Mahalingam
Anandh Mahalingam, Duluth, GA US
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20150261445 | DATA DE-DUPLICATION FOR INFORMATION STORAGE SYSTEMS - Technologies for eliminating duplicate data within a storage system. De-duplication may be performed done at physical chunk level, where the data is not copied or moved to different location. A logical mapping is modified using a thin de-duplication kernel module that resides between a distributed volume manager (DVM) and a logical disk (LD). De-duplication is achieved by changing pointers in the mapping to land at a physical location. De-duplication is performed as post-process feature where duplicates are identified and the duplicates are marked in the mapping table, thereby claiming free space through de-duplication. Block-level de-duplication in accordance with the above can co-exist with existing storage architectures for thin provisioning and snapshot management. | 09-17-2015 |
Anbu Selvam Mahalingam, Kulim Pedana MY
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20110284990 | Process for making an alignment structure in the fabrication of a semiconductor device - A process for making an alignment structure in manufacturing a semiconductor device, comprising copper interconnect (Cu-interconnect) fabrication involving chemical-mechanical planarization (CMP) is disclosed. The process comprises tailoring said CMP process to produce a sufficiently high dishing on a designated alignment key area during bulk removal of Cu. The additional dishing step would have sufficient step height for optical pickup to produce alignment signal. Subsequent photolithographic processes specifically for making conventional alignment structure may thus be omitted. Preferably, the additional dishing is achieved by control over any one or combination of pressuring, vacuuming and/or venting of a CMP head's membrane, inner tube and retaining ring chambers, and selection of any one or combination of pads, slurry, pad conditioner and recipe, and may only need to achieve a removal of up to 100 {dot over (A)}. Our process may be adapted for fabricating a MIM top and MIM bottom layers via 2 masking processes, wherein the additional dishing is created as a narrow metal line. It may also be adapted for fabricating an MIM capacitor wherein the underlying Cu layer is used as the bottom plate of the MIM. The additional dishing does not appear to affect electrical properties of the underlying Cu layer. | 11-24-2011 |
Devalingam Mahalingam, Galway IE
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20110262455 | TREATMENT OF PROLIFERATIVE DISORDERS WITH A DEATH RECEPTOR AGONIST - A method of treating a proliferative disorder, and a pharmaceutical composition for use in such a method, comprises administering to the patient a combination of an agonist of a death receptor and an antagonist of Egr-1. The death receptor agonist and the Egr-1 antagonist may be administered sequentially, separately or in combination | 10-27-2011 |
Harish Mahalingam, Ledgewood, NJ US
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20120315344 | Cosmetic Compositions and Methods for Using Same to Improve the Aesthetic Appearance of Skin - The present invention relates to compositions useful in treating the various signs of dermatological aging in human skin. The present invention also relates to cosmetic compositions and methods of using such compositions that improve the aesthetic appearance of skin. Further, the present invention relates to methods of applying the compositions to the skin to effect treatment and to improve the aesthetic appearance of skin, particularly, by providing anti-aging benefits to the skin. Suitable anti-aging agents include 3,3′-thiodipropionic acid and/or its derivatives. | 12-13-2012 |
20140308376 | Cosmetic Compositions and Methods for Using Same to Improve the Aesthetic Appearance of Skin - The present invention relates to compositions useful in treating hyperpigmentation and the various signs of dermatological aging in human skin. The present invention also relates to cosmetic compositions and methods of using such compositions that improve the aesthetic appearance of skin. Further, the present invention relates to methods of applying the compositions to the skin to effect treatment and to improve the aesthetic appearance of skin, particularly, by providing anti-aging benefits to the skin. | 10-16-2014 |
Harish Mahalingam, Parsippany, NJ US
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20160081895 | NOVEL FORMULATIONS - The invention provides for a topical o/w emulsion having moisturizing, and protecting, repairing or restoring the skin lipid barrier of the lips of a mammal, and is a topical oil-in-water emulsion composition comprising: | 03-24-2016 |
Janardhanan Mahalingam, Singapore SG
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20090264328 | COMPOSITIONS - A surfactant composition comprising: (a) a surfactant material; (c) a polyethylene imine of the general formula —(CH | 10-22-2009 |
20110218132 | COMPOSITIONS - A surfactant composition comprising: | 09-08-2011 |
20120122746 | Compositions - A surfactant composition comprising: | 05-17-2012 |
Lalgudi M. Mahalingam, Scottsdale, AZ US
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20110163439 | DIE BONDING A SEMICONDUCTOR DEVICE - A method includes providing a silicon-containing die and providing a heat sink having a palladium layer over a first surface of the heat sink. A first gold layer is located over one of a first surface of the die or the palladium layer. The silicon-containing die is bonded to the heat sink, where bonding includes joining the silicon-containing die and the heat sink such that the first gold layer and the palladium layer are between the first surface of the silicon-containing die and the first surface of the heat sink, and heating the first gold layer and the palladium layer to form a die attach layer between the first surface of the silicon-containing die and the first surface of the heat sink, the die attach layer comprising a gold interface layer having a plurality of intermetallic precipitates, each of the plurality of intermetallic precipitates comprising palladium, gold, and silicon. | 07-07-2011 |
