Patent application number | Description | Published |
20090009907 | Laminated film for head applications - A laminated main pole layer is disclosed in which a non-AFC scheme is used to break the magnetic coupling between adjacent high moment layers and reduce remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. An amorphous material layer with a thickness of 3 to 20 Angstroms and made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, or Si is inserted between adjacent high moment stacks. The laminated structure also includes an alignment layer below each high moment layer within each stack. In one embodiment, a Ru coupling layer is inserted between two high moment layers in each stack to introduce an AFC scheme. An uppermost Ru layer is used as a CMP stop layer. A post annealing process may be employed to further reduce the anisotropy field (Hk). | 01-08-2009 |
20090323227 | Ta/W film as heating device for dynamic fly height adjustment - A dynamic fly heater (DFH) for improved lifetime and better film uniformity is disclosed for a magnetic head. The heater has a lower amorphous Ta layer and an upper W layer to promote small grain size and reduced electro-migration. The composite film is especially advantageous for heaters greater than 1000 Angstroms thick where dR/R is difficult to control in the prior art. The DFH may be a (Ta/W) | 12-31-2009 |
20100119874 | Laminated high moment film for head applications - A laminated high moment film with a non-AFC configuration is disclosed that can serve as a seed layer for a main pole layer or as the main pole layer itself in a PMR writer. The laminated film includes a plurality of (B/M) stacks where B is an alignment layer and M is a high moment layer. Adjacent (B/M) stacks are separated by an amorphous layer that breaks the magnetic coupling between adjacent high moment layers and reduces remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. The amorphous material layer may be made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, Ti, Cr, Nb, or Si, or may be Hf, Zr, Ta, Nb, CoFeB, CoB, FeB, or CoZrNb. Alignment layers are FCC soft ferromagnetic materials or non-magnetic FCC materials. | 05-13-2010 |
20100276272 | Method for fabricating a high coercivity hard bias structure for magnetoresistive sensor - A hard bias (HB) structure for longitudinally biasing a free layer in a MR sensor is disclosed that includes a mildly etched seed layer and a hard bias (HB) layer on the etched seed layer. The HB layer may contain one or more HB sub-layers stacked on a lower sub-layer which contacts the etched seed layer. Each HB sub-layer is mildly etched before depositing another HB sub-layer thereon. The etch may be performed in an IBD chamber and creates a higher concentration of nucleation sites on the etched surface thereby promoting a smaller HB average grain size than would be realized with no etch treatments. A smaller HB average grain size is responsible for increasing Hcr in a CoPt HB layer to as high as 2500 to 3000 Oe. Higher Hcr is achieved without changing the seed layer or HB material and without changing the thickness of the aforementioned layers. | 11-04-2010 |
20100330395 | Thin seeded Co/Ni multiplayer film with perpendicular anisotropy for read head sensor stabilization - A hard bias (HB) structure for producing longitudinal bias to stabilize a free layer in an adjacent spin valve is disclosed and includes a composite seed layer made of at least Ta and a metal layer having a fcc(111) or hcp(001) texture to enhance perpendicular magnetic anisotropy (PMA) in an overlying (Co/Ni) | 12-30-2010 |
20110198314 | Method to fabricate small dimension devices for magnetic recording applications - A three step ion beam etch (IBE) sequence involving low energy (<300 eV) is disclosed for trimming a sensor critical dimension (free layer width=FLW) to less than 50 nm. A first IBE step has a steep incident angle with respect to the sensor sidewall and accounts for 60% to 90% of the FLW reduction. The second IBE step has a shallow incident angle and a sweeping motion to remove residue from the first IBE step and further trim the sidewall. The third IBE step has a steep incident angle to remove damaged sidewall portions from the second step and accounts for 10% to 40% of the FLW reduction. As a result, FLW approaching 30 nm is realized while maintaining high MR ratio of over 60% and low RA of 1.2 ohm-μm | 08-18-2011 |
20110255196 | PMR writer with graded side shield - A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a graded side shield that is conformal to the shape of the pole tip at an upper portion of the shield but not conformal to the pole tip at a lower portion. The shield includes a trailing shield, that is conformal to the trailing edge of the pole tip and may include a leading edge shield that magnetically connects two bottom ends of the graded side shield. | 10-20-2011 |
20120129007 | Fabrication of a coercivity hard bias using FePt containing film - The free layer of a CPP-TMR sensor is biased by laterally disposed hard bias (HB) layers that include a seedlayer structure, a magnetic layer structure of high coercivity material and a capping layer structure. The magnetic layer structure is a layer of FePt-containing material, such as FePtCu, while the seedlayers and capping layers include layers of Cr, CrTi, Fe, FeCo or FeCoMo. These combinations enable the promotion of the L10 phase of the FePt-containing material which provides a high coercivity magnetic layer structure at much lower annealing temperatures than in the prior art. | 05-24-2012 |
20130084452 | Very thin high coercivity film and process for making it - High Hc (>4,000 Oe) and high Hk (>1 Tesla) has been achieved in FePt films as thin as 70 Angstroms. This was accomplished by starting with a relatively thick film having the required high coercivity, coating it with a suitable material such as Ta, and then using ion beam etching to remove surface material until the desired thickness was reached. | 04-04-2013 |
20140091055 | Method of Making a PMR Writer with Graded Side Shield - A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a graded side shield that is conformal to the shape of the pole tip at an upper portion of the shield but not conformal to the pole tip at a lower portion. The shield includes a trailing shield, that is conformal to the trailing edge of the pole tip and may include a leading edge shield that magnetically connects two bottom ends of the graded side shield. | 04-03-2014 |
Patent application number | Description | Published |
20100332697 | STORAGE DEVICE AND STORAGE DEVICE ASSEMBLY - A storage device includes a USB connector, a storage module, a first USB receiver, and a multiplexer. The USB connector is configured for connected to a computer. The storage module is configured for storing data. The first USB receiver is configured to receive a second storage device. The multiplexer is connected to the USB connector and the first USB receiver, and is capable of accessing the storage module, wherein the multiplexer is capable of accessing the storage module and the second storage device at the same time when the USB connector is connected to the computer and the second storage device is connected to the first USB receiver. | 12-30-2010 |
20150196062 | BATTERY ASSEMBLY AND ELECTRONIC CIGARETTE HAVING SAME - An exemplary battery assembly for an electronic cigarette includes a housing, a battery received in the housing, and a first switch assembly connected to the battery. The first switch assembly includes a fixed electrode, and a rotatable electrode. The fixed electrode is connected to the battery. The fixed electrode has a conductive area and an insulated area. The rotatable electrode is rotatable between a first position and a second position. In the first position, the rotatable electrode is in contact with the conductive area, thus connecting to the fixed electrode, and the first switch assembly is turned on. In the second position, the rotatable electrode is positioned in the insulated area, thus disconnecting from the fixed electrode, and the first switch assembly is turned off. | 07-16-2015 |
Patent application number | Description | Published |
20090130845 | DIRECT ELECTRODEPOSITION OF COPPER ONTO TA-ALLOY BARRIERS - A method of depositing copper directly onto a tantalum alloy layer of an on-chip copper interconnect structure, which includes electrodepositing copper from a neutral or basic electrolyte onto a surface of a tantalum alloy layer, in which the tantalum alloy layer is deposited on a substrate of the on-chip copper interconnect structure, and in which the copper nucleates onto the surface of the tantalum alloy layer without use of a seed layer to form a copper conductor. | 05-21-2009 |
