Patent application number | Description | Published |
20130038577 | OPTICAL TOUCH DEVICE AND COORDINATE DETECTION METHOD THEREOF - An optical touch device and a coordinate detection method thereof are disclosed. The optical touch device includes a detection area, a first capture module, a second capture module, and a processing module. The detection area provides a first object and a second object to contact with. The first capture module captures a first captured image from the detection area and captures a first object image and a second object image. The second capture module captures a second captured image from the detection area and captures a third object image and a fourth object image. The processing module calculates coordinates of a plurality of touch point according to the first captured image and the second captured image and determines the plurality of touch point is a real point or a ghost point according to the relation between the first object image to the fourth object image. | 02-14-2013 |
20140015799 | OPTICAL TOUCH SYSTEM AND TOUCH POINT CALCULATION METHOD THEREOF - An optical touch system and a touch point calculation method thereof are provided. The optical touch system includes a first lens, a second lens and a screen. The first and second lenses are disposed on the same side of the screen and face to the other side of the screen. In the method, images of a touch object above the screen are captured and used to calculate a first and a second touch signal of the touch object touching the screen before and after a preset time. Then, it is determined whether a width difference of the first and second touch signals exceeds a predetermined threshold. If yes, a third touch signal corresponding to the first touch signal relative to the second touch signal is calculated. Finally, positions of the first touch signal and the third touch signal are taken as locations of two touch points on the screen. | 01-16-2014 |
20140015800 | OPTICAL TOUCH SYSTEM AND TOUCH OBJECT SEPARATING METHOD THEREOF - An optical touch system and a touch object separating method thereof are provided. First, touch object images in a first and a second captured image of a first and a second lens are recognized. When the first captured image includes two touch object images and the second captured image includes a single touch object image, a first distance between a leftmost end and a rightmost end of the two touch object images in the first captured image, a second distance between centers of the two touch object images, and a third distance between a leftmost end and a rightmost end of the single touch object image in the second captured image are calculated. A fourth distance corresponds to the third distance is calculated according to a ratio of the first distance to the second distance and used to separate the single touch object images into two touch object images. | 01-16-2014 |
20140139487 | OPTICAL TOUCH DEVICES AND OPERATION METHOD THEREOF - An embodiment of the disclosure provides an operation method for an optical touch device. The optical touch device includes a panel, a left-side sensor and a right-side sensor. The operation method includes the steps of: sensing a sensing waveform on the panel; determining the number of peaks of the sensing waveform to control the optical touch device to be switched to a gesture mode or a touch mode; estimating a first variance according to a first sensing waveform sensed by the left-side sensor and a second variance according to a second sensing waveform sensed by the right-side sensor when the optical touch device is operating in the gesture mode; and determining the gesture made by the user according to the first variance and the second variance. | 05-22-2014 |
20140320457 | Method of determining touch gesture and touch control system - A method of determining a touch gesture is utilized for a touch control system. The method includes detecting at least one first touch point on a touch surface corresponding to the touch gesture at a first time point to generate a first detecting result; detecting at least one second touch point on the touch surface corresponding to the touch gesture at a second time point to generate a second detecting result; obtaining a moving vector and a distributing variation corresponding to the touch gesture according to a relationship of the first detecting result and the second detecting result; and determining the touch gesture on the touch surface according to the moving vector and the distributing variation. | 10-30-2014 |
20150035788 | TOUCH MODULE AND TOUCH POSITIONING METHOD THEREOF - A touch module includes a touch device, a stylus, and a processing unit. The stylus includes a body, a motor, an angle encoder, and a distance sensor. The angle encoder and the distance sensor are disposed on a rotating shaft of the motor. The distance sensor detects relative distances between itself and first, second, third, and fourth sides of a front frame of the touch device respectively. The processing unit is disposed in the body or the touch device for controlling the rotating shaft to rotate when a mark of the body points to the first side, calculating rotating angles of the rotating shaft and determining whether the rotating shaft makes one rotation according to encoded data of the angle encoder, and calculating four local minimum distances according to relationship of the rotating angles and the relative distances for positioning the stylus on a touch surface of the touch device. | 02-05-2015 |
20150070321 | OPTICAL COORDINATE INPUT DEVICE - An optical coordinate input device is disclosed. The optical coordinate input device includes a frame, a first touch detection area, a second touch detection area, a first detection module, a second detection module, and a processing module. The second touch detection area overlap the first touch detection area. The first detection module is disposed on the frame and adjacent to the second touch detection area for detecting the first touch detection area to generate a first touch coordinate signal. The second detection module is disposed on the frame and adjacent to the first touch detection area for detecting the second touch detection area to generate a second touch coordinate signal, wherein the first and second detection module are disposed on different surface of the frame. The processing is used for executing a coordinate calculation procedure base on the first and the second touch coordinate signal. | 03-12-2015 |
20150100254 | TESTING METHOD OF TOUCH DEVICE AND SYSTEM THEREOF - A testing method of a touch device and a system thereof are provided. The testing method includes following steps. A test sensing information generated by the touch device is received, and the test sensing information is physical characteristic information provided by sensors of the touch device. A test gesture signal and a test keypad signal generated by the touch device are received, the test gesture signal includes gesture coordinates provided by touch device, and the test keypad signal includes a keypad key triggering signal generated by the touch device. According to a preset table, in order to generate a test result, whether the test sensing information, the test gesture signal, and the test keypad signal match data of the preset table or not is determined, and whether the touch device works properly is determined according to the test result. | 04-09-2015 |
20150109258 | OPTICAL TOUCH SYSTEM, METHOD OF TOUCH DETECTION, AND COMPUTER PROGRAM PRODUCT - An optical touch system is provided. A reflecting unit is disposed beside a base plane. At least one light emitting module is disposed beside the base plane and provides a detecting light, wherein the detecting light is transmitted to the reflecting unit. At least one optical detecting module is disposed beside the base plane. A processing unit is coupled to the optical detecting module, wherein when a first object and a second object approach or touch the base plane, the processing unit determines which one of the intensity of a first portion of a signal corresponding to the first object OB1 and the intensity of a second portion of the signal corresponding to the second object OB2 from the optical detecting module is larger. Additionally, a method of touch detection and a computer program product are also provided. | 04-23-2015 |
20150153903 | OPTICAL TOUCH DEVICE AND METHOD FOR CALCULATING COORDINATE OF TOUCH POINT - An optical touch device utilizes a weighting to integrate two coordinates of a touch point sensed by two sets of image sensing units, so as to calculate an output coordinate of the touch point performed on a central touch area. Accordingly, the invention can effectively prevent a touch trajectory from shifting on the central touch area, such that the touch trajectory will be much smoother on the central touch area. | 06-04-2015 |
20150153945 | OPTICAL TOUCH DEVICE AND METHOD FOR DETECTING TOUCH POINT - An optical touch device utilizes two images sensed by two image sensing units, which are diagonal to each other, to determine whether a number of touch points located at a central touch area is equal to 1. When the number of touch points are larger than 1, the optical touch device further utilizes another two images sensed by another two image sensing units, which are also diagonal to each other, to assist in determining the number of touch points located at the central touch area, so as to improve the accuracy of determination. | 06-04-2015 |
Patent application number | Description | Published |
20080265397 | Chip-Stacked Package Structure - A chip stacked package structure and applications are provided, wherein the chip stacked package structure comprises a substrate, a first chip, a patterned circuit layer and a second chip. The substrate has a first surface and an opposite second surface. The first chip with a first active area and an opposite first rear surface is electrically connected to first surface of substrate by a flip chip bonding process. The patterned circuit layer set on the dielectric layer is electrically connected to the substrate via a bonding wire. The second chip set on the patterned circuit layer has a second active area and a plurality of second pads formed on the second active area, wherein the second bonding pad is electrically connected to the patterned circuit layer. | 10-30-2008 |
20080265400 | Chip-Stacked Package Structure and Applications Thereof - A chip stacked package structure and applications are provided, wherein the chip stacked package structure comprises a substrate, a first chip, circuit board and a second chip. The substrate has a first surface and an opposite second surface. The first chip having a first active surface and an opposite first rear surface is electrically connected to first surface of substrate serving by a flip chip bonding process. The circuit board has a dielectric layer set on the first rear surface and a patterned conductive layer set on the dielectric layer is electrically connected to the substrate via a bonding wire. The second chip set on the patterned conductive layer has a plurality of second pads formed on a second active surface thereof and eclectically connected to the patterned conductive layer. | 10-30-2008 |
20100155929 | Chip-Stacked Package Structure - A chip stacked package structure and applications are provided, wherein the chip stacked package structure comprises a substrate, a first chip, a patterned circuit layer and a second chip. The substrate has a first surface and an opposite second surface. The first chip with a first active area and an opposite first rear surface is electrically connected to first surface of substrate by a flip chip bonding process. The patterned circuit layer set on the dielectric layer is electrically connected to the substrate via a bonding wire. The second chip set on the patterned circuit layer has a second active area and a plurality of second pads formed on the second active area, wherein the second bonding pad is electrically connected to the patterned circuit layer. | 06-24-2010 |
Patent application number | Description | Published |
20140167269 | Methods and Apparatus of Packaging with Interposers - Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, where a micro-bump is used as a vertical connection between a die and the interposer, and a micro-bump line is used as a horizontal connection for signal transmission between different dies above the interposer. The micro-bump lines may be formed at the same time as the formation of the micro-bumps with little or no additional cost. | 06-19-2014 |
20150102482 | Mechanism for Forming Patterned Metal Pad connected to Multiple Through Silicon Vias (TSVs) - Various embodiments of mechanisms for forming through a three-dimensional integrated circuit (3DIC) structure are provided. The 3DIC structure includes an interposer bonded to a die and a substrate. The interposer has a conductive structure with through silicon vias (TSVs) connected to a patterned metal pad and a conductive structure on opposite ends of the TSVs. The pattern metal pad is embedded with dielectric structures to reduce dishing effect and has regions over TSVs that are free of the dielectric structures. The conductive structure has 2 or more TSVs. By using a patterned metal pad and 2 or more TSVs, the reliability and yield of the conductive structure and the 3DIC structure are improved. | 04-16-2015 |
20150130082 | Configurable Routing for Packaging Applications - Various structures having a fuse and methods for forming those structures are described. An embodiment is a method. The method comprises attaching a first die to a first side of a component using first electrical connectors. After the attaching, at least one of (i) the first die comprises a first fuse, (ii) the first side of the component comprises a second fuse, (iii) a second side of the component comprises a third fuse, the second side being opposite the first side, or (iv) a combination thereof. The method further comprises after the attaching the first die to the first side of the component, blowing the first fuse, the second fuse, the third fuse, or a combination thereof. | 05-14-2015 |
20150249019 | Methods and Apparatus of Packaging with Interposers - Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, where a micro-bump is used as a vertical connection between a die and the interposer, and a micro-bump line is used as a horizontal connection for signal transmission between different dies above the interposer. The micro-bump lines may be formed at the same time as the formation of the micro-bumps with little or no additional cost. | 09-03-2015 |