Patent application number | Description | Published |
20080210997 | Solid-state image pickup device and manufacturing method thereof - A solid-state image pickup device is provided in which a pixel forming region 4 and a peripheral circuit forming region | 09-04-2008 |
20090311823 | SOLID-STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD THEREOF - A solid-state image pickup device is provided in which a pixel forming region | 12-17-2009 |
20100141815 | SEMICONDUCTOR IMAGE SENSOR MODULE, METHOD FOR MANUFACTURING THE SAME AS WELL AS CAMERA AND METHOD FOR MANUFACTURING THE SAME - A semiconductor image sensor module and a method for manufacturing thereof as well as a camera and a method for manufacturing thereof are provided in which a semiconductor image sensor chip and an image signal processing chip are connected with a minimum parasitic resistance and parasitic capacity and efficient heat dissipation of the image signal processing chip and shielding of light are simultaneously obtained. | 06-10-2010 |
20100155582 | SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME, ELECTRONIC EQUIPMENT, AND SEMICONDUCTOR DEVICE - A solid-state imaging device includes: a photodiode formed to be segmented with respect to each pixel in a pixel area in which plural pixels are integrated on a light receiving surface of a semiconductor substrate; an insulator film formed on the semiconductor substrate to cover the photodiode; a recessed part formed with respect to each of the pixels in the insulator film in an upper part of the photodiode; a first light transmission layer of a siloxane resin formed to fill the recessed part and configure an optical waveguide in the pixel area; a second light transmission layer formed to configure an on-chip lens with respect to each of the pixels in the pixel area; and a guard ring formed to surround an outer circumference of the pixel area to partition an inner area containing the pixel area and an outer dicing area. | 06-24-2010 |
20100167449 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME - A solid-state imaging device with a semiconductor substrate; a pixel formation region in the substrate and including a pixel made of a photoelectric conversion element; and an element isolation portion in the substrate and including an element isolation insulating layer and an impurity element isolation region. The element isolation insulating layer is positioned in a surface of the substrate. The impurity element isolation region is positioned under the element isolation insulating layer and within the substrate. The impurity element isolation region has at least a portion with a width that is narrower than that of the element isolation insulating layer. The photoelectric conversion element extends to a position under the element isolation insulating layer of the element isolation portion. | 07-01-2010 |
20110024858 | SOLID-STATE IMAGING DEVICE AND METHOD FOR PRODUCING THE SAME - A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate. | 02-03-2011 |
20120056288 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS - A semiconductor device includes: a first semiconductor chip; and a second semiconductor chip that is stacked on the first semiconductor chip. The first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip. The second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip. The respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer. | 03-08-2012 |
20120146173 | METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS - The present disclosure provides a method of manufacturing a solid-state imaging device, including, forming on a first substrate a semiconductor thin film which is to be photoelectric conversion sections, forming driving circuits on a face side of a second substrate, laminating the first substrate and the second substrate by disposing the first substrate and second substrate opposite to each other in a condition in which the semiconductor thin film is connected to the driving circuits, and removing the first substrate from the semiconductor thin film in a condition in which the semiconductor thin film is left on the second substrate side. | 06-14-2012 |
20120261554 | SEMICONDUCTOR IMAGE SENSOR MODULE, METHOD FOR MANUFACTURING THE SAME AS WELL AS CAMERA AND METHOD FOR MANUFACTURING THE SAME - A semiconductor image sensor module | 10-18-2012 |
20130264673 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME - A solid-state imaging device with a semiconductor substrate; a pixel formation region in the substrate and including a pixel made of a photoelectric conversion element; and an element isolation portion in the substrate and including an element isolation insulating layer and an impurity element isolation region. The element isolation insulating layer is positioned in a surface of the substrate. The impurity element isolation region is positioned under the element isolation insulating layer and within the substrate. The impurity element isolation region has at least a portion with a width that is narrower than that of the element isolation insulating layer. The photoelectric conversion element extends to a position under the element isolation insulating layer of the element isolation portion. | 10-10-2013 |
20130328144 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS - A semiconductor device includes: a first semiconductor chip; and a second semiconductor chip that is stacked on the first semiconductor chip. The first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip. The second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip. The respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer. | 12-12-2013 |
20140035088 | SEMICONDUCTOR IMAGE SENSOR MODULE, METHOD FOR MANUFACTURING THE SAME AS WELL AS CAMERA AND METHOD FOR MANUFACTURING THE SAME - A semiconductor image sensor module | 02-06-2014 |
