Quinones
Beatriz Quiñones, San Pablo, CA US
Patent application number | Description | Published |
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20160034636 | OLIGONUCLEOTIDE PROBES FOR SPECIFIC IDENTIFICATION OF NOROVIRUSES AND OTHER PATHOGENS - Embodiments of the present disclosure relate to the identification of norovirus genotypes using type specific probes. Other embodiments of the present disclosure relate to the identification of distinct types of organisms using type specific probes. | 02-04-2016 |
Maria Clemens Quinones, Cebu City PH
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20090057855 | SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES - A semiconductor die package. It includes a semiconductor die including a first surface and a second surface opposite the first surface, an optional conductive structure, and a leadframe structure. The leadframe structure comprises a central portion suitable for supporting the semiconductor die, and a plurality of stand-off structures coupled to the central portion of the leadframe structure. The stand-off structures can support the conductive structure, and the conductive structure is attached to the second surface of the semiconductor die. | 03-05-2009 |
20090179313 | FLEX CLIP CONNECTOR FOR SEMICONDUCTOR DEVICE - A semiconductor die package. The semiconductor die package includes a semiconductor die having a first surface comprising a die contact region, and a second surface. It also includes a leadframe structure having a die attach pad and a lead structure, where the semiconductor die is attached to the die attach pad. It also includes a flex clip connector comprising a flexible insulator, a first electrical contact region, and a second electrical contact region. The first electrical contact region of the flex clip connector is coupled to the die contact region and the second electrical contact region of the flex clip connector is coupled to the lead structure. | 07-16-2009 |
Maria Clemens Y. Quinones, Cebu City PH
Patent application number | Description | Published |
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20080251739 | OPTICAL COUPLER PACKAGE - A method is disclosed. The method includes forming a substrate with a leadframe and a molding compound. The molding compound fills internal spaces in the leadframe and forms a dam structure. An optical emitter and an optical receiver are placed on the substrate. An optically transmissive medium is formed between the optical emitter and optical receiver. | 10-16-2008 |
20090236702 | SiP SUBSTRATE - Disclosed in this specification is a system-in-a-package substrate that includes an interconnect substrate for permitting finely pitched connections to be made to an integrated circuit. The interconnect substrate includes a central region on its upper surface for receiving the integrated circuit. The interconnect substrate also has interconnections that electrically connect the finely pitched contacts on the upper surface to larger pitched contacts on the lower surface. The larger pitched contacts connect to a conductive trace frame. The resulting assembly is encased in a molding compound along with a plurality of other devices which are configured to interact with one other through the conductive trace. | 09-24-2009 |
20090311832 | Flex Chip Connector For Semiconductor Device - A semiconductor die package. The semiconductor die package includes a semiconductor die having a first surface comprising a die contact region, and a second surface. It also includes a leadframe structure having a die attach pad and a lead structure, where the semiconductor die is attached to the die attach pad. It also includes a flex clip connector comprising a flexible insulator, a first electrical contact region, and a second electrical contact region. The first electrical contact region of the flex clip connector is coupled to the die contact region and the second electrical contact region of the flex clip connector is coupled to the lead structure. | 12-17-2009 |
20100148346 | SEMICONDUCTOR DIE PACKAGE INCLUDING LOW STRESS CONFIGURATION - A semiconductor die package. The semiconductor die package comprises a semiconductor die and a molded clip structure comprising a clip structure and a first molding material covering at least a portion of the clip structure. The first molding material exposes an outer surface of the clip structure. The clip structure is electrically coupled to the semiconductor die. The semiconductor die package further comprises a leadframe structure comprising a die attach pad and a plurality of leads extending from the die attach pad. The semiconductor die is on the die attach pad of the leadframe structure. A second molding material covers at least a portion of the semiconductor die and the leadframe structure. The semiconductor die package also includes a heat slug and a thermally conductive material coupling the heat slug to the exposed surface of the clip structure. | 06-17-2010 |
