Patent application number | Description | Published |
20100287861 | EXTERIOR WALL ASSEMBLY INCLUDING MOISTURE TRANSPORTATION FEATURE - An exterior wall assembly includes a wall frame supporting an interior wall layer and an exterior wall layer opposite the interior wall layer, a flexible sheet disposed within the exterior wall assembly, and a seal attached to the flexible sheet and configured to prevent ingress of water toward the wall frame. The flexible sheet is configured to transport moisture from between the interior wall layer and the exterior wall layer to a location outside of the exterior wall assembly. | 11-18-2010 |
20100287862 | EXTERIOR WALL ASSEMBLY INCLUDING DYNAMIC MOISTURE REMOVAL FEATURE - A wall assembly includes a wall frame, a trough, a moisture transport spacer coupled to the wall frame and providing a substantial barrier to the passage of air and moisture vapor through the wall assembly, a moisture wicking sheet disposed at a bottom of the wall frame and extending from the moisture transport spacer to the trough, and an air seal disposed between the moisture wicking sheet and the bottom of the wall frame. The trough communicates with a dynamic ventilation system configured to remove moisture collected in the trough. | 11-18-2010 |
20100287863 | BUILDING ENVELOPE ASSEMBLY INCLUDING MOISTURE TRANSPORTATION FEATURE - A building envelope assembly includes a first structural frame supporting a first interior layer, a second structural frame parallel with the first structural frame supporting a second interior layer and an exterior sheathing layer opposite the second interior layer, and a flexible sheet disposed within the assembly and configured to transport moisture from between the first structural frame and the second structural frame to a location outside of the assembly. A drain assembly is configured to transport moisture from the flexible sheet. A seal is attached to the flexible sheet and configured to prevent ingress of water toward the first and second structural frames. | 11-18-2010 |
20110250035 | FASTENER ASSEMBLY CONFIGURED FOR ATTACHING BOARD IN EXTERIOR WALL - A fastening system is configured for attaching a board that is spaced apart from a wall stud of an exterior wall. A stud cap is configured to be secured over an edge of the wall stud. A sleeve is configured to be secured to an exterior surface of the board, the sleeve defining a bore. A fastener comprises a shaft extending between a proximal end portion and a distal end, the proximal end portion comprising threads configured to couple with a surface of the bore of the sleeve and the shaft comprising threads configured to penetrate the stud cap and couple with the wall stud. | 10-13-2011 |
20120079789 | METHOD OF REMOVING MOISTURE FROM A WALL ASSEMBLY - A method removes moisture from a wall assembly including a supporting wall, an interior finishing layer attached to an interior side of the supporting wall, and an exterior layer disposed opposite the interior finishing layer. The supporting wall supports the interior finishing layer and exterior layer. The method includes sealing, with a moisture seal located between a base of the wall assembly and the supporting wall erected on the base, and providing a water separation plane disposed within the supporting wall so that the water separation plane is located between the interior finishing layer and the exterior layer. The water separation plane provides a substantial barrier to moisture vapor and bulk water. The method includes transporting moisture along an interior side and an opposing exterior side of the water separation plane to a moisture collection area outside of the wall assembly, and removing the moisture from the moisture collection area. | 04-05-2012 |
20120272590 | BUILDING ENVELOPE ASSEMBLY INCLUDING MOISTURE TRANSPORTATION FEATURE - A building envelope assembly including a first structural wall frame, a flexible sheet, a drain assembly, and a seal. The flexible sheet is disposed along a surface of the first structural wall frame. The flexible sheet configured to transport moisture along two opposing surfaces. The flexible sheet includes an upper portion and a bottom portion having a moisture wicking sheet. The drain assembly is configured to receive moisture from the flexible sheet. The seal is attached to the bottom portion of the flexible sheet and is configured to prevent ingress of water, water vapor, and air toward the upper portion of the flexible sheet. | 11-01-2012 |
20140360109 | BUILDING ENVELOPE ASSEMBLY INCLUDING MOISTURE TRANSPORTATION FEATURE - A building envelope assembly including a first structural wall frame, a flexible sheet, a drain assembly, and a seal. The flexible sheet is disposed along a surface of the first structural wall frame. The flexible sheet configured to transport moisture along two opposing surfaces. The flexible sheet includes an upper portion and a bottom portion having a moisture wicking sheet. The drain assembly is configured to receive moisture from the flexible sheet. The seal is attached to the bottom portion of the flexible sheet and is configured to prevent ingress of water, water vapor, and air toward the upper portion of the flexible sheet. | 12-11-2014 |
Patent application number | Description | Published |
20130005078 | LOW TEMPERATURE DEPOSITION OF PHASE CHANGE MEMORY MATERIALS - A system and method for forming a phase change memory material on a substrate, in which the substrate is contacted with precursors for a phase change memory chalcogenide alloy under conditions producing deposition of the chalcogenide alloy on the substrate, at temperature below 350° C., with the contacting being carried out via chemical vapor deposition or atomic layer deposition. Various tellurium, germanium and germanium-tellurium precursors are described, which are useful for forming GST phase change memory films on substrates. | 01-03-2013 |
20130029456 | ANTIMONY AND GERMANIUM COMPLEXES USEFUL FOR CVD/ALD OF METAL THIN FILMS - Antimony, germanium and tellurium precursors useful for CVD/ALD of corresponding metal-containing thin films are described, along with compositions including such precursors, methods of making such precursors, and films and microelectronic device products manufactured using such precursors, as well as corresponding manufacturing methods. The precursors of the invention are useful for forming germanium-antimony-tellurium (GST) films and microelectronic device products, such as phase change memory devices, including such films. | 01-31-2013 |
20130288462 | TELLURIUM COMPOUNDS USEFUL FOR DEPOSITION OF TELLURIUM CONTAINING MATERIALS - Precursors for use in depositing tellurium-containing films on substrates such as wafers or other microelectronic device substrates, as well as associated processes of making and using such precursors, and source packages of such precursors. The precursors are useful for deposition of Ge | 10-31-2013 |
20140206134 | LOW TEMPERATURE DEPOSITION OF PHASE CHANGE MEMORY MATERIALS - A system and method for forming a phase change memory material on a substrate, in which the substrate is contacted with precursors for a phase change memory chalcogenide alloy under conditions producing deposition of the chalcogenide alloy on the substrate, at temperature below 350° C., with the contacting being carried out via chemical vapor deposition or atomic layer deposition. Various tellurium, germanium and germanium-tellurium precursors are described, which are useful for forming GST phase change memory films on substrates. | 07-24-2014 |
20140209566 | CHEMICAL-MECHANICAL POLISHING COMPOSITION CONTAINING ZIRCONIA AND METAL OXIDIZER - The invention provides a chemical-mechanical polishing composition and a method of chemically-mechanically polishing a substrate with the chemical-mechanical polishing composition. The polishing composition comprises (a) abrasive particles, wherein the abrasive particles comprise zirconia, (b) at least one metal ion oxidizer, wherein the at least one metal ion oxidizer comprises metal ions of Co | 07-31-2014 |
Patent application number | Description | Published |
20100279011 | NOVEL BISMUTH PRECURSORS FOR CVD/ALD OF THIN FILMS - Bismuth precursors having utility for forming highly conformal bismuth-containing films by low temperature (<300° C.) vapor deposition processes such as CVD and ALD, including bismuth aminidates, bismuth guanidates, bismuth isoureates, bismuth carbamates and bismuth thiocarbamates, bismuth beta-diketonates, bismuth diketoiminates, bismuth diketiiminates, bismuth allyls, bismuth cyclopentadienyls, bismuth alkyls, bismuth alkoxides, and bismuth silyls with pendant ligands, bismuth silylamides, bismuth chelated amides, and bismuth ditelluroimidodiphosphinates. Also described are methods of making such precursors, and packaged forms of such precursors suitable for use in the manufacture of microelectronic device products. These bismuth precursors are usefully employed to form bismuth-containing films, such as films of GBT, Bi | 11-04-2010 |
20110263100 | ANTIMONY AND GERMANIUM COMPLEXES USEFUL FOR CVD/ALD OF METAL THIN FILMS - Antimony, germanium and tellurium precursors useful for CVD/ALD of corresponding metal-containing thin films are described, along with compositions including such precursors, methods of making such precursors, and films and microelectronic device products manufactured using such precursors, as well as corresponding manufacturing methods. The precursors of the invention are useful for forming germanium-antimony-tellurium (GST) films and microelectronic device products, such as phase change memory devices, including such films. | 10-27-2011 |
20120108038 | AMORPHOUS GE/TE DEPOSITION PROCESS - Germanium, tellurium, and/or antimony precursors are usefully employed to form germanium-, tellurium- and/or antimony-containing films, such as films of GeTe, GST, and thermoelectric germanium-containing films. Processes for using these precursors to form amorphous films are also described. Further described is the use of [{nBuC(iPrN) | 05-03-2012 |
20140024216 | GST CMP SLURRIES - The present invention provides chemical-mechanical polishing (CMP) compositions suitable for polishing a substrate comprising a germanium-antimony-tellurium (GST) alloy. The CMP compositions of the present invention are aqueous slurries comprising a particulate abrasive, a water-soluble surface active agent, a complexing agent, and a corrosion inhibitor. The ionic character of the surface active material (e.g., cationic, anionic, or nonionic) is selected based on the zeta potential of the particulate abrasive. A CMP method for polishing a GST alloy-containing substrate utilizing the composition is also disclosed. | 01-23-2014 |