Patent application number | Description | Published |
20080254215 | PLANARIZING COATING METHOD - A planarizing coating method for filling a step between patterns formed on a board surface, includes the steps of: preparing at least two types of coating liquids different in non-volatile matter densities, first coating one of the coating liquids higher in density on the board surface, rotating the board so as to leave the one coating liquid inside the step and such that, at the same time, substantially none of the one coating liquid is left on a pattern crest of the patterns, subsequently coating another of the coating liquids lower in non-volatile matter density on the board surface, and rotating the board so that the coating liquid lower in density is left on a coating film comprising the one coating liquid higher in density and such that, at the same time, substantially none of the other coating liquid lower in density left on the pattern crest. | 10-16-2008 |
20090249604 | METHOD AND APPARATUS FOR RELEASING SUPPORT PLATE AND WAFER CHIPS FROM EACH OTHER - The present invention provides an apparatus for releasing a support plate and wafer chips from each other. A wafer | 10-08-2009 |
20090325467 | Method of Thinning Wafer and Support plate - A wafer can be thinned without occurrences of dimples. A support plate | 12-31-2009 |
20100009084 | Coating apparatus, coating method and coating-film forming appratus - A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position. The nozzle is positioned above a non-recessed portion of the tray and supplies a coating liquid only onto a non-recessed portion of the upper surface of the tray to form a coating liquid pool, and the applicator is relatively movable in a horizontal direction in a state of maintaining a certain distance with respect to the upper surface of the substrate accommodated into the recessed portion and spreads the coating liquid of the coating liquid pool from the non-recessed portion of the upper surface of the tray over the entire upper surface of the substrate. | 01-14-2010 |
20100037916 | TREATMENT DEVICE, TREATMENT METHOD, AND SURFACE TREATMENT JIG - The treatment device | 02-18-2010 |
20100069593 | ADHESIVE COMPOSITION AND ADHESIVE FILM - An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing. | 03-18-2010 |
20100075141 | ADHESIVE COMPOSITION AND FILM ADHESIVE - Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature. | 03-25-2010 |
20100178497 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION - Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature. | 07-15-2010 |
20100227996 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION - An adhesive composition according to the present invention is an adhesive composition whose main component is a polymer obtained by copolymerization of a monomer composition, which monomer composition contains styrene, (meth)acrylic ester having a cyclic structure, and alkyl (meth)acrylate having a chain structure. The polymer thus having a styrene block segment allows improvement of thermal resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping following a high temperature process of the adhesive composition. As such, an adhesive composition is provided, which has high thermal resistance, adhesive strength in the high temperature environment, and alkaline resistance, and further which can easily carry out stripping of the adhesive composition after a high temperature process has been carried out to the adhesive composition. | 09-09-2010 |
20110146899 | SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE - A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate. | 06-23-2011 |
20120132359 | ATTACHING DEVICE AND ATTACHING APPARATUS FOR SUPPORTING PLATE, AND ATTACHING METHOD FOR SUPPORTING PLATE - An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled. | 05-31-2012 |
20120141682 | COATING APPARATUS, COATING METHOD AND COATING-FILM FORMING APPARATUS - A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray. | 06-07-2012 |
20130333833 | PERFORATED SUPPORT PLATE - To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention. | 12-19-2013 |