20110133318 | SiP SUBSTRATE - Disclosed in this specification is a system-in-a-package substrate that includes an interconnect substrate for permitting finely pitched connections to be made to an integrated circuit. The interconnect substrate includes a central region on its upper surface for receiving the integrated circuit. The interconnect substrate also has interconnections that electrically connect the finely pitched contacts on the upper surface to larger pitched contacts on the lower surface. The larger pitched contacts connect to a conductive trace frame. The resulting assembly is encased in a molding compound along with a plurality of other devices which are configured to interact with one other through the conductive trace. | 06-09-2011 |
20120083071 | SEMICONDUCTOR DIE PACKAGE INCLUDING LOW STRESS CONFIGURATION - A semiconductor die package. The semiconductor die package comprises a semiconductor die and a molded clip structure comprising a clip structure and a first molding material covering at least a portion of the clip structure. The first molding material exposes an outer surface of the clip structure. The clip structure is electrically coupled to the semiconductor die. The semiconductor die package further comprises a leadframe structure comprising a die attach pad and a plurality of leads extending from the die attach pad. The semiconductor die is on the die attach pad of the leadframe structure. A second molding material covers at least a portion of the semiconductor die and the leadframe structure. The semiconductor die package also includes a heat slug and a thermally conductive material coupling the heat slug to the exposed surface of the clip structure. | 04-05-2012 |
Maria Clemens Y. Quinones, Cebu PH
Patent application number | Description | Published |
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20100164078 | PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES - Semiconductor packages and methods for making and using such semiconductor packages are described. The semiconductor packages contain a dual gauge heat sink exposed on an upper part of the package, a leadframe containing a gate lead and an exposed drain pad on a lower part of the package, and a semiconductor die containing an IC device located between the heat sink and the leadframe. The gate of the IC device is connected to the gate lead of the leadframe using a bond interconnect wire or a gate interconnect clip located and placed under the heat sink and in between the heat sink and main leadframe. Such a configuration provides both a simple design for the semiconductor package and a simple method of manufacturing. Other embodiments are described. | 07-01-2010 |
20110244633 | PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES - Semiconductor packages and methods for making and using such semiconductor packages are described. The semiconductor packages contain a dual gauge heat sink exposed on an upper part of the package, a leadframe containing a gate lead and an exposed drain pad on a lower part of the package, and a semiconductor die containing an IC device located between the heat sink and the leadframe. The gate of the IC device is connected to the gate lead of the leadframe using a bond interconnect wire or a gate interconnect clip located and placed under the heat sink and in between the heat sink and main leadframe. Such a configuration provides both a simple design for the semiconductor package and a simple method of manufacturing. Other embodiments are described. | 10-06-2011 |
Maria Clemens Y. Quiñones, Cebu City PH
Patent application number | Description | Published |
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20090311832 | Flex Chip Connector For Semiconductor Device - A semiconductor die package. The semiconductor die package includes a semiconductor die having a first surface comprising a die contact region, and a second surface. It also includes a leadframe structure having a die attach pad and a lead structure, where the semiconductor die is attached to the die attach pad. It also includes a flex clip connector comprising a flexible insulator, a first electrical contact region, and a second electrical contact region. The first electrical contact region of the flex clip connector is coupled to the die contact region and the second electrical contact region of the flex clip connector is coupled to the lead structure. | 12-17-2009 |
Maria Clemens Ypil Quinones, Cebu City PH
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20150200162 | ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS - In some general aspects, an apparatus may include a first semiconductor die, a second semiconductor die, and a capacitive isolation circuit being coupled to the first semiconductor die and the second semiconductor die. The capacitive isolation circuit may be disposed outside of the first semiconductor die and the second semiconductor die. The first semiconductor die, the second semiconductor die, and the capacitive circuit may be included in a molding of a semiconductor package. | 07-16-2015 |
