Patent application number | Description | Published |
20080252689 | LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a liquid discharge head including an energy generating element, which generates energy utilized for discharging a liquid, and a discharge portion provided at a position facing the energy generating element and having a discharge port for discharging the liquid is provided. This method includes the steps of forming a negative photosensitive resin layer used for a member that forms the discharge port on the substrate, and exposing the layer to an i-line to form the discharge portion that is tapered in a direction from the substrate to the discharge port, wherein the layer has an absorbance per 1 μm thickness of about 0.02 to about 0.07 for light used for the exposure. | 10-16-2008 |
20080292993 | PHOTO-CATIONIC POLYMERIZABLE EPOXY RESIN COMPOSITION, LIQUID DISCHARGE HEAD, AND MANUFACTURING METHOD THEREOF - A liquid discharge head having a substrate provided with energy generating elements for generating energy to discharge a liquid, discharge portions including discharge ports for discharging the liquid, and flow paths supplying the liquid to the discharge portions and a method for its manufacture are provided. The method includes the steps of forming a layer of a negative type photosensitive resin on the substrate, and exposing the layer to light having a wavelength of 365 nm to form the discharge portions. | 11-27-2008 |
20090095708 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A method for manufacturing a liquid discharge head including a substrate on which supply ports for supplying a liquid are provided, includes forming a first supply port among the supply ports by performing crystal anisotropic etching on the substrate from one surface of the substrate, and forming a plurality of second supply ports among the supply ports by performing dry etching on the substrate using a crystal anisotropic etching method from a surface exposed toward the one surface of the substrate to a rear surface so that the independent second supply ports are respectively opened on the rear surface. | 04-16-2009 |
20090133256 | MANUFACTURING METHOD OF LIQUID EJECTION HEAD - A manufacturing method of a liquid ejection head provided with a flow passage communicating with an ejection outlet for ejecting liquid includes steps of preparing a substrate on which a flow passage wall forming member for forming a part of a wall of the flow passage and a solid layer having a shape of a part of the flow passage contact each other, wherein the flow passage wall forming member has a height, from a surface of the substrate, substantially equal to that of the solid layer; providing on the solid layer a pattern having a shape of another part of the flow passage; providing a coating layer, for forming another part of the wall of the flow passage, so as to coat the pattern; providing the ejection outlet to the coating layer; and forming the flow passage by removing the solid layer and the pattern. | 05-28-2009 |
20090136875 | MANUFACTURING METHOD OF LIQUID EJECTION HEAD - A manufacturing method of a liquid ejection head including an ejection outlet forming member provided with an ejection outlet for ejecting liquid and a flow passage communicating with the ejection outlet is constituted by the steps of: preparing a substrate on which a flow passage wall forming member for forming a part of a wall of the flow passage and a solid layer having a shape of a part of the flow passage contact each other, wherein the flow passage wall forming member has a height, from a surface of the substrate, substantially equal to that of the solid layer; providing a first layer, on the solid layer and the flow passage wall forming member, formed of a negative photosensitive resin material for forming another part of the wall of the flow passage; exposing to light a portion of the first layer correspondingly to the another part of the wall of the flow passage; providing a second layer, on the exposed first layer, formed of a negative photosensitive resin material to constitute the ejection outlet forming member; exposing to light a portion of the second layer correspondingly to the ejection outlet forming member; and forming the ejection outlet and another part of the flow passage by removing unexposed portions of the first layer and the second layer. | 05-28-2009 |
20100149260 | INK JET HEAD AND METHOD OF MANUFACTURING THE SAME - An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other. | 06-17-2010 |
20100156990 | LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE LIQUID DISCHARGE HEAD - A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from first surface to rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a <100> direction the first surface; and forming a plurality of the supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate. | 06-24-2010 |
20110108532 | LASER PROCESSING METHOD - Provided is a laser processing method capable of improving precision of a processing shape and degree of freedom of the processing shape. When a recess portion is formed in a substrate (W) which is an object to be processed, an inner portion of the substrate (W) is scanned with a condensing point (L | 05-12-2011 |