Patent application number | Description | Published |
20100314783 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 12-16-2010 |
20110065043 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 03-17-2011 |
20110065260 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 03-17-2011 |
20110079927 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 04-07-2011 |
20110193244 | ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE - An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape to be laminated, can reduce a thermal stress such as warpage of a wafer, can simplify a step of manufacturing a semiconductor device, and is excellent in heat resistance and humidity resistance reliance, an adhesive sheet in which the adhesive film and a dicing tape are laminated, as well as a semiconductor device. | 08-11-2011 |
20120133061 | PHOTOSENSITIVE ADHESIVE, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE, WHICH ARE MADE USING SAME - To provide a photosensitive adhesive which is sufficiently excellent in terms of all the properties of attachment, pattern formability, thermocompression bondability and high-temperature adhesion, and which has thermocompression bondability for adherends after patterning by exposure and development, and is capable of alkali development, as well as a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer and a semiconductor device, which employ the same. A photosensitive adhesive comprising (A) an imide group-containing resin with a fluoroalkyl group, (B) a radiation-polymerizable compound, (C) a photoinitiator and (D) a thermosetting component. | 05-31-2012 |
20120202015 | METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN - The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed. | 08-09-2012 |
20120248632 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE - The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa. | 10-04-2012 |
20120248634 | METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - The method for manufacturing a film-like adhesive according to the present invention includes: applying an adhesive composition comprising (A) a radiation-polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, and having a solvent content of 5% by mass or lower and being liquid at 25° C., on a base material to thereby form an adhesive composition layer; and irradiating the adhesive composition layer with light to thereby form the film-like adhesive. | 10-04-2012 |
20120256326 | ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF - Disclosed is an adhesive composition used for adhesion of a semiconductor chip which contains a radiation polymerizable compound, a photoinitiator, and a thermosetting resin. When the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm | 10-11-2012 |
20120263946 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER - Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween. | 10-18-2012 |
Patent application number | Description | Published |
20100143673 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation. | 06-10-2010 |
20100178501 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME - An adhesive composition that is capable of achieving a superior combination of process characteristics such as adherend fill properties (embedability) and low-temperature lamination properties, and semiconductor device reliability such as reflow resistance, as well as a film-like adhesive, an adhesive sheet that exhibits excellent process characteristics including ready releasability from dicing sheets, and a semiconductor device that exhibits excellent productivity, superior adhesive strength when heated and superior moisture resistance, all of which use the adhesive composition. The adhesive composition comprises (A) a thermoplastic resin, (B) a bisallylnadimide represented by a general formula (I) shown below, and (C) a bifunctional or higher (meth)acrylate compound. | 07-15-2010 |
20100239858 | FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME - An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins. | 09-23-2010 |
20100295190 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A photosensitive adhesive composition comprising (A) an alkali-soluble polymer, (B) a thermosetting resin, (C) one or more radiation-polymerizable compounds and (D) a photoinitiator, wherein the 5% weight reduction temperature of the mixture of all of the radiation-polymerizable compounds in the composition is 200° C. or higher. | 11-25-2010 |
20110031631 | PHOTOSENSITIVE ADHESIVE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device | 02-10-2011 |
20110045639 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 02-24-2011 |
20110121435 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater. | 05-26-2011 |
20110151195 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION - There is provided a photosensitive adhesive composition having a lowest melt viscosity at 20° C. to 200° C. after pattern formation of 30,000 Pa·s or lower. | 06-23-2011 |
20110159238 | PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT - A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T | 06-30-2011 |
20110187009 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100° C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group. | 08-04-2011 |
20110223397 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - The invention provides a semiconductor device comprising a semiconductor element and an adherend, thermocompression bonded via a patterned photosensitive film adhesive, wherein the water content of the patterned photosensitive film adhesive just before thermocompression bonding is no greater than 1.0 wt %, with the aim of providing a semiconductor device exhibiting excellent heat resistance. | 09-15-2011 |
20120282547 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 11-08-2012 |
20130062787 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 03-14-2013 |
Patent application number | Description | Published |
