Patent application number | Description | Published |
20110227616 | PHASE LOCKED LOOP CIRCUIT, METHOD OF DETECTING LOCK, AND SYSTEM HAVING THE CIRCUIT - Provided are a phase locked loop (PLL) circuit, a lock detector employable with a PLL circuit, a system including such a PLL circuit and/or lock detector, and a method of detecting a lock/unlock state of a PLL circuit. The PLL circuit may include a clock generating circuit configured to generate an output clock signal having a predetermined frequency in synchronization with a reference clock signal. The lock detector may be configured to determine that the PLL circuit is in a lock state when a phase difference between the reference clock signal and the output clock signal is equal to or less than a first reference value, determine that the PLL circuit is in an unlock state when the phase difference between the reference clock signal and the output clock signal is greater than a second reference value, and generate a lock detection signal. | 09-22-2011 |
20110227617 | PHASE LOCKED LOOP CIRCUIT AND SYSTEM HAVING THE SAME - A phase locked loop (PLL) circuit and a system including such a PLL that may at least compensate for leakage current in a loop filter. The PLL circuit may include a voltage adjusting unit configured to pump charges based on a phase difference between an oscillation clock signal and a reference clock signal, a loop filter configured to generate a frequency control voltage, a level of which is shifted by the charge pumping of the voltage adjusting unit, a voltage controlled oscillator (VCO) configured to output the oscillation clock signal having a frequency corresponding to the frequency control voltage, and a current control circuit configured to generate a compensation current corresponding to a leakage current generated by the loop filter and allow the compensation current and the leakage current to substantially and/or completely counterbalance each other. | 09-22-2011 |
20110291726 | DUTY CORRECTING CIRCUIT, DELAY-LOCKED LOOP CIRCUIT INCLUDING THE CIRCUIT, AND METHOD OF CORRECTING DUTY - A duty correcting circuit includes a duty steerer circuit, a differential clock generator, and a charge pump circuit. The duty steerer circuit corrects a duty cycle of an input clock signal in response to a duty control signal and generates an output clock signal. The differential clock generator generates two internal clock signals having a phase difference of 180° from each other based on the output clock signal. The charge pump circuit performs a charge pump operation in a differential mode in response to the internal clock signals to generate a duty control signal. | 12-01-2011 |
Patent application number | Description | Published |
20090179219 | SIDE VIEW TYPE LED PACKAGE - In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body. | 07-16-2009 |
20100133565 | LEAD FRAME, LIGHT EMITTING DIODE HAVING THE LEAD FRAME, AND BACKLIGHT UNIT HAVING THE LIGHT EMITTING DIODE - An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal. | 06-03-2010 |
20100301376 | SIDE VIEW TYPE LED PACKAGE - In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body. | 12-02-2010 |
20100315835 | LEAD FRAME, LIGHT EMITTING DIODE HAVING THE LEAD FRAME, AND BACKLIGHT UNIT HAVING THE LIGHT EMITTING DIODE - An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal. | 12-16-2010 |