Patent application number | Description | Published |
20080253033 | Thin-film magnetic head having electric lapping guide and method of making the same - A magnetic head in which the size of MR height is controlled precisely, a head gimbal assembly and a hard disk drive which are mounted with such a magnetic head, and a method of making a magnetic head in which the size of MR height is controlled precisely. | 10-16-2008 |
20080253037 | Thin-Film Magnetic Head and Manufacturing Method Thereof - A thin-film magnetic head includes a lower magnetic shield layer, an MR multi-layered structure formed on the lower magnetic shield layer so that current flows in a direction perpendicular to surfaces of laminated layers, an insulation layer formed to surround the MR multi-layered structure, an additional metal layer laminated on at least the MR multi-layered structure, an upper electrode layer made of a soft magnetic material laminated on the additional metal layer and the insulation layer, and an upper magnetic shield layer laminated on the upper electrode layer. The additional metal layer has a multi-layered structure including a nonmagnetic metal layer and a soft magnetic layer laminated on the nonmagnetic metal layer, and has a length along a track-width direction of the MR multi-layered structure larger than a width of a magnetization-free layer in the MR effect multi-layered structure. | 10-16-2008 |
20080282532 | Method of making thin film magnetic head using electric lapping guide - As a reticle pattern corresponding to a resist pattern for magnetic detection element layer and a reticle pattern corresponding to a resist pattern for conductive layer in a reticle, a reticle having a convex portion that projects in the height direction and a concave portion that dents in the direction opposite to the convex portion, respectively, is used to form a convex portion and concave portion corresponding to the convex portion and concave portion of the reticle pattern in the resist pattern for magnetic detection element and in the resist pattern for conductive layer, respectively. Then, with each resist pattern as a mask, unnecessary portions of the magnetic detection element layer and conductive layer are removed to determine an initial height of the magnetic detection element layer and an initial height perpendicular to a medium facing surface of the conductive layer, and to form a convex portion and concave portion corresponding to the convex portion and concave portion of the resist pattern in the magnetic detection element layer and in the conductive layer, respectively. Then, based on a ratio between a width in the track width direction of the convex portion of the magnetic detection element layer and a width in the track width direction of the concave portion of the magnetic detection element layer, a deviation in the height direction concerning a surface intersecting the height direction of the magnetic detection element layer is obtained, and based on a ratio between a width in the track width direction of the convex portion of the conductive layer and a width in the track width direction of the concave portion of the conductive layer, a deviation in the height direction concerning a surface intersecting the height direction of the conductive layer is obtained, and then based on the deviation in the height direction of the magnetic detection element layer and the deviation in the height direction of the conductive layer, the medium facing surface is ground with the conductive layer as a resistance sensor so that the height of the magnetic detection element layer be a desired value. | 11-20-2008 |
20080285178 | Thin film magnetic head characterized in bias-applying layer - A thin film magnetic head comprises a lower magnetic shield layer and an upper magnetic shield layer which are mutually opposed in the layering direction, a magnetoresistance effect element having a free layer, and a bias-applying layer which applies a bias magnetic field to the magnetoresistance effect element. The free layer is positioned between the lower magnetic shield layer and the upper magnetic shield layer, and is positioned on the side of the media-opposed surface. The bias-applying layer has a first portion, a second portion, and a third portion. The first portion and the second portion are positioned at a distance in the track width direction so as to enclose the magnetoresistance effect element therebetween. The third portion is positioned either between the magnetoresistance effect element and the lower magnetic shield layer or between the magnetoresistance effect element and the upper magnetic shield layer, and connects the first portion and the second portion. | 11-20-2008 |
20080291582 | Thin film magnetic head, head gimbal assembly, head arm assembly and magnetic disk device - Provided is a thin film magnetic head capable of suppressing an occurrence of a track erase, decreasing an influence on a magnetoresistive element caused by a magnetic flux generated from a thin film coil, and further decreasing the parasitic capacity. The thin film magnetic head has, in order in a stacked direction, a first magnetic shield layer, a magnetoresistive element, a second magnetic shield layer, a third magnetic shield layer, a main magnetic pole layer and a return yoke layer. A width in a track width direction of at least one of the first and the second magnetic shield layers is smaller than widths in a track width direction of the third magnetic shield layer and the return yoke layer. | 11-27-2008 |
20080291583 | Thin film magnetic head comprising metal layer and method of producing the same - A method of producing a thin film magnetic head includes the steps of: forming a pair of openings in a predetermined region of a TMR layer formed on a lower magnetic shield layer; forming a pair of bias-applying layers in the pair of Openings so that an upper surface thereof may be located above an upper surface of the TMR layer; laminating a metal layer that covers the upper surface of a portion located between the pair of bias-applying layers in the TMR layer and the upper surface of the pair of bias-applying layers; forming a resist layer across the upper surface of a portion located above the pair of bias-applying layers in the metal layer and the upper surface of a portion located above the TMR layer in the metal layer; and etching a part of the TMR layer and a part of the pair of bias-applying layers with the resist layer being as a mask. Here, the reflectivity R for the incident light having a wavelength of 248 nm at an interface between the metal layer and the resist layer is set so as to satisfy the condition represented by the following formula (1), and also the magnitude D of a step is set so as to satisfy the condition represented by the following formula (2). | 11-27-2008 |
20080305442 | Patterned material layer, method of forming the same, microdevice, and method of manufacturing the same - A formation method for a patterned material layer comprising a step of exposing a composite layer to light in a predetermined pattern, the composite layer including a first photosensitive resin layer, a protective film, and an upper resin layer; a step of partly removing the exposed composite layer so as to form an opening exposing the substrate and form a groove along the main surface of the substrate on a side face of the opening by depressing the end portion of the upper resin layer on the substrate side, thereby forming a resist frame comprising the composite layer formed with the opening; a step of forming a vacuum coated layer having a material pattern part formed on the substrate in the opening and a part to lift off formed on the resist frame, by vacuum coating process; and a step of removing the part to lift off together with the resist frame, so as to yield a patterned material layer. | 12-11-2008 |
20090145878 | Thin-film patterning method for magnetoresistive device - The thin-film patterning method for a magnetoresistive device comprises forming a functional layer on a substrate; forming a first mask layer above the functional layer; forming a patterned resist on the first mask layer; etching the first mask layer by using the resist; removing the resist; forming a second mask layer by atomic layer deposition, the second mask layer covering a step defined by an edge of the first mask layer; dry-etching the second mask layer in a thickness direction of the substrate so as to leave the second mask layer on a side face of the step; removing the first mask layer so as to expose the functional layer under the first mask; and dry-etching the functional layer by using the second mask layer. | 06-11-2009 |
20090323222 | Thin film magnetic head, magnetic head slider, head gimbal assembly, head arm assembly, magnetic disk device and method of manufacturing thin film magnetic head - In manufacturing the thin film magnetic head, the rear end face of the MR element and the rear end face of a resistive film pattern are determined with high precision using a mask pattern, in which a first opening and a second opening are collectively formed. The first and second openings are located side by side in a track-width direction. The first opening includes a first edge extending across the MR film in the track-width direction, and the second opening includes a second edge located at a given interval, as measured in a direction orthogonal to the track-width direction, from the first edge, and extending in the track-width direction. In the step of polishing for forming a magnetic-recording-medium-facing-surface, the amount of polishing is determined by monitoring the resistance change of the resistive film pattern, thereby reducing the dimension errors in the MR height when manufacturing the MR element. | 12-31-2009 |
20110216430 | MAGNETIC HEAD INCLUDING SENSOR - A magnetic head disposed in a slider arranged with an interval with respect to a magnetic disk includes a sensor that is positioned in a stepped-back position from an air bearing surface facing the magnetic disk, an insulating film that is positioned on the air bearing surface and that covers the sensor; a pair of lead films, the lead films being electrically connected to the sensor such that at least portions of the lead films are exposed on the air bearing surface, and being configured to transfer a temperature change of the air bearing surface to the sensor. | 09-08-2011 |
20110235214 | Magnetoresistive sensor, magnetic head, head gimbal assembly, and disk drive unit with the same - A MR sensor includes a first shielding layer, a second shielding layer, a MR element formed therebetween, and a pair of hard magnet layers respectively placed on two sides of the MR element. The MR element comprises an AFM layer formed on the first shielding layer, a pinned layer formed on the AFM layer and a free layer formed between the pinned layer and the second shielding layer. The free layer is funnel-shaped, which having a first edge facing the air bearing surface and a second edge opposite the first edge, and the first edge has a narrower width than that of the second edge. The structure of the MR sensor can improve MR height control performance, and improve the ESD performance and decrease the PCN and RTN and, in turn, get a more stable performance. The present invention also discloses a magnetic head, a HGA and a disk drive unit. | 09-29-2011 |
20110249363 | MAGNETIC HEAD INCLUDING SENSOR - A magnetic head disposed in a slider, that is arranged at an interval from a magnetic disk includes a sensor disposed in a position that is opposed to the magnetic disk, a heat conductive film that is positioned on an air bearing surface opposed to the magnetic disk, and that is formed so as to overlap the sensor, of which a height in a direction perpendicular to the air bearing surface is more than a height of the sensor, and that transfers a temperature change of the air bearing surface to the sensor, and a pair of lead films electrically connected to the sensor and not electrically connected to the heat conductive film. | 10-13-2011 |
20130236692 | COMPOSITE MATERIAL STRUCTURE, AND AIRCRAFT WING AND AIRCRAFT FUSELAGE PROVIDED THEREWITH - Provided is a composite material structure reinforced against stress concentration in the peripheral edge portions of holes and enabled to be reduced in weight. A wing ( | 09-12-2013 |
20140365629 | INFORMATION PROCESSING SYSTEM - In an information processing system, plural information processing devices are mutually connected by an SMP connection mechanism. Each of the information processing devices includes a control device (FPGA) having a synchronous register that shows the state of a control signal of the information processing device and an internode communication access control unit that transmits first synchronous packets with the content of the synchronous register reflected to the other information processing devices at predetermined time intervals, receives second synchronous packets from the other information processing devices, and reflects the content of the received second synchronous packets on the synchronous register. | 12-11-2014 |