20140252586 | SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH A GOLD INTERFACE LAYER - Embodiments of a semiconductor device include a primary portion of a substrate, a die, and a die attach layer between the die and the primary portion of the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon. | 09-11-2014 |
20140256091 | METHODS FOR BONDING A DIE AND A SUBSTRATE - Embodiments of methods for forming a semiconductor device that includes a die and a substrate include pressing together the die and the substrate such that a first gold layer and one or more additional material layers are between the die and the substrate, and performing a bonding operation to form a die attach layer between the die and the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon. | 09-11-2014 |
L.m. Mahalingam, Scottsdale, AZ US
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20150146399 | PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION - An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die. | 05-28-2015 |
20150333031 | SEMICONDUCTOR DEVICE WITH MECHANICAL LOCK FEATURES BETWEEN A SEMICONDUCTOR DIE AND A SUBSTRATE - An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die. | 11-19-2015 |
L. M. Mahalingam, Scottsdale, AZ US
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20150294921 | SEMICONDUCTOR DEVICES WITH A THERMALLY CONDUCTIVE LAYER AND METHODS OF THEIR FABRICATION - An embodiment of a semiconductor device includes a semiconductor substrate that includes a host substrate and an upper surface, an active area, a substrate opening in the semiconductor substrate that is partially defined by a recessed surface, and a thermally conductive layer disposed over the semiconductor substrate that extends between the recessed surface and a portion of the semiconductor substrate within the active area. A method for fabricating the semiconductor device includes defining an active area, forming a gate electrode over a channel in the active area, forming a source electrode and a drain electrode in the active area on opposite sides of the gate electrode, etching a substrate opening in the semiconductor substrate that is partially defined by the recessed surface, and depositing a thermally conductive layer over the semiconductor substrate that extends between the recessed surface and a portion of the semiconductor substrate over the channel. | 10-15-2015 |
Mali Mahalingam, Scottsdale, AZ US
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20090001614 | SEMICONDUCTOR DEVICE WITH A BUFFER REGION WITH TIGHTLY-PACKED FILLER PARTICLES - An embodiment of a semiconductor device includes a supporting member, a semiconductor die mounted on a portion of the supporting member, a buffer region, and a plastic encapsulation. The buffer region covers a portion of the die, and includes a resin and filler particles packed within the resin. The filler particles have a mix of filler sizes and are tightly packed within the resin. The buffer region has a first dielectric constant and a first loss tangent. The plastic encapsulation encloses at least part of the supporting member and the die. The plastic encapsulation includes a plastic material of a second dielectric constant and a second loss tangent, where the second dielectric constant is larger than the first dielectric constant and the second loss tangent is larger than the first loss tangent. | 01-01-2009 |
Nagarajan Mahalingam, Singapore SG
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20130307630 | Integrated Circuit Architecture with Strongly Coupled LC Tanks - An integrated circuit for a radio frequency (RF) circuit such as a voltage controlled oscillator or an injection locked frequency divider is provided. The integrated circuit architecture includes a primary LC tank circuit comprising a first inductor and a first capacitive device connected in parallel and one or more secondary LC tank circuits, each comprising an inductor and a capacitive device connected in parallel. Each of the one or more secondary LC tank circuits is strongly coupled to the primary LC tank circuit and to each other either electrically, magnetically or a combination of electrically and magnetically. | 11-21-2013 |
Nagi Jayaraman Mahalingam, Cambridge GB
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20130171996 | MOBILITY IN A WIRELESS ENTERPRISE NETWORK - A method for configuring a network is described, the method comprising: receiving, from a first radio node in the network, network information associated with one or more second radio nodes in the network; generating a network relation table, the network relation table comprising network information associated with the first radio node and the one or more second radio nodes; and performing a handoff to a third radio node in the network using the network relation table. | 07-04-2013 |
20160037550 | RADIO ACCESS NETWORKS - An example communication system in a cellular network comprises: a processing system comprising a controller and remote units, with the remote units being configured to communicate with the controller and to communicate with mobile devices within a communication cell of the cellular network. At least part of the processing system is configured to perform operations comprising: estimating signal strength experienced by all or some of the mobile devices; identifying, based at least on the signal strength, one or more of the mobile devices that can be scheduled for communication with one or more of the remote units in the communication cell on a same airlink resource; and scheduling the communication. | 02-04-2016 |