20140306313 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS - A semiconductor device includes: a first semiconductor chip; and a second semiconductor chip that is stacked on the first semiconductor chip. The first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip. The second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip. The respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer. | 10-16-2014 |
20150041872 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME - A solid-state imaging device with a semiconductor substrate; a pixel formation region in the substrate and including a pixel made of a photoelectric conversion element; and an element isolation portion in the substrate and including an element isolation insulating layer and an impurity element isolation region. The element isolation insulating layer is positioned in a surface of the substrate. The impurity element isolation region is positioned under the element isolation insulating layer and within the substrate. The impurity element isolation region has at least a portion with a width that is narrower than that of the element isolation insulating layer. The photoelectric conversion element extends to a position under the element isolation insulating layer of the element isolation portion. | 02-12-2015 |
Patent application number | Description | Published |
20110099912 | Vehicle Door Frame Structure - A vehicle door frame structure has an upper sash member located along a roof panel of a vehicle body and also has a vertical pillar sash member located along a center pillar of the vehicle body. The upper sash member has, at its linear end joined to the vertical pillar sash member side, an aesthetically designed section and an inner frame portion. The aesthetically designed section is located on the outer side of the door, and the inner frame portion is located closer to the vehicle interior than the aesthetically designed section and is shorter in length than the aesthetically designed section. The vertical pillar sash member has at its upper end a superposed contact section that is superposed, in the direction of the thickness of the door, on an end of the inner frame portion of the upper sash member, and the superposed contact section and the inner frame portion are joined together while being superposed on each other. | 05-05-2011 |
20130205912 | METHOD AND APPARATUS FOR BENDING LONG MEMBER, AND METHOD FOR BENDING DOOR FRAME - A method of bending a long member includes applying a tensile force to the long member to draw out the long member in a lengthwise direction thereof, measuring a displacement of the long member after commencement of the application of the initial tensile force, and bending the long member by applying a correction tensile force and a bending pressure for bending the long member into a curved shape in the lengthwise direction simultaneously to the long member upon the displacement exceeding a predetermined tensile fracture threshold value within a predetermined period of time or after a lapse of the predetermined period of time without the displacement exceeding the tensile fracture threshold value. The correction tensile force is smaller than the tensile force at the time the displacement exceeds the tensile fracture threshold value or the tensile force at the lapse of the predetermined period of time. | 08-15-2013 |
20140021739 | VEHICLE DOOR FRAME STRUCTURE - A door frame structure of a vehicle door which includes an upright pillar sash and an upper sash, wherein joining end surfaces of the upright pillar sash and the upper sash are welded together along a periphery thereof, at least one of the upright pillar sash and the upper sash includes a frame body portion and a cantilever protrusion, the joining end surface of the one of the upright pillar sash and the upper sash partly including the frame body portion and the cantilever protrusion. The upright pillar sash and the upper sash are welded to each other along the frame body portion and a base portion of the cantilever protrusion which is connected to the frame body portion. A leading end portion of the cantilever protrusion which is positioned on the leading end side is not welded. | 01-23-2014 |
20140291298 | METHOD OF WELDING PLATED STEEL SHEET AND RAW STEEL SHEET AND METHOD OF WELDING VEHICLE DOOR SASH - A method of spot-welding portions of a plated steel sheet and a raw steel sheet which are overlaid on each other, the spot-welding method includes preparing a flat electrode and a radius electrode serving as a pair of welding electrodes, bringing the flat electrode and the radius electrode into contact with the portions of the plated steel sheet and the raw steel sheet, respectively, with the portions of the plated steel sheet and the raw steel sheet overlaid on each other, and performing a spot-welding process by passing a welding current through the flat electrode and the radius electrode to spot-weld the portions of the plated steel sheet and the raw steel sheet to each other while applying pressure on the portions of the plated steel sheet and the raw steel sheet by the flat electrode and the radius electrode. | 10-02-2014 |
20150197072 | JOINED BODY OF DISSIMILAR ALUMINUM ALLOY MATERIALS, AND VEHICLE DOOR - A joined body of dissimilar aluminum alloy materials includes a first Al—Mg—Si aluminum alloy material, a second Al—Mg—Si aluminum alloy material, and a single Al—Mg aluminum alloy material. The joined body of dissimilar aluminum alloy materials is formed by welding the first Al—Mg—Si aluminum alloy material and the second Al—Mg—Si aluminum alloy material to the single Al—Mg aluminum alloy material. The Al—Mg aluminum alloy material and the first Al—Mg—Si aluminum alloy material are joined by arc welding. The Al—Mg aluminum alloy material and the second Al—Mg—Si aluminum alloy material are joined by friction-stir welding. | 07-16-2015 |
Patent application number | Description | Published |