Maria Prat Quiñones, Barcelona ES
Patent application number | Description | Published |
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20100234333 | NOVEL QUINUCLIDINE DERIVATIVES AND MEDICINAL COMPOSITIONS CONTAINING THE SAME - A compound according to formula (I) | 09-16-2010 |
20100324000 | DERIVATIVES OF 4-(2-AMINO-1-HYDROXYETHYL)PHENOL AS AGONISTS OF THE BETA2 ADRENERGIC RECEPTORS - The present disclosure relates to 4-(2-amino-1-hydroxyethyl)phenol derivatives of formula (I) as well as pharmaceutical compositions comprising them, and their use in therapy as agonists of the β2 adrenergic receptor. | 12-23-2010 |
Maria Prat Quiñones US
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20110118223 | NOVEL QUINUCLIDINE DERIVATIVES AND MEDICINAL COMPOSITIONS CONTAINING THE SAME - The invention provides 3(R)-(2-hydroxy-2,2-dithien-2-ylacetoxy)-1-(3-phenoxypropyl)-1-azoniabicyclo[2.2.2]octane bromide in powder inhalant form, and methods of using it for treatment of respiratory disorders. | 05-19-2011 |
Pablo Alfonso Olachea Quiñones, Tijuana MX
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20130306830 | ENGINE SKID ASSEMBLY - A skid assembly for a gas turbine engine includes a first segment having a first engine support structure and a second segment having one or more second engine support structures. The first engine support structure configured to support a gas producer group of the gas turbine engine and the one or more second engine support structures configured to support a turbine power group of the gas turbine engine. A replaceable member removably attached to the first segment and the second segment. | 11-21-2013 |
Pablo Alfonso Olachea Quiñones, Tijuana MX
Patent application number | Description | Published |
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20130306830 | ENGINE SKID ASSEMBLY - A skid assembly for a gas turbine engine includes a first segment having a first engine support structure and a second segment having one or more second engine support structures. The first engine support structure configured to support a gas producer group of the gas turbine engine and the one or more second engine support structures configured to support a turbine power group of the gas turbine engine. A replaceable member removably attached to the first segment and the second segment. | 11-21-2013 |
20150139572 | LINEAR MOTION BEARING WITH MODULAR BEARING SEGMENTS - A modular bearing segment is disclosed. The modular bearing segment having a first end and a second end and can include a retainer defining at least one bearing track having an open load bearing portion; a plurality of bearings positioned within the at least one bearing track; a bearing plate in load bearing communication with less than all of the plurality of bearings and positioned opposite the retainer, and a lid positioned on the bearing plate, fixed to the retainer and defining a rocker element retaining hole positioned above the bearing plate. | 05-21-2015 |
Santiago Quinones, Saltillo MX
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20160084296 | CONNECTING ROD CRACKING MANDREL - Exemplary connecting rod cracking mandrels and methods are disclosed. A mandrel may include a pair of jaw elements slidably mounted relative to one another and separated from each other. Each one of the jaw elements has a pair of opposing side portions and a center portion disposed between the opposing side portions. Each one of the side portions is configured to contact an inner diameter surface of a bore of a connecting rod when the jaws are moved away from one another within the bore so as to break the connecting rod. The center portion is configured to be spaced apart from the inner diameter surface of the bore when the jaws are moved away from one another within the bore, such that the opposing side portions contact the connecting rod bore. | 03-24-2016 |
Vidalina Quiñones, Mamaroneck, NY US
Patent application number | Description | Published |
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20120159707 | INFANT BED SUPPORT SYSTEMS - Infant bed support systems comprising an infant bed support that allows a mattress to be used as an infant bed to prevent rolling. The infant bed support systems offers users a simple way to convert virtually any mattress into a safe area on which an individual may sleep. Infant bed support may assist individuals in feeling at ease as the individual sleeps, without worrying that the individual may be in danger of rolling out of bed or crawling out of a crib. The infant bed support may be ideal for use while traveling, when a crib and other traditional means, may be unavailable. The infant bed support comprises: a sheet having a plurality of bands; a removably attachable body-suit; and a fabric extension member. | 06-28-2012 |