20090048835 | FEATURE EXTRACTING APPARATUS, COMPUTER PROGRAM PRODUCT, AND FEATURE EXTRACTION METHOD - A feature extracting apparatus includes a spectrum calculator that calculates a logarithmic frequency spectrum including frequency components obtained from an input speech signal at regular intervals on a logarithmic frequency scale of a frame; a function calculator that calculates a cross-correlation function between a logarithmic frequency spectrum of a time and a logarithmic frequency spectrum of one or plural times included in a certain temporal width before and after the time, from a sequence of the logarithmic frequency spectra calculated at each time; and a feature extractor that extracts a set of the cross-correlation functions as a local and relative fundamental-frequency pattern feature at the frame. | 02-19-2009 |
20100063322 | NOVEL POLYAMINE DERIVATIVES - A compound having the general formula (I) or a pharmacologically acceptable salt thereof: | 03-11-2010 |
20140006007 | SPEECH TRANSLATION APPARATUS, METHOD AND PROGRAM | 01-02-2014 |
20150199341 | SPEECH TRANSLATION APPARATUS, METHOD AND PROGRAM - According to one embodiment, a speech translation apparatus includes a speech recognition unit, a translation unit, a search unit and a selection unit. The speech recognition unit successively performs speech recognition to obtain a first language word string. The translation unit translates the first language word string into a second language word string. The search unit search for at least one similar example and acquires the similar example and a translation example. The selection unit selects, in accordance with a user instruction, at least one of the first language word string associated with the similar example and the second language word string associated with the translation example, as a selected word string. | 07-16-2015 |
Patent application number | Description | Published |
20080243508 | Prosody-pattern generating apparatus, speech synthesizing apparatus, and computer program product and method thereof - Normalization parameters are generated at a normalization-parameter generating unit by calculating the mean values and the standard deviations of an initial prosody pattern and a prosody pattern of a training sentence of a speech corpus. Then, the variance range or variance width of the initial prosody pattern is normalized at the prosody-pattern normalizing unit in accordance with the normalization parameters. As a result, a prosody pattern similar to speech of human beings and improved in naturalness can be generated with a small amount of calculation. | 10-02-2008 |
20090222259 | APPARATUS, METHOD AND COMPUTER PROGRAM PRODUCT FOR FEATURE EXTRACTION - A feature extraction apparatus includes a spectrum calculating unit that calculates, based on an input speech signal, a frequency spectrum having frequency components obtained at regular intervals on a logarithmic frequency scale for each of frames that are defined by regular time intervals, and thereby generates a time series of the frequency spectrum; a cross-correlation coefficients calculating unit that calculates, for each target frame of the frames, a cross-correlation coefficients between frequency spectra calculated for two different frames that are in vicinity of the target frame and a predetermined frame width apart from each other; and a shift amount predicting unit that predicts a shift amount of the frequency spectra on the logarithmic frequency scale with respect to the predetermined frame width by use of the cross-correlation coefficients. | 09-03-2009 |
20140067393 | MODEL LEARNING DEVICE, MODEL GENERATION METHOD, AND COMPUTER PROGRAM PRODUCT - According to an embodiment, a model learning device learns a model having a full covariance matrix shared among a plurality of Gaussian distributions. The device includes a first calculator to calculate, from training data, frequencies of occurrence and sufficient statistics of the Gaussian distributions contained in the model; and a second calculator to select, on the basis of the frequencies of occurrence and the sufficient statistics, a sharing structure in which a covariance matrix is shared among Gaussian distributions, and calculate the full covariance matrix shared in the selected sharing structure. | 03-06-2014 |
Patent application number | Description | Published |
20130179158 | Speech Feature Extraction Apparatus and Speech Feature Extraction Method - According to one embodiment, a speech feature extraction apparatus includes an extraction unit and a calculation unit. The extraction unit extracts speech segments over a predetermined period at intervals of a unit time from either an input speech signal or a plurality of subband input speech signals obtained by extracting signal components of a plurality of frequency bands from the input speech signal, to generate either a unit speech signal or a plurality of subband unit speech signals. The calculation unit calculates either each average time of the unit speech signal in each of the plurality of frequency bands or each average time of each of the plurality of subband unit speech signals to obtain a speech feature. | 07-11-2013 |
20140257810 | PATTERN CLASSIFIER DEVICE, PATTERN CLASSIFYING METHOD, COMPUTER PROGRAM PRODUCT, LEARNING DEVICE, AND LEARNING METHOD - According to an embodiment, a pattern classifier device includes a decision unit, an execution unit, a calculator, and a determination unit. The decision unit is configured to decide a subclass to which the input pattern is to belong, based on attribute information of the input pattern. The execution unit is configured to determine whether the input pattern belongs to a class that is divided into subclasses, using a weak classifier allocated to the decided subclass, and output a result of the determination and a reliability of the weak classifier. The calculator is configured to calculate an integrated value obtained by integrating an evaluation value based on the determination result and the reliability. The determination unit is configured to repeat the determination processing when a termination condition of the determination processing is not satisfied, and terminate the determination processing and output the integrated value when the termination condition, has been satisfied. | 09-11-2014 |