20140370426 | NON-MAGNETIC SINGLE-COMPONENT TONER, ELECTROSTATIC CHARGE IMAGE DEVELOPER, AND PROCESS CARTRIDGE - A non-magnetic single-component toner includes a toner base particle that contains at least a binder resin and a colorant, and an external additive, wherein the external additive includes an organic particle and an inorganic particle, the binder resin contains at least an amorphous polyester resin and a crystalline polyester resin, an endothermic peak of the crystalline polyester resin obtained by differential scanning calorimetry is from 50° C. to 100° C., the organic particle contains at least one kind selected from a group consisting of higher fatty acid, higher alcohol, fatty acid ester, and fatty acid amide, and the inorganic particle is treated with silicone oil. | 12-18-2014 |
20150220009 | ELECTROSTATIC CHARGE IMAGE DEVELOPING TONER, ELECTROSTATIC CHARGE IMAGE DEVELOPER, TONER CARTRIDGE, AND PROCESS CARTRIDGE - An electrostatic charge image developing toner has toner particles that contain a binder resin containing a polyester resin, a release agent containing hydrocarbon-based wax, styrene(meth)acrylic resin particles, and an aluminum element, wherein fluorescent X-ray NET intensity of the aluminum element existing in the toner particles is from 0.1 to 0.3, and 70% or more of the release agent among the entire release agent exists within 800 nm from the surface of the toner particles. | 08-06-2015 |
Patent application number | Description | Published |
20090010674 | IMAGE FORMING DEVICE - An image forming device including: an image holding member; a charging member; a latent image-forming unit; a developing unit that develops the electrostatic latent image formed on the image holding member with a developer including a toner and a carrier, the toner comprising an external additive having first inorganic particles with a volume average particle diameter of 80 nm to 300 nm, and the carrier including a core material having a magnetic powder dispersed in a resin and a resin covering layer that covers the core material; a transfer unit; a removal unit; and an aggregation-forming unit that, by contacting a surface of the charging member and rotating in accordance with rotation of the charging member, removes adherents on the surface of the charging member, including the first inorganic particles, from the surface of the charging member, and forms aggregations in which the removed first inorganic particles are aggregated. | 01-08-2009 |
20110222914 | POWDER TRANSPORTING UNIT AND IMAGE FORMING APPARATUS USING THE SAME - According to an aspect of the invention, a powder transporting unit include: a first powder transporting cylindrical member in which a powder reception port for receiving a powder from a powder storage container storing the powder is opened in an upper portion of the first powder transporting cylindrical member; a second powder transporting cylindrical member whose inner diameter is formed to be larger than an inner diameter of the first powder transporting cylindrical member and in which a powder discharge port for discharging the powder; a link member which is made from an elastic material and which displaceably couples the first powder transporting cylindrical member and the second powder transporting cylindrical member with each other; and a powder transporting member which is rotatably disposed inside the first powder transporting cylindrical member and the second powder transporting cylindrical member and which transports the powder. | 09-15-2011 |
20130216272 | POWDER CONTAINER AND IMAGE FORMING APPARATUS - A powder container includes a body and a pair of walls that blocks one longitudinal end of the body and the other longitudinal end of the body. Powder is accommodated within the powder container which is mounted to an apparatus using the powder in a posture where a longitudinal direction of the body is a transverse direction of the apparatus. The powder container has an opening, through which the powder is supplied to the apparatus, formed in a lower position of the body in a posture where the powder container is mounted to the apparatus. The powder container includes a shutter and a shield. The shutter is, prior to mounting the powder container to the apparatus, in a closed location to block the opening and, when the powder container is mounted, is moved along an outer peripheral surface of the body to an opened location to open the opening. | 08-22-2013 |
20140286677 | POWDER CONTAINER AND IMAGE FORMING APPARATUS - A powder container includes a body and a pair of walls that blocks one longitudinal end of the body and the other longitudinal end of the body. Powder is accommodated within the powder container which is mounted to an apparatus using the powder in a posture where a longitudinal direction of the body is a transverse direction of the apparatus. The powder container has an opening, through which the powder is supplied to the apparatus, formed in a lower position of the body in a posture where the powder container is mounted to the apparatus. The powder container includes a shutter and a shield. The shutter is, prior to mounting the powder container to the apparatus, in a closed location to block the opening and, when the powder container is mounted, is moved along an outer peripheral surface of the body to an opened location to open the opening. | 09-25-2014 |
20140286680 | POWDER CONTAINER AND IMAGE FORMING APPARATUS - A powder container includes a body and a pair of walls that blocks one longitudinal end of the body and the other longitudinal end of the body. Powder is accommodated within the powder container which is mounted to an apparatus using the powder in a posture where a longitudinal direction of the body is a transverse direction of the apparatus. The powder container has an opening, through which the powder is supplied to the apparatus, formed in a lower position of the body in a posture where the powder container is mounted to the apparatus. The powder container includes a shutter and a shield. The shutter is, prior to mounting the powder container to the apparatus, in a closed location to block the opening and, when the powder container is mounted, is moved along an outer peripheral surface of the body to an opened location to open the opening. | 09-25-2014 |