Patent application number | Description | Published |
20100327273 | DITHIENOTHIOPHENE DERIVATIVES - An organic compound represented by the following general formula (I) wherein n is an integer from 1 to 500, inclusive, and R1 and R2 are each independently a moiety having an atom length of from about 8 atoms to about 20 atoms. | 12-30-2010 |
20100331550 | THIENOTHIOPHENE DERIVATIVES - An organic compound represented by the following general formula (I) and characterised by the conjugation of thieno[3,2-b]thiophene, thiophene and phenylene units in the conjugated compound. | 12-30-2010 |
20120156829 | POLYMERIC SEMICONDUCTORS, DEVICES, AND RELATED METHODS - A polymer comprises a polymeric chain represented by formula (I) or (II). In formula (I), a, b, c, d, and n are integers, a from 0 to 3, b from 1 to 5, c from 1 to 3, d from 1 to 5, and n from 2 to 5000; R | 06-21-2012 |
20120161117 | P-TYPE MATERIALS AND ORGANIC ELECTRONIC DEVICES - There is presently provided compounds of formula (I), which are useful as p-type semiconductor materials and in devices comprising such p-type semiconductor materials. | 06-28-2012 |
20140231784 | POLYMERIC SEMICONDUCTORS, DEVICES, AND RELATED METHODS - A polymer comprises a polