Patent application number | Description | Published |
20080309355 | VOLTAGE CLAMP CIRCUIT AND SEMICONDUCTOR DEVICE, OVERCURRENT PROTECTION CIRCUIT, VOLTAGE MEASUREMENT PROBE, VOLTAGE MEASUREMENT DEVICE AND SEMICONDUCTOR EVALUATION DEVICE RESPECTIVELY USING THE SAME - In a voltage clamp circuit, a normally-on type field-effect transistor having a negative threshold voltage has a drain connected to an input node, a source connected to an output node and grounded via a resistance element, and a gate supplied with an output voltage of a variable direct-current power supply. When a voltage at the output node becomes higher than a clamping voltage because of voltage drop of the resistance element, the field-effect transistor is tuned off. Accordingly, the output voltage is limited to be at most the clamping voltage. Thus, a response speed is higher than those of conventional voltage clamp circuits using diodes or the like. | 12-18-2008 |
20090206373 | FIELD EFFECT TRANSISTOR - A field effect transistor includes a GaN epitaxial substrate, a gate electrode formed on an electron channel layer of the substrate, and source and drain electrodes arranged spaced apart by a prescribed distance on opposite sides of the gate electrode. The source and drain electrodes are in ohmic contact with the substrate. At an upper portion of the gate electrode, a field plate is formed protruding like a visor to the side of drain electrode. Between the electron channel layer of the epitaxial substrate and the field plate, a dielectric film is formed. The dielectric film is partially removed at a region immediately below the field plate, to be flush with a terminal end surface of the field plate. The dielectric film extends from a lower end of the removed portion to the drain electrode, to be overlapped on the drain electrode. | 08-20-2009 |
Patent application number | Description | Published |
20100308373 | FIELD-EFFECT TRANSISTOR - A field-effect transistor provided with a substrate, a channel layer, a carrier supply layer, a source electrode, a drain electrode, a gate electrode, a first insulating layer that is laminated on the carrier supply layer between the source electrode and the drain electrode, and suppresses current collapse, an opening that is formed between an edge of the first insulating layer opposing the drain electrode and the drain electrode, and a second insulating layer that is laminated on the carrier supply layer exposed in the opening. | 12-09-2010 |
20110133205 | FIELD-EFFECT TRANSISTOR - A field-effect transistor provided with a channel layer, a carrier supply layer forming a heterojunction with the channel layer, a recessed portion recessed from a surface of the carrier supply layer, a first insulating layer formed at least along the recessed portion, a first gate electrode formed on the first insulating layer, a source electrode formed on one side of the recessed portion in a channel lengthwise direction, and a drain electrode formed on an opposite side of the recessed portion in the channel lengthwise direction. The recessed portion snakes in a direction intersecting the channel lengthwise direction, in the range of a channel length between the source electrode and the drain electrode. | 06-09-2011 |
20130306984 | NORMALLY-OFF-TYPE HETEROJUNCTION FIELD-EFFECT TRANSISTOR - A normally-off-type HFET includes an undoped Al | 11-21-2013 |
20140367742 | NORMALLY-OFF-TYPE HETEROJUNCTION FIELD-EFFECT TRANSISTOR - A normally-off-type HFET includes: an undoped Al | 12-18-2014 |
Patent application number | Description | Published |
20100314663 | SEMICONDUCTOR DEVICE - One embodiment of a semiconductor device according to the present invention includes a substrate, a base compound semiconductor layer layered on the substrate to form a base, a channel defining compound semiconductor layer layered on the base compound semiconductor layer to define a channel, and an impact ionization control layer that is layered within a layering range of the base compound semiconductor layer and controls the location of impact ionization, wherein the base compound semiconductor layer is formed of a first compound semiconductor, the channel defining compound semiconductor layer is formed of a second compound semiconductor, and the impact ionization control layer is formed of a third compound semiconductor that has a smaller band gap than the first compound semiconductor. | 12-16-2010 |
20130009166 | SEMICONDUCTOR DEVICE - One embodiment of a semiconductor device according to the present invention includes a substrate, a base compound semiconductor layer layered on the substrate to form a base, a channel defining compound semiconductor layer layered on the base compound semiconductor layer to define a channel, and an impact ionization control layer that is layered within a layering range of the base compound semiconductor layer and controls the location of impact ionization, wherein the base compound semiconductor layer is formed of a first compound semiconductor, the channel defining compound semiconductor layer is formed of a second compound semiconductor, and the impact ionization control layer is formed of a third compound semiconductor that has a smaller band gap than the first compound semiconductor. | 01-10-2013 |