Patent application number | Description | Published |
20090214516 | Inhibitors of Reglll Proteins as Asthma Therapeutics - Methods of screening for agents for treating asthma are provided. The methods involve screening for agents that decrease the production or activity of a RegIII protein that has been discovered herein to play a role in producing the symptoms and pathological complications involved in asthma. Methods of treating asthma, as well as screening for and treating with inhibitors of a RegIII protein are also provided. | 08-27-2009 |
20090274705 | IL-13 BINDING AGENTS - Agents (e.g., antibodies and fragments thereof) that bind specifically to IL 13 and modulate the ability of IL-13 to interact with IL-13 receptors and signaling mediators are disclosed. | 11-05-2009 |
20100129360 | ANTIBODIES AGAINST HUMAN INTERLEUKIN-13 AND USES THEREFOR - This application relates to antibodies, e.g., humanized antibodies, and antigen-binding fragments thereof, that bind to interleukin-13 (IL-13), in particular, human IL-13, and their uses in regulating immune responses mediated by IL-13. The antibodies disclosed herein are useful in diagnosing, preventing, and/or treating a subject, e.g., a human patient, one or more IL-13-associated disorders, e.g., respiratory disorders (e.g., asthma); atopic disorders (e.g., allergic rhinitis); inflammatory and/or autoimmune conditions of the skin (e.g., atopic dermatitis), and gastrointestinal organs (e.g., inflammatory bowel diseases (IBD)), as well as fibrotic and cancerous disorders. | 05-27-2010 |
20110262435 | IL-13 BINDING AGENTS - Agents (e.g., antibodies and fragments thereof) that bind specifically to IL 13 and modulate the ability of IL-13 to interact with IL-13 receptors and signaling mediators are disclosed. | 10-27-2011 |
Patent application number | Description | Published |
20100178190 | Accurate Powder Metal Component, Assembly and Method - The invention provides an accurate powder metal component having a body with opposed surfaces at least one of which has at least one projection of smaller cross-sectional area than the main portion of the body of the component. The distance from the free end of the projection to the opposite end of the component defines one dimension of the component that must be relatively accurate, in one embodiment to slide against and form a seal that inhibits liquid flow against another component of an assembly. In the manufacturing method, the powdered metal component is made by compaction to form the body including a projection at the end, is sintered and thereafter is reduced in the dimension between the end of the projection and the opposite end of the component by coining the free end of the projection so as to reduce the dimension to within a tolerance of the nominal specified dimension. | 07-15-2010 |
20110000457 | PREALLOYED COPPER POWDER FORGED CONNECTING ROD - A process for manufacturing connecting rods is provided which comprises the steps of compacting, sintering, and powder forging a powder metal comprising a carbon source and a prealloyed powder consisting essentially of iron and copper. The connecting rods made from this process have sufficient hardness and strength to be used in an engine and do not require any additional quenching or tempering. | 01-06-2011 |
20110111247 | BRAZED COMPONENT AND METHOD OF FORMING A BRAZED JOINT THEREIN - A brazed part, and methods of forming a brazed joint therein, are disclosed. The brazed part includes two or more components that are brazed together. Using the method of locating the parts herein disclosed, an inter-component gap between the components may be formed. Flow control features formed along the inter-component gap may then be used to assist in the retention of the braze material between the components during brazing. | 05-12-2011 |
20110143158 | POWDER METAL COMPONENT TOLERANCE IMPROVEMENTS - A powder metal component ( | 06-16-2011 |
20110265757 | ALUMINUM ALLOY POWDER METAL BULK CHEMISTRY FORMULATION - A powder metal mixture is disclosed that provides improved mechanical properties for parts made from powder metal, such as cam caps. The powder metal mixture, upon sintering, forms an S phase intermetallic in the Al—Cu—Mg alloy system. The S phase is present in a concentration that results in an enhanced response to cold work strengthening of the powder metal part. Further, by minor adjustments to certain alloy elements, such as tin, the tensile properties of the resultant part may be adjusted. | 11-03-2011 |