Nagi Jayaraman Mahalingam, Milton GB
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20100315974 | Mobility In a Wireless Enterprise Network - A method for configuring a network is described, the method comprising: receiving, from a first radio node in the network, network information associated with one or more second radio nodes in the network; generating a network relation table, the network relation table comprising network information associated with the first radio node and the one or more second radio nodes; and performing a handoff to a third radio node in the network using the network relation table. | 12-16-2010 |
Nagi Jayaraman Mahalingam, Nashua, NH US
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20130052989 | SYSTEM AND METHOD FOR LOAD BALANCING IN A COMMUNICATION NETWORK - A system and method for achieving load balancing in a communication network. Each User Equipment (UE) configured to a Femto Access Point (FAP) is grouped under a particular access class based on the quality of service being subscribed to, by the UE. At the time of overloading, each access class is barred access for a particular percent of duty cycle. When an authorized UE requests connection to the FAP, the system checks for an overloading situation. If overloading is detected in the network, the system identifies the access class of that particular UE and checks if that particular access class is authorized to access the FAP at that particular instant of time. If the UE's access class is authorized to access the FAP at that instant of time, the system allow UE to establish connection. | 02-28-2013 |
Sailakshmi Mahalingam, Nashua, NH US
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20140155109 | SUBSCRIBER-AWARE PAGING - This disclosure relates to systems and methods for paging devices in a communication network. A network device providing mobility management through control messaging can be assigned a number of cell sites in multiple tracking areas. The network device such as a mobility management entity (MME) can use a subscriber-aware implementation to provide a hierarchy for contacting a mobile device with a page. The subscriber-aware implementation can be tailored to analyze subscriber activity such as frequency and timing, to page a subset of the total number of cell sites in multiple tracking areas based on the subscriber activity, and to expand the subset after unsuccessful attempts to page the mobile device. | 06-05-2014 |
Sakkarapalayam M. Mahalingam, West Lafayette, IN US
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20140271476 | SYNTHESIS AND COMPOSITION OF AMINO ACID LINKING GROUPS CONJUGATED TO COMPOUNDS USED FOR THE TARGETED IMAGING OF TUMORS - The present disclosure relates to compounds that are useful as near-infrared fluorescence probes, wherein the compounds include i) a pteroyl ligand that binds to a target receptor protein, ii) a dye molecule, and iii) a linker molecule that comprises an amino acid or derivative thereof. The disclosure further describes methods and compositions for making and using the compounds, methods incorporating the compounds, and kits incorporating the compounds. | 09-18-2014 |
20140271482 | SYNTHESIS AND COMPOSITION OF AMINO ACID LINKING GROUPS CONJUGATED TO COMPOUNDS USED FOR THE TARGETED IMAGING OF TUMORS - The present disclosure relates to compounds that are useful as near-infrared fluorescence probes, wherein the compounds include i) a pteroyl ligand that binds to a target receptor protein, ii) a dye molecule, and iii) a linker molecule that comprises an amino acid or derivative thereof. The disclosure further describes methods and compositions for making and using the compounds, methods incorporating the compounds, and kits incorporating the compounds. | 09-18-2014 |
Srikanth Mahalingam, Troy, MI US
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20150310354 | UNIT-BASED LICENSING FOR THIRD PARTY ACCESS OF DIGITAL CONTENT - A method and apparatus for unit-based licensing for third party access of digital content are provided. Unit-based licensing for third party access of digital content may include receiving a request for access to content, the request for access indicating the customer account and a third party, identifying a cardinality of assigned units for the content, identifying a cardinality of available licensing units allocated to the customer account, determining, by a processor, whether the cardinality of the assigned units is within the cardinality of available licensing units, outputting a response indicating that the request is granted on a condition that the cardinality of the assigned units is within the cardinality of available licensing units, and outputting a response indicating that the request is denied on a condition that the cardinality of the assigned units exceeds the cardinality of available licensing units. | 10-29-2015 |
20150363578 | AUTOMATED POPULARITY-BASED PRICING FOR DIGITAL CONTENT LICENSING - A method and apparatus for automated popularity-based pricing for digital content licensing are provided. Automated popularity-based pricing for digital content licensing may include receiving a request for access to content, the request for access indicating a customer account, determining a cardinality of assigned units for the content based on a popularity based assignment index for the content, identifying a cardinality of available licensing units allocated to the customer account, determining whether the cardinality of the assigned units is within the cardinality of the available licensing units, outputting a response indicating that the request is granted, on a condition that the cardinality of the assigned units is within the cardinality of the available licensing units, and outputting a response indicating that the request is denied, on a condition that the cardinality of the assigned units exceeds the cardinality of the available licensing units. | 12-17-2015 |