Patent application number | Description | Published |
20100044089 | INTERPOSER INTEGRATED WITH CAPACITORS AND METHOD FOR MANUFACTURING THE SAME - An interposer integrated with capacitors ( | 02-25-2010 |
20100265159 | ELECTROMAGNETIC BAND GAP ELEMENT, AND ANTENNA AND FILTER USING THE SAME - Conductor pieces | 10-21-2010 |
20100308474 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A substrate ( | 12-09-2010 |
20110012697 | ELECTRO-MAGNETIC BAND-GAP STRUCTURE, METHOD FOR MANUFACTURING THE SAME, FILTER ELEMENT AND PRINTED CIRCUIT BOARD HAVING EMBEDDED FILTER ELEMENT - An electromagnetic bandgap structure EBG includes a rigid substrate, a first conductive plane provided on the rigid substrate, a dielectric layer provided on the first conductive plane, and a plurality of conductor patches arrayed in a two-dimensional regular pattern on the dielectric layer. The electromagnetic bandgap structure also includes an interlayer insulation film provided on top of the conductor patches, and a second conductive plane provided on the interlayer insulation film. The conductor patches and the second conductive plane are interconnected by a plurality of conductors provided in extending through the bulk of the interlayer insulation film. | 01-20-2011 |
20110170268 | ELECTROMAGNETIC BAND GAP STRUCTURE, ELEMENT, SUBSTRATE, MODULE, AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC BAND GAP STRUCTURE, AND PRODUCTION METHODS THEREOF - To provide a small-sized and thin electromagnetic band gap structure which can be surface-mounted or built in a substrate. An electromagnetic band gap structure according to an aspect of the present invention includes: an insulating substrate; a plurality of conductor pieces regularly arranged on the insulating substrate; a dielectric layer formed so as to fill a space between adjacent ones of the conductor pieces; an interlayer insulating layer formed on the dielectric layer; and a conductor plane which is formed on the interlayer insulating layer and is connected to each of the conductor pieces with a conductor penetrating through the interlayer insulating layer. | 07-14-2011 |
20110302753 | CAPACITOR PRODUCING METHOD, CAPACITOR PRODUCING DEVICE, AND CAPACITOR PRODUCING PROGRAM - In a capacitor producing method, a bottom electrode, a thin-film dielectric, and a top electrode are deposited on a substrate so as to form a capacitor, wherein defects including particles and electrical short-circuits between the bottom electrode and the top electrode are detected before the capacitor is divided into capacitor cells. Next, defects such as particles and electrical short-circuits between the bottom electrode and the top electrode are removed before the capacitor is divided into capacitor cells. | 12-15-2011 |
20120217653 | SEMICONDUCTOR DEVICE AND NOISE SUPPRESSING METHOD - A first semiconductor chip ( | 08-30-2012 |
20130005085 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below. | 01-03-2013 |
20140068905 | CAPACITOR PRODUCING METHOD, CAPACITOR PRODUCING DEVICE, AND CAPACITOR PRODUCING PROGRAM - In a capacitor producing method, a bottom electrode, a thin-film dielectric, and a top electrode are deposited on a substrate so as to form a capacitor, wherein defects including particles and electrical short-circuits between the bottom electrode and the top electrode are detected before the capacitor is divided into capacitor cells. Next, defects such as particles and electrical short-circuits between the bottom electrode and the top electrode are removed before the capacitor is divided into capacitor cells. | 03-13-2014 |
Patent application number | Description | Published |
20100195019 | SURFACE LIGHT SOURCE APPARATUS - A light guide plate ( | 08-05-2010 |
20120002441 | AREA LIGHT SOURCE DEVICE - An area light source device has a diffusion plate and a prism sheet stacked on a light guide plate, and a light source disposed opposite an end face of the light guide plate. Light emitted from the light source is introduced to an inside of the light guide plate from the end face. Area light emission is obtained by outputting the light diffused in the light guide plate from the diffusion plate and the prism sheet through a front face disposed opposite the diffusion plate. The light guide plate includes a light guide section that includes the end face disposed opposite the light source, a light emitting section that is disposed opposite the diffusion plate, and a joining section that joins the light guide section and the light emitting section. The front surface in the joining section includes an inclined surface that is gradually retreated toward a rear surface on an opposite side from the light guide section toward the light emitting section. The front faces of the light guide section and the joining section are covered with a light shielding member. The light shielding member is fixed to the diffusion plate without interposing the prism sheet therebetween. The light shielding member and the inclined surface are arranged to allow air to be interposed therebetween. | 01-05-2012 |
20140111743 | SURFACE LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE - An area light source device has a light guide plate having an end face and a light exit surface, a light source that is disposed in a position facing the end face of the light guide plate, a plurality of optical sheets that are disposed on the light guide plate, a light shielding plate that is disposed so as to cover an upper portion of the light source, and a light blocking member that is provided between the end face of the light guide plate and the light exit surface. The end face of the light guide plate is configured to have light introduced therethrough. The light exit surface of the light guide plate is configured to output the light from the light guide plate. The light blocking member is different from the light shielding plate. | 04-24-2014 |
20140124965 | TRANSFER MOLDING METHOD AND TRANSFER MOLDING APPARATUS - A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value. | 05-08-2014 |
20140125917 | LIGHT GUIDE PLATE PRODUCING METHOD, DIE STRUCTURE, TRANSFER MOLDING APPARATUS, LIGHT GUIDE PLATE, AREA LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE - A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies. | 05-08-2014 |
20140125918 | DIE STRUCTURE, TRANSFER MOLDING APPARATUS, TRANSFER MOLDING METHOD, OPTICAL MEMBER, AREA LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE - A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface. | 05-08-2014 |
20140125921 | RESIN SHEET PRODUCING METHOD, OPTICAL MEMBER PRODUCED BY RESIN SHEET PRODUCING METHOD, AREA LIGHT SOURCE DEVICE IN WHICH OPTICAL MEMBER IS USED, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE - An area light source device has a transfer-molded optical member, and a light source disposed in a position facing at least one of end faces of the optical member. Light incident to the optical member from the light source is output through a light exit surface of the optical member. A cutting back clearance portion is provided in at least one of corner portions of the end face of the optical member. | 05-08-2014 |