Patent application number | Description | Published |
20080253129 | LAMP FIXTURE - An improved lamp fixture with anti-glare function is disclosed, which comprises: a lamp; a light source; and a light-control unit, composed of a semi-Fresnel microstructure and a light-control microstructure; wherein the light source and the light-control unit are mounted on the lamp; and the semi-Fresnel microstructure is used for diffusing/collimating light of the light source while the light-control microstructure is used for controlling the resulting lighting angle. With the aforesaid lamp fixture, not only glare can be prevented, but also uniformity of the lamp fixture is improved. | 10-16-2008 |
20090236270 | WATER PURIFICATION SYSTEM - A water purification system performs a water purification process through physical sterilization, and at least includes a compression device and a decompression device. Water is converted into a high-pressure liquid through the compression device, and then is converted into a high-speed fluid by controlling the cross-sectional area of a spout of the decompression device, thus generating physical effects such as pressure drop and shear stress, so as to damage cell walls of bacteria in the liquid to die-off the bacteria. Therefore, purified water is obtained. | 09-24-2009 |
20090284275 | CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR IC - A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump. | 11-19-2009 |
20100098600 | PLASMA SYSTEM - A plasma system for generating a plasma is generated. The plasma system includes a tube, a positive electrode and a negative electrode. The tube has a plasma jet opening, a first end surface and a second end surface. The plasma jet opening penetrates the wall of the tube. The plasma passes through the plasma jet opening and is emitted to the outside of the tube. The positive electrode has a side surface facing and adjacent to the tube. The negative electrode is separated from the positive electrode by a first predetermined distance. The negative electrode has a negative electrode side surface facing and adjacent to the tube. The first positive electrode and the first negative electrode are disposed between the first end surface and the second end surface, and a portion of the plasma jet opening is disposed between the positive electrode and the negative electrode. | 04-22-2010 |
20100164517 | CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR ICS - A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulating substrate into a plating solution and plating conducting layers within the trenches to form a plurality of micro-wires; and stacking a plurality of the insulating substrates or winding or folding the insulating substrate along an axis substantially parallel to an extended direction of the micro-wires to form a conducting lump. | 07-01-2010 |
20110107596 | CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR IC - A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump. | 05-12-2011 |
20110141412 | COLOR SEPARATION SYSTEM - A color separation system is disclosed, which comprises: a backlight source, being highly collimated and used for providing an incident beam; a color separation module, formed with a first color separation film for separating the incident beam basing on wavelength while deflecting the optical paths of the resulting split beams; and a beam splitting module, being configured with at least one beam splitting plate and a liquid crystal layer; wherein, the at least one beam splitting plate is used for converging the beams from the color separation module while deflecting the optical paths thereof for enabling those to be discharged thereout following a normal direction of a light emitting surface of the backlight source. | 06-16-2011 |
20110169519 | CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR IC - A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump. | 07-14-2011 |
20120218776 | COMPOSITE COLOR SEPARATION SYSTEM - A color separation system is disclosed, which comprises: a wavelength distribution module, a light guide module and a light splitting module. The wavelength distribution module includes at least one lighting unit and at least one lens unit, in which each lighting unit emits at least two beams of different wavelengths. The plurality of beams is directed to enter the lens unit before it is discharged out of the wavelength distribution module. After that, the plural beams from the wavelength distribution module enters the light guide module. The portion of those beams that are being absorbed, while the portion of those beams being discharged out of the light guide module and then enter the light splitting module. The light splitting module is functioned for splitting the plural beams. | 08-30-2012 |
20120251035 | CIRCULAR PHOTONIC CRYSTAL STRUCTURE, LIGHT EMITTING DIODE DEVICE AND PHOTOELECTRIC CONVERSION DEVICE - A method applying a circular photonic crystal structure to improve optical properties of a photoelectric conversion device such as a light emitting diode device, an organic light emitting diode device or a solar cell is provided, wherein the circular photonic crystal structure is configured on a junction surface between two different mediums where passes a light emitted or received by the photoelectric conversion device. The circular photonic crystal structure provides isotropic photonic band gap which conduces high light extraction efficiency. | 10-04-2012 |
20130160820 | FOCUSING SOLAR LIGHT GUIDE MODULE - A focusing solar light guide module includes a lens array plate and a light guide plate. The lens array plate includes at least one lens. Each lens receiving and focusing a sunlight has an upper curved surface and a lower plane surface. The light guide plate has an upper plane surface parallel to the lower plane surface of the lens array plate and a lower microstructure surface. The lower microstructure surface includes at least one depressed area and at least one connection area parallel to the upper plane surface of the light guide plate. The connection area is connected between the adjacent depressed areas having a depressed point, a first inclined plane and a second inclined plane. The first inclined plane and the second inclined plane are respectively connected between the depressed point and the adjacent connection area. | 06-27-2013 |
20130241590 | CONDUCTIVE FILM STRUCTURE AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR ICS - A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulating substrate into a plating solution and plating conducting layers within the trenches to form a plurality of micro-wires; and stacking a plurality of the insulating substrates or winding or folding the insulating substrate along an axis substantially parallel to an extended direction of the micro-wires to form a conducting lump. | 09-19-2013 |
20130312822 | SOLAR-CELL DEVICE - The disclosure provides a solar-cell device, including a substrate, a first electrode layer comprising a first two-dimensional periodic structure disposed on the substrate, a first light conversion layer disposed on the first two-dimensional periodic structure, a second light conversion layer disposed on the first light conversion layer; and a second electrode layer disposed on the second light conversion layer. | 11-28-2013 |
20130334561 | METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND BONDING STRUCTURE - A method for bonding an LED wafer, a method for manufacturing an LED chip, and a bonding structure are provided. The method for bonding an LED wafer includes the following steps. A first metal film is formed on an LED wafer. A second metal film is formed on a substrate. A bonding material layer whose melting point is lower than or equal to about 110° C. is formed on the surface of the first metal film. The LED wafer is placed on the substrate. The bonding material layer is heated at a pre-solid reaction temperature for a pre-solid time to perform a pre-solid reaction. The bonding material layer is heated at a diffusion reaction temperature for a diffusing time to perform a diffusion reaction, wherein the melting points of the first and the second inter-metallic layers after diffusion reaction are higher than about 110° C. | 12-19-2013 |