Patent application number | Description | Published |
20140246810 | MOLDING METHOD AND APPARATUS THEREFOR - In a molding method and an apparatus for the method, a base material is placed on mounting portions of bottom support pins, which protrude from a first inner surface of a lower mold in an open state. Pressing portions of top support pins, which protrude from a second inner surface of an upper mold, are brought into contact with the base material. Consequently, the base material is sandwiched between the mounting portions and the pressing portions. Thereafter, pre-forming preferably is carried out. For example, the bottom support pins and the top support pins are lowered toward the lower mold, such that the base material is brought into contact with the first inner surface. Then, the lower mold and the upper mold are closed, and the base material is molded into a molded article. | 09-04-2014 |
20140272243 | RESIN COMPOSITE STRUCTURE AND METHOD FOR PRODUCING THE SAME - Linking parts are formed on one end of a first resin composite member and on one end of a second resin composite member in order to bond the ends together. For example, the linking parts may be wavy parts containing concave portions and convex portions. In this case, the wavy parts initially are heated and softened. Then, in a molding unit, respective pairs of confronting convex portions are overlapped with each other, and respective pairs of confronting concave portions are utilized to form a non-overlapping space. The overlapped convex portions are pressed and crushed, such that a base thermoplastic resin and fibers contained therein flow toward the non-overlapping space. Thereafter, the thermoplastic resin is cooled and hardened, whereby the first resin composite member and the second resin composite member are bonded integrally to obtain a resin composite structure. | 09-18-2014 |
20140288901 | COMPUTER-AIDED DIE DESIGN APPARATUS - In a computer-aided die design apparatus having a computer, a display adapted to be connected to the computer, and a simulator adapted to be loaded in the computer to analyze and display on the display flow behavior of resin when the resin charged into a die cavity is die-clamped by a press at a compression force, the simulator comprises an analyzer that analyzes the resin flow behavior by increasing the compression force for die-clamping the resin at a predetermined time interval until the increased compression force reaches an upper limit value, and a substitutive value calculator that calculates a substitutive value of the compression force based on a stress-relaxation time of the resin when the compression force has reached the upper limit value. | 09-25-2014 |