20120132160 | ADHESIVE JOINING FOR POWDER METAL COMPONENTS - A method of joining multiple powder metal components to form a powder metal component assembly using an adhesive is disclosed. By machining at least one of the powder metal components prior to the adhesive joining, otherwise difficult to machine features can be more easily machined for less cost and at higher production rates. Unlike high temperature joining techniques, the adhesive joins the powder metal components at room temperature. This room temperature adhesive joining eliminates the thermal distortions in pre-joined machined features common to high temperature joining techniques such as brazing or welding that bring these features out of specification during joining. | 05-31-2012 |
20130183189 | ALUMINUM POWDER METAL ALLOYING METHOD - A zirconium-doped aluminum powder metal and a method of making this powder metal are disclosed. The method of making includes forming an aluminum-zirconium melt in which a zirconium content of the aluminum-zirconium melt is less than 2.0 percent by weight. The aluminum-zirconium melt then powderized to form a zirconium-doped aluminum powder metal. The powderization may occur by, for example, air atomization. | 07-18-2013 |
20130309123 | ALUMINUM ALLOY POWDER METAL WITH TRANSITION ELEMENTS - A transition element-doped aluminum powder metal and a method of making this powder metal are disclosed. The method of making includes forming an aluminum-transition element melt in which a transition element content of the aluminum-transition element melt is less than 6 percent by weight. The aluminum-transition element melt then powderized to form a transition element-doped aluminum powder metal. The powderization may occur by, for example, air atomization. | 11-21-2013 |
20130333870 | ALUMINUM ALLOY POWDER METAL WITH HIGH THERMAL CONDUCTIVITY - An aluminum alloy powder metal is disclosed. A sintered part made from the aluminum alloy powder has a thermal conductivity comparable to or exceeding parts made from wrought aluminum materials. | 12-19-2013 |
20140341635 | Brazed Component and Method of Forming a Brazed Joint Therein - A brazed part includes two or more components that are brazed together and has related method of making. Using a method of locating parts relative to one another, an inter-component gap between the components may be formed. Subsequently, during brazing, flow control features formed along the inter-component gap may then be used to assist in the retention of the braze material between the components during brazing. | 11-20-2014 |
Patent application number | Description | Published |
20100270635 | Semiconductor Surface Modification - Methods, systems, and devices associated with surface modifying a semiconductor material are taught. One such method includes providing a semiconductor material having a target region and providing a dopant fluid layer that is adjacent to the target region of the semiconductor material, where the dopant fluid layer includes at least one dopant. The target region of the semiconductor material is lased so as to incorporate the dopant or to surface modify the semiconductor material. During the surface modification, the dopant in the dopant fluid layer is actively replenished. | 10-28-2010 |
20120214260 | Semiconductor Surface Modification - Methods, systems, and devices associated with surface modifying a semiconductor material are taught. One such method includes providing a semiconductor material having a target region and providing a dopant fluid layer that is adjacent to the target region of the semiconductor material, where the dopant fluid layer includes at least one dopant. The target region of the semiconductor material is lased so as to incorporate the dopant or to surface modify the semiconductor material. During the surface modification, the dopant in the dopant fluid layer is actively replenished. | 08-23-2012 |
20140154891 | Beam Delivery Systems for Laser Processing Materials and Associated Methods - Devices, systems, and methods for laser processing semiconductor materials are provided. In one aspect, a system for uniformly laser irradiating at least one wafer can include a wafer platter operable to receive and support a one or more wafers, a rotational movement system coupled to the wafer platter, the rotational movement system being operable to rotate the wafer platter in at least one of a clockwise or a counter clockwise direction, and a linear movement system coupled to the wafer platter and operable to move the wafer platter along one or more linear axes. The system can also include a laser source oriented to deliver laser radiation onto a wafer supported by the wafer platter at a fixed angle relative to the surface of the wafer, where the rotational movement system and the linear movement system are operable to maintain the fixed angle across the entirety of the wafer surface. | 06-05-2014 |