20130025907 | CARBON-BASED SUBSTRATE CONDUCTOR - A cable is provided having a jacket surrounding a core. A carbon-based substrate (CBS) conductor is provided in the core. The CBS conductor includes a CBS network metalized with a metalized layer. A method for manufacturing a carbon-based substrate (CBS) conductor includes providing a CBS network of CBS fibers forming a framework and metalizing at least a portion of the CBS network with a metalized layer. Optionally, the metalized layer may be at least one of a silver metalized layer, a copper metalized layer, a gold metalized layer, a nickel metalized layer, and a tin metalized layer. The CBS network may be one of a yarn, a sheet, and a tape. The CBS conductor may be a signal carrying conductor of the cable or the CBS conductor may surround the core and provide EMI shielding for the core. The cable may further include a contact terminated to the CBS conductor at the first end of the cable. The metalized layer may be provided at the interface between the CBS conductor and the contact to enhance the electrical interface between the CBS conductor and the contact. | 01-31-2013 |
20130206461 | Electrical Conductors and Methods of Manufacturing Electrical Conductors - A method of manufacturing an electrical conductor includes providing a substrate layer, depositing a surface layer on the substrate layer that has pores at least partially exposing the substrate layer, and forming graphene deposits in the pores. Optionally, the graphene deposits may be formed only in the pores. The graphene deposits may be formed along the exposed portions of the substrate layer. The graphene layers may be selectively deposited or may be deposited to cover an entire layer. Optionally, the forming of the graphene deposits may include processing the electrical conductor using a chemical vapor deposition process using an organic compound precursor and heat of sufficient temperature to facilitate graphene growth on the metal compound comprising the substrate layer. | 08-15-2013 |
20130217279 | TERMINATION OF CARBON NANOTUBE MACROSTRUCTURES - An electrical connector has a carbon nanotube (CNT) conductor, a terminal terminated to the CNT conductor, and a conductive intermediary electrically coupled to the CNT conductor and the terminal to enhance an electrical connection between the CNT conductor and the terminal. Optionally, the terminal may have a crimp barrel that receives the CNT conductor. The electrical connector may include a second CNT conductor where the terminal splices the CNT conductor and the second CNT conductor together. | 08-22-2013 |
Patent application number | Description | Published |
20130122309 | POLYVINYLIDENE FLUORIDE DISPERSION - The invention relates to a polyvinylidene fluoride (PVDF) solvent dispersion composition containing PVDF (such as KYNAR 500) that is free of fluorosurfactants, an organic solvent, and low levels of dispersants. A pigmented version of this dispersion is also covered. The dispersion is useful for producing tough, chemical-resistant coatings, especially on metallic substrates, including for use as a coil coating or an architectural coating. | 05-16-2013 |
20150079403 | AQUEOUS FLUOROPOLYMER GLASS COATING - The invention relates to an aqueous fluoropolymer coating composition for direct application to glass without the need for pre-treatment of the glass surface. The coating composition can also be used with other non-porous and porous substrates. The fluoropolymer coating contains a hydroxyl-functional fluoropolymer, and polyisocyanates. Preferably the coating composition also contains a water-dispersible hydroxyl functional polyurethane. The coating composition may exist as a 1-pack or a multi-pack coating system. The coating has excellent wet adhesion to glass, good weathering, chalking resistance, chemical resistance, and dirt pickup resistance. | 03-19-2015 |
20150086792 | PROCESS FOR COATING A GLASS SUBSTRATE WITH AN AQUEOUS FLUOROPOLYMER COATING - The invention relates to an process for coating a glass substrate with an environmentally friendly aqueous, fluoropolymer coating composition. The process involves applying a polyurethane primer to the glass substrate, and partially, but not completely crosslinking this primer coating. An aqueous hydroxyl-functional fluoropolymer coating is then applied to the partially crosslinked primer coating, and the coating allowed to fully cure. The invention also relates to the intertwined multilayer primer/fluoropolymer coating on the glass substrate. The final coating has excellent wet adhesion to glass, good weathering, durability, chalking resistance, chemical resistance, and dirt pickup resistance. | 03-26-2015 |