Patent application number | Description | Published |
20080253095 | Electronic Circuit Assembly, Device Comprising Such Assembly and Method for Fabricating Such Device - An electronic circuit assembly (A | 10-16-2008 |
20100052129 | MULTI-CHIP PACKAGE AND MANUFACTURING METHOD - Manufacturing method and a multi-chip package, which comprises a conductor pattern ( | 03-04-2010 |
20100103635 | SINGLE-LAYER COMPONENT PACKAGE - A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in an installation cavity inside the insulating-material layer, a semiconductor component having flat contact zones; and solid contact pillars containing copper and solderlessly, metallurgically and electrically connecting the flat contact zones to the single conductive-pattern layer. | 04-29-2010 |
20100202114 | ELECTRIC MODULE - An electronic module, comprising: a conductive-pattern layer; an insulating-material layer supporting the conductive-pattern layer; at least one component inside the insulating-material layer, the at least one component comprising a first surface and contact zones on the first surface; a first hardened adhesive layer on the first surface of the at least one component; a second hardened adhesive layer in contact with the conductive-pattern layer and the first hardened adhesive layer; holes in the first and second hardened adhesive layer at the locations of the contact zones; and conductive material in the holes and in electrical connection with the contact zones of the component and the conductive-pattern layer. | 08-12-2010 |
20100202115 | CIRCUIT BOARD INCLUDING AN EMBEDDED COMPONENT - The document describes a circuit board and an electronic module, comprising a conductor-pattern layer, an insulating-material layer supporting the conductor-pattern layer, and at least one component inside the insulating-material layer. The component has a plurality of contact areas and the circuit board or electronic module comprises contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component such that at least two of the contact elements are in direct contact with a common contact area. | 08-12-2010 |
20100202127 | ELECTRONIC MODULE WITH EMI PROTECTION - An electronic module with EMI protection is disclosed. The electronic module comprises a component ( | 08-12-2010 |
20100308452 | ELECTRONIC MODULE WITH FEED THROUGH CONDUCTOR BETWEEN WIRING PATTERNS - The electronic module comprises a dielectric | 12-09-2010 |
20110061909 | CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - Manufacturing method and circuit module, which comprises an insulator layer ( | 03-17-2011 |
20110291293 | METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND AN ELECTRONIC MODULE - This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component ( | 12-01-2011 |
20140059851 | Circuit board structure and method for manufacturing a circuit board structure - The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern. | 03-06-2014 |