wafer with the work surface of the polishing pad. The pressure plate has a generally planar position and is selectively movable from the planar position to a convex position and to a concave position. | 12-03-2009 |
20120028555 | Grinding Tool For Trapezoid Grinding Of A Wafer - A grinding tool for trapezoid grinding of a wafer on a profiling machine includes an annular wheel including a central hole adapted for mounting the wheel on a spindle. The wheel includes at least two grooves disposed at an outer edge of the wheel and the grooves are sized for receiving an outer edge of the wafer. At least one of the grooves is adapted for rough grinding of the wafer. At least one other of the grooves is adapted for fine grinding of the wafer. | 02-02-2012 |
20130087132 | Systems and Methods For Connecting An Ingot To A Wire Saw - Systems and methods are disclosed for connecting an ingot to a wire saw with an ingot holder, a bond beam, and a bar. The bar has an angled mating surface that engages a recessed surface formed in a slot of the bond beam. Mechanical fasteners are used to connect the tee bar to the ingot holder. The angle of the mating surface with respect to the recessed surface of the slot prevents deformation of the bond beam and prevents compromising the integrity of the adhesive bond between the ingot and the bond beam. | 04-11-2013 |
20130121802 | Wafer Transport Cart - Systems and methods are disclosed for transporting wafers to a processing apparatus. The system comprises a frame having a support sized for receiving a wafer assembly including the wafers. An alignment system is connected to the frame. The alignment system is disposed for guiding the wafer assembly to a first position as the wafer assembly is lowered onto the support of the frame. The alignment system reduces the amount of time required to transport the wafers to the processing apparatus. | 05-16-2013 |
20140150826 | WAFER CLEANING APPARATUS AND METHODS - A wafer cleaning apparatus includes a beam for holding a plurality of semiconductor or solar wafers. The beam includes at least one channel extending axially through the beam. An opening extends from the channel to a location between adjacent wafers. A manifold includes a conduit coupled to the channel and an immersion tank includes an ultrasonic transducer. | 06-05-2014 |
20140170781 | DOUBLE SIDE POLISHER WITH PLATEN PARALLELISM CONTROL - A platen for polishing a surface of a wafer has a reaction plate, a polishing plate, and a bladder. The reaction plate has a top and bottom surface, and defines a longitudinal axis. The polishing plate is positioned coaxially with the reaction plate. The polishing plate has a second top surface and a second bottom surface. The second top surface is adjacent to the bottom surface of the reaction plate. The bladder is coaxially located along a radially outer portion of either the top or bottom surface of the reaction plate. The bladder is connected with the polishing plate and able to expand to deform the polishing plate with respect to the bottom surface of the reaction plate. | 06-19-2014 |
20140182788 | Apparatus for Stressing Semiconductor Substrates - Apparatus for use in preparing heterostructures having a reduced concentration of defects including apparatus for stressing semiconductor substrates to allow them to conform to a crystal having a different crystal lattice constant. | 07-03-2014 |
20140187022 | Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Distension - Apparatus and processes for preparing heterostructures with reduced strain are disclosed. The heterostructures may include a semiconductor structure that conforms to a surface layer having a different crystal lattice constant than the structure to form a relatively low-defect heterostructure. | 07-03-2014 |
20140187023 | Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Compression - Apparatus and processes for preparing heterostructures with reduced strain are disclosed. The heterostructures may include a semiconductor structure that conforms to a surface layer having a different crystal lattice constant than the structure to form a relatively low-defect heterostructure. | 07-03-2014 |