Patent application number | Description | Published |
20080203512 | Image sensor chip package - A chip package includes a carrier ( | 08-28-2008 |
20080251875 | SEMICONDUCTOR PACKAGE - An exemplary semiconductor package includes a substrate, at least one passive component, an insulative layer and a chip. The substrate defines a cavity therein. The at least one passive component is disposed within the cavity, and is electrically connected to the substrate. The insulative layer is received in the cavity, and encases the at least one passive component. The chip is disposed on the insulative layer, and is electrically connected to the substrate. The semiconductor package packaging the at least one passive component within the cavity and under the chip can improve a space usage thereof, thus a packaging scale of the semiconductor package could be reduced. | 10-16-2008 |
20080252760 | COMPACT IMAGE SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - An exemplary image sensor package includes a base, an image sensor chip, a bonding layer, and an imaging lens. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area with the bonding layer. The imaging lens is configured for forming images on the photosensitive area. The present invention also relates to a method for manufacturing the image sensor package. | 10-16-2008 |
20080252771 | CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME - An exemplary camera module includes a lens module, a base, an image sensor chip, a bonding layer, and an imaging lens. The lens module is disposed on the base. The lens module is optically aligned with the image sensor chip. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area. The imaging lens is configured for focusing light signals onto the photosensitive area. The present invention also relates to a method for manufacturing the camera module. | 10-16-2008 |
20080265350 | IMAGE CAPTURING DEVICE - An image capturing device includes an image sensor package and a lens module aligned with the image sensor package. The image sensor package includes a substrate, at least one passive component, an insulative layer, and an image sensor. The substrate has a surface facing an object side of the image capturing device, the surface defines a cavity therein. The at least one passive component is disposed within the cavity and electrically connected to the substrate. The insulative layer is received in the cavity and encases the at least one passive component. The image sensor is disposed on the insulative layer and electrically connected to the substrate. The holder has an end connecting with the barrel and an opposite end secured on the substrate. | 10-30-2008 |
20080266822 | ELECTRONIC ELEMENTS CARRIER AND MANUFACTURING METHOD THEREOF - An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element. | 10-30-2008 |
20090122176 | IMAGING MODULE PACKAGE - An exemplary imaging module package includes a lens module and an imaging sensor module. The lens module includes a housing having a hollow top portion and a hollow bottom portion coaxially aligned with the hollow top portion. The imaging sensor module is received in the hollow bottom portion. The imaging sensor module includes an imaging sensor connected to the substrate and secured to the bottom portion, a substrate spaced from the bottom portion and defining at least one recess therein, and a plurality of passive components received in the at least one recess and wholly disposed below the imaging sensor. | 05-14-2009 |
20090135297 | CAMERA MODULE - An exemplary camera module includes a substrate, a printed circuit board, an imaging sensor chip, and a lens module. The substrate defines a top surface and a recessed portion in the top surface. The printed circuit board defines a bottom surface soldered to the top surface of the substrate. The imaging sensor chip is received in the recessed portion of the substrate. The lens module is positioned above the imaging sensor chip, with an optical center thereof aligned with that of the imaging sensor chip. | 05-28-2009 |
20090153706 | IMAGING MODULE PACKAGE - An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip. | 06-18-2009 |
20090166833 | SEMICONDUCTOR UNIT WHICH INCLUDES MULTIPLE CHIP PACKAGES INTEGRATED TOGETHER - A semiconductor unit includes an interface plate, a supporting plate integrally formed with the interface plate, two chip packages positioned at opposite sides of the supporting plate, and leading traces running in the interface plate and the supporting plate, connected with the chip packages respectively. | 07-02-2009 |
20090166837 | COMBINATION OF CHIP PACKAGE UNITS - A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination. | 07-02-2009 |
20090262226 | IMAGE SENSOR PACKAGE AND CAMERA MODULE HAVING SAME - An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein. | 10-22-2009 |
20090267206 | STACKED SEMICONDUCTOR PACKAGE - A stacked semiconductor package includes a circuit board with a number of pads disposed thereon, and a number of package units stacked on the circuit board. Each of the package units includes a substrate, a chip, an anisotropic conductive layer, and a number of conductive elements. The substrate has a first surface facing to the circuit board and a second surface opposite to the first surface, both of the first surface and the second surface have a number of pads disposed thereon. The chip is disposed on the substrate and electrically connected with the substrate. The anisotropic conductive layer is disposed between the substrate and the chip, and is capable of fixing the chip on the substrate. The conductive elements electrically connect the pads on the first surface of the substrate with the pads on the second surface of an adjacent substrate and the pads on the circuit board. | 10-29-2009 |
20090283662 | IMAGE SENSOR PACKAGE, CAMERA MODULE HAVING SAME AND MANUFACTURING METHOD FOR THE SAME - An exemplary image sensor package includes a substrate, an imaging area, a circuit layer and two passive components. The substrate has a first surface and a second surface, which are opposite to each other. An image sensing area is formed on the first surface of the substrate and a circuit layer is formed on the second surface of the substrate. The passive components opposite to the image sensing area are soldered to the circuit layer of the second surface. | 11-19-2009 |
20090284628 | IMAGE SENSOR PACKAGE AND CAMERA MODULE UTILIZING THE SAME - An image sensor package includes an image sensor chip, a sidewall, an encapsulation glass, conductive material, and a plurality of solder balls. The image sensor chip comprises a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area. The sidewall is located on the non-photosensitive are and defines a plurality of first through holes aligned with and corresponding to the bonding pads. The encapsulation glass is located on the sidewall. A plurality of solder balls are formed on the encapsulation glass aligned with the bonding pads, respectively. The encapsulation glass defines a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball. The image sensor package further comprises a conductive material through which the first and second through holes penetrate. | 11-19-2009 |