Patent application number | Description | Published |
20080229859 | Eye module - An eye module is provided. The eye module includes a casing, an eyeball and a first driving element. The eyeball having a surface is disposed in the casing. The first driving element leans against the surface and drives the eyeball to rotate by a first friction force generated by rotating the first driving element. | 09-25-2008 |
20080302664 | Apparatus for driving fluid - An apparatus for driving a fluid includes a substrate, at least one electrode group and a controlling unit. The substrate has at least one plane. The electrode group is disposed on the substrate and includes a first electrode, a second electrode and a third electrode. A projecting position of the second electrode on the plane is disposed between that of the first electrode and that of the third electrode. The controlling unit electrically connected to electrode group is for driving the first to third electrodes. When the controlling unit drives the first to third electrodes to make the first and third electrodes have opposite polarities and to make the second and third electrodes have the same polarity, an electric field produced by the electrode group enables the fluid on the substrate to flow from the first electrode to the third electrode. | 12-11-2008 |
20100265216 | OPTICAL TOUCH APPARATUS AND OPERATING METHOD THEREOF - An optical touch apparatus is disclosed. The optical touch apparatus comprises at least one light sensing module and a processing module. The at least one light sensing module is set at a first side of a surface of the optical touch apparatus, and used for receiving at least one light and generating a sensing result according to the condition of receiving the at least one light. The sensing result relates to whether the at least one light is blocked by at least one object above the surface and also relates to a comparing result between the at least one object and a reference region. The reference region is set at an opposite second side of the surface. The processing module determines at least one touch point position corresponding to the at least one object on the surface according to the sensing result. | 10-21-2010 |
20100277413 | DATA INPUTTING APPARATUS AND ELECTRONIC APPARATUS - A data inputting apparatus includes a plurality of keyswitches, an optical module, a sensing module and a processing module. The keyswitches are disposed on the data inputting apparatus. The optical module is disposed on a first side of the data inputting apparatus and is used for emitting a plurality of lights along a first direction, and the lights are corresponding to the keyswitches respectively. The sensing module is disposed on a second side opposite to the first side and is used for receiving the lights and generating a sensing result. The processing module is coupled to the sensing module. When one of the keyswitches is pressed, one of the lights is blocked by the pressed keyswitch resulting in the sensing module adjusting the sensing result, and the position of the pressed keyswitch is determined by the processing module based on the sensing result. | 11-04-2010 |
20130313114 | PORTABLE BIOCHEMICAL TESTING APPARATUS OPERATING METHOD - A method of operating a portable biochemical testing apparatus is disclosed. The portable biochemical testing apparatus includes a light source module, a sample module, a photoconductive material layer, a touch module, and a control module. At least one sample is disposed in the sample module. The photoconductive material layer is disposed between the sample module and the light source module. The touch module generates a driving signal according to a touch action of the user to drive the light source module to emit a light. When the light is emitted to the photoconductive material layer, the photoconductive material layer will generate a photoelectric driving effect. The at least one sample is affected by the photoelectric driving effect and generates a change corresponding to the touch action. | 11-28-2013 |
Patent application number | Description | Published |
20140027893 | CIRCUIT SUBSTRATE FOR MOUNTING CHIP, METHOD FOR MANUFACTURING SAME AND CHIP PACKAGE HAVING SAME - A circuit board includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer has a plurality of through holes passing through. The electrically conductive layer is formed on a surface of the insulation layer and covers the through holes. The electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads. The solder mask layer covers the electrically conductive layer and defines a plurality of openings to expose parts of the electrically conductive layer. Parts of the electrically conductive layer are exposed to the solder mask layer to serve as a plurality of second conductive pads. The second conductive pads are electrically connected to the first conductive pads respectively. This disclosure further relates to a chip package and a method of manufacturing the same. | 01-30-2014 |
20140036465 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via. | 02-06-2014 |
20140078706 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads. | 03-20-2014 |
20140085833 | CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME - A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer. | 03-27-2014 |
20140117553 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body. | 05-01-2014 |
20140185259 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME - A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts. | 07-03-2014 |
20150014849 | CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME - A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a copper foil. A groove is defined in the copper foil and a plurality of contact pads are formed on the surface of the copper foil. A chip including a plurality of electrode pads is received in the groove and a packaging layer is formed on a side of the copper foil. An insulating layer and a conductive pattern layer are formed on the packaging layer in that order, the conductive pattern layer being electrically connected to the contact pads and the electrode pads by a plurality of conductive bumps. Finally, the etching resist layer and the copper foil are removed to obtain a coreless package structure. | 01-15-2015 |
Patent application number | Description | Published |
20080231721 | Image capture systems and methods - Image capture systems and methods for use in a picture-taking device. The system comprises an image sensor and a processing unit. The image sensor captures at least one picture. The processing unit determines whether a specific behavior exists in the picture. If so, the processing unit drives the device to perform a photography process to take an image via the image sensor. | 09-25-2008 |
20090077600 | Mobile computing device and method for switching mobile television channels thereof - A method for switching mobile television channels of a mobile computing device includes the following steps: First, an original channel is played on a screen of the mobile computing device. A first channel number of a first selected channel is received at a first time point. Then, a second channel number of a second selected channel is received at a second time point, wherein a time interval between the first and second time points is less than a predetermined interval for action. A period of time from the second time point to an action time point is counted, wherein the period of time is equal to the predetermined time interval for action. Next, data bursts of the second selected channel are received and buffered from the action time point to a next time point. At last, the second selected channel is played on the screen from the next time point. | 03-19-2009 |
20100172164 | AC Adapter and the Control Method Thereof - An AC adapter including an AC-side plug module and a DC-side connector module coupled to each other is provided. A first voltage-reducing element and a relay are electrically coupled to an AC power supply. An AC-to-DC converter is electrically coupled to the relay. The DC-side connector module has a mechanical switch element electrically coupled to the relay and the first voltage-reducing element. When the DC-side connector module is connected to a device socket, the mechanical switch element is turned on and the relay is enabled, so that the electrical power of the AC power supply is transmitted to the AC-to-DC converter through the enabled relay. When the DC-side connector module is disconnected from the device socket, the mechanical switch element is turned off and the relay is disabled, so that the electrical power of the AC power supply is not transmitted to the AC-to-DC converter. | 07-08-2010 |
Patent application number | Description | Published |
20100314826 | PAPER OUTPUT MECHANISM FOR PAPER FEEDING APPARATUS - A paper output mechanism for an automatic document feeder, including: a seat; a connecting shaft, passed through the seat; and a paper feeding roller, placed around the connecting shaft, and including: a shaft portion; a roller portion, placed around the shaft portion; and adapted to convey a document, and an elastic element, placed around the shaft portion, and one end thereof being connected to the seat. | 12-16-2010 |
20100314829 | SUPPORTING PLATE FOR AUTOMATIC DOCUMENT FEEDER AND PAPER OUTPUT MECHANISM USING SAME - A supporting plate for an automatic document feeder, adapted to configure a plurality of paper feeding rollers installed correspondingly to a plurality of transmission wheels, and used for transmitting a document to a paper output tray, the supporting plate including a plate body, including a plurality of accepting holes and adapted to install the plurality of paper feeding rollers, the plurality of paper feeding rollers and the plurality of transmission wheels drive the document move along a paper output direction toward the paper output tray; and a plurality of supporting portions, disposed at sides of the plurality of accepting holes along the paper output direction, and used for supporting the document to cause the document to form a curved body while being moved. A paper output mechanism using the aforementioned supporting plate is also disclosed here. | 12-16-2010 |
Patent application number | Description | Published |
20120097429 | PACKAGE SUBSTRATE AND FABRICATION METHOD THEREOF - A package substrate includes: a dielectric layer having two opposite surfaces; a wiring layer embedded in the dielectric layer and exposed from the two opposite surfaces of the dielectric layer, wherein the wiring layer has solder pads, conductive pads and circuit wires electrically connecting the solder pads and the conductive pads; and a first insulating protection layer disposed on one of the two opposite surfaces of the dielectric layer to cover the dielectric layer and the wiring layer and having a plurality of openings for exposing the conductive pads, respectively. The package substrate, by directly using the dielectric layer as a base, provides a package substrate having reduced thickness and lower fabrication costs compared to the prior art. | 04-26-2012 |
20120097430 | PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME - A packaging substrate and a method of fabricating the packaging substrate. The packaging substrate includes: a dielectric layer that has an external contact surface and an opposing chip mounting surface; a circuit layer that is embedded in the dielectric layer and exposed from the external contact surface and the chip mounting surface, the circuit layer having wire-bonding pads, conductive pads, and a circuit that electrically connects the wire-bonding pads and the conductive pads, wherein the widths of the wire-bonding pads, conductive pads, and the circuit narrow gradually from chip mounting surface to the external contact surface; and a first insulating protective layer disposed on the external contact surface of the dielectric layer and covering the dielectric layer and the circuit layer, a plurality of conductive pad openings being formed in the first insulating protective layer for exposing the conductive pads. The dielectric layer is used directly as a foundation of the packaging substrate, thereby providing advantage in miniaturization, simpler fabrication procedure, and thus low cost production. | 04-26-2012 |
20120120609 | PACKAGE STRUCTURE HAVING A SEMICONDUCTOR COMPONENT EMBEDDED THEREIN AND METHOD OF FABRICATING THE SAME - A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a manner that the semiconductor chip protrudes from the second surface, and having an active surface and an inactive surface opposing the active surface, electrode pads being disposed on the active surface and in the first dielectric layer, the inactive surface and a part of a side surface adjacent the inactive surface protruding from the second surface; a first circuit layer disposed on the first surface; a built-up structure disposed on the first surface and the first circuit layer; and an insulating protective layer disposed on the built-up structure, a plurality of cavities being formed in the insulating protective layer for exposing a part of a surface of the built-up structure. The package structure includes only one built-up structure. | 05-17-2012 |