Slifer
David M. Slifer, Royersford, PA US
Patent application number | Description | Published |
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20100316725 | REDUCTION OF FLAKE-LIKE AGGREGATION IN NANOPARTICULATE ACTIVE AGENT COMPOSITIONS - This invention is directed to reduction of flake-like aggregation in nanoparticulate compositions. Also encompassed by the invention are compositions comprising a nanoparticulate active agent, at least one surface stabilizer and a flake-like aggregation reducing agent, such as a buffer and a sugar. The nanoparticulate active agent compositions comprise particles of the active agent having an effective average particle size of less than about 2000 nm. | 12-16-2010 |
20140105984 | REDUCTION OF FLAKE-LIKE AGGREGATION IN NANOPARTICULATE ACTIVE AGENT COMPOSITIONS - This invention is directed to reduction of flake-like aggregation in nanoparticulate compositions. Also encompassed by the invention are compositions comprising a nanoparticulate active agent, at least one surface stabilizer and a flake-like aggregation reducing agent, such as a buffer and a sugar. The nanoparticulate active agent compositions comprise particles of the active agent having an effective average particle size of less than about 2000 nm. | 04-17-2014 |
Jason Shannon Slifer, Fortville, IN US
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20080245277 | Interlocking Table with Integral Magazine Holder - An article of furniture comprises a support assembly including an elongate cross-member, a first end panel having a top edge and an interlocking slot for engagement with an interlocking slot at one end of the cross-member, a second end panel having a top edge and an interlocking slot for engagement with the interlocking slot at the other end of the cross-member, and an intermediate support member having a pair of top edges and an interlocking slot for engagement with an interlocking slot at an intermediate portion of the cross-member. A tabletop panel is supported on the top edges of the end panels and the intermediate support. The article of furniture includes a magazine holder comprising an opening formed in the table top over an intersection point, the intersection point corresponding to a base for supporting magazines inserted through the opening. | 10-09-2008 |
Russell Slifer, Boise, ID US
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20140258269 | GEOSPATIAL AND TEMPORAL DATA SYSTEM - A system is described that a geospatial coordinate component arranged to identify a set of geospatial coordinates from a geospatial dataset. A temporal coordinate component is arranged to identify a set of temporal coordinates from a temporal dataset. The system includes an article query component that is arranged to determine a set of articles based on the set of geospatial coordinates and the set of temporal coordinates. A presentation component is arranged to present a representation of a member of the set of articles. The geospatial coordinate component can receive a user selected geographical area and intersect the geospatial dataset with the geographical area. | 09-11-2014 |
Russell D. Slifer, Boise, ID US
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20090283898 | DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS - Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect. | 11-19-2009 |
20120309128 | DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS - Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect. | 12-06-2012 |
Russell D. Slifer US
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20130214421 | DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS - Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect. | 08-22-2013 |