Patent application number | Description | Published |
20110023940 | SOLAR ENERGY COLLECTION SYSTEM - In one aspect of the present invention, a solar energy collection system that includes multiple longitudinally adjacent collectors is described. The collectors are coupled end to end to form a collector row. The collector row extends along a longitudinal axis and is arranged to rotate about a pivot axis to track the sun in at least one dimension. Each collector includes a reflector, one or more solar receivers and a support structure. The support structure includes a tube assembly that underlies the reflector. The tube assemblies of the collector row are arranged end to end along the longitudinal axis. There is a space between the tube assemblies of adjacent collectors in the collector row, where the reflectors of the adjacent collectors extend beyond the underlying tube assemblies to form a substantially continuous reflective surface over the space. A coupling device is positioned in the space between the tube assemblies. The coupling device connects and helps to rotate the tube assemblies of the adjacent collectors. Some embodiments relate to various types of coupling devices and collector arrangements. | 02-03-2011 |
20110108090 | SOLAR COLLECTOR - The present invention relates to a solar energy collector suitable for use in a solar energy collection system. The solar energy collection system includes the collector, a stand that supports the collector and a tracking system that causes the collector to track movements of the sun along at least one axis. The collector includes one or more reflector panels, one or more solar receivers, and a support structure that physically supports the reflector panels and solar receivers. Some designs involve a reflector panel that has a compound curvature. That is, the reflector panel has a convex shape along one direction and a concave shape in another direction. In another aspect of the invention, the collector includes a space frame support structure. | 05-12-2011 |
20110108091 | SOLAR COLLECTOR - The present invention relates to a solar energy collector suitable for use in a solar energy collection system. The solar energy collection system includes the collector, a stand that supports the collector and a tracking system that causes the collector to track movements of the sun along at least one axis. The collector includes one or more reflector panels, one or more solar receivers, and a support structure that physically supports the reflector panels and solar receivers. Some designs involve a reflector panel that has a compound curvature. That is, the reflector panel has a convex shape along one direction and a concave shape in another direction. In another aspect of the invention, the collector includes a space frame support structure. | 05-12-2011 |
20110226309 | SOLAR ENERGY COLLECTION SYSTEM - In one aspect of the present invention, a solar energy collection system that includes multiple longitudinally adjacent collectors is described. The collectors are coupled end to end to form a collector row. Each collector includes a reflector, one or more solar receivers and a support structure. There is a space between the support structures of adjacent collectors in the collector row, where the reflectors of the adjacent collectors extend beyond the underlying support structures to form a substantially continuous reflective surface over the space. A coupling device is positioned in the space between the tube assemblies. The coupling device connects and helps to rotate the support structures of the adjacent collectors. Some embodiments relate to various types of coupling devices and collector arrangements. | 09-22-2011 |
20120042932 | SOLAR COLLECTOR - The present invention relates to a solar energy collector suitable for use in a solar energy collection system. The solar energy collection system includes the collector, a stand that supports the collector and a tracking system that causes the collector to track movements of the sun along at least one axis. The collector includes one or more reflector panels, one or more solar receivers, and a space frame support structure that physically supports the reflector panels and solar receivers. In a particular embodiment, the space frame support structure includes struts that extend through a gap between the reflector panels to support the one or more receivers. | 02-23-2012 |
Patent application number | Description | Published |
20080251148 | Fluid Handling System for Wafer Electroless Plating and Associated Methods - A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber. | 10-16-2008 |
20080254225 | Method and Apparatus for Wafer Electroless Plating - A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen. | 10-16-2008 |
20080254621 | Wafer Electroless Plating System and Associated Methods - A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM). | 10-16-2008 |
20080296166 | PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRATED PROXIMTIY HEAD - A plating assembly for use in plating metallic materials onto a surface of a substrate is provided. The plating assembly comprising a delivery unit having a fluid chamber, a metallic source, and a porous insert. The plating assembly also comprising a receiving unit having a fluid chamber and a metallic receiver. The receiving unit also has a porous insert. The porous insert of the delivery unit being substantially aligned with, and spaced apart from, the porous insert of the receiving unit. The metallic receiver being substantially aligned with the porous insert of the delivery unit and a path being defined between the delivery unit and the receiving unit. Wherein a plating meniscus is capable of being defined in the path between the porous inserts of the delivery unit and the receiving unit and a substrate is capable of being moved through the plating meniscus to enable the plating of metallic materials onto the surface of the substrate. Examples for de-plating are also provided. | 12-04-2008 |
20110017605 | PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRATED PROXIMITY HEAD - Methods for plating substrates are herein defined. One method includes providing a plating assembly having a plating source in a plating fluid and a plating facilitator in the plating fluid, and defining a plating meniscus between the plating source and the plating facilitator. The plating meniscus being contained in a path of the plating assembly. The method further includes traversing a substrate through the path of the plating assembly. The substrate being charged so that plating ions are attracted to a surface of the substrate when the plating meniscus is present on the surface of the substrate, wherein the substrate traversing through the path of the plating assembly enables plating across the surface of the substrate. And, inducing a uniform charge in the path where the plating meniscus is formed, such that charge from the plating source is substantially uniformly directed toward the plating facilitator as the substrate that is charged moves through the path of the plating assembly. | 01-27-2011 |
20120045897 | Wafer Electroless Plating System and Associated Methods - A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM). | 02-23-2012 |
20130280917 | Method and Apparatus for Wafer Electroless Plating - A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen. | 10-24-2013 |
Patent application number | Description | Published |
20090083590 | System and method for determining the fault-tolerance of an erasure code - A method for determining a fault tolerance of an erasure code comprises deriving base erasure patterns from a generator matrix of an erasure code, determining which of the base erasure patterns are adjacent to one another and XORing the adjacent base erasure patterns with one another to produce child erasure patterns of the erasure code. The method further comprises combining the base erasure patterns and the child erasure patterns to form a minimal erasures list (MEL) for the erasure code, whereby the MEL corresponds to the fault tolerance of the erasure code. Also provided are methods for communicating and storing data by using the fault tolerance of erasure codes. | 03-26-2009 |
20100083068 | Allocation Of Symbols Of An Erasure Code Across A Plurality Of Devices - A technique is provided for determining an allocation of the symbols of an erasure code across a plurality of devices. A list of erasure patterns is provided for the erasure code and, based on the list, minimal erasures of minimal weight are identified for the code's symbols. Precedences of the symbols are determined based on the size of the corresponding MEMW. An allocation of the symbols across a plurality of devices is determined based on the precedences. | 04-01-2010 |
20100083069 | Selecting Erasure Codes For A Fault Tolerant System - A technique for selecting an erasure code from a plurality of erasure codes for use in a fault tolerant system comprises generating a preferred set of erasure codes based on characteristics of the codes' corresponding Tanner graphs. The fault tolerances of the preferred codes are compared based at least on the Tanner graphs. A more fault tolerant code is selected based on the comparison. | 04-01-2010 |
20100115335 | Simulator For Determining Data Loss In A Fault Tolerant System - A fault tolerant system is simulated to determine the occurrence of data loss in the fault tolerant system. A list of erasure patterns corresponding to an erasure code implemented across the devices in the system is provided and a device event is simulated. The list of erasure patterns is updated based on the device event, and the occurrence of data loss is determined based on the updated list. | 05-06-2010 |
20100192018 | Methods of Measuring Consistability of a Distributed Storage System - A method for measuring consistability of a distributed storage system is disclosed. The method includes determining at least one consistency level that the distributed storage system can provide. A plurality of failure classes can be determined for the distributed storage system. A probability of the distributed storage system to be in each of the plurality of failure classes can be measured. Each failure class can be mapped to the at least one consistency level. The probability of each failure class for each consistency level can be summed to determine an expected portion of time that the distributed storage system provides each consistency level. | 07-29-2010 |
20120017140 | NON-MDS ERASURE CODES FOR STORAGE SYSTEMS - Erasure-encoded data is stored across a plurality of storage devices in a data storage system. The erasure-encoded data includes k data elements to store on k data storage devices and m parity elements to store on m parity storage devices, wherein for a given minimum Hamming distance d of the data storage system and m≧(d−1), data elements are assigned only to corresponding unique combinations of parity elements of size (d−1). | 01-19-2012 |
20120198195 | DATA STORAGE SYSTEM AND METHOD - A data storage system including a storage device. The storage device may include a plurality of data storage drives that may be logically divided into a plurality of groups and arranged in a plurality of rows and a plurality of columns such that each column contains only data storage drives from distinct groups. Furthermore, the storage device may include a plurality of parity storage drives that correspond to the rows and columns of data storage drives. | 08-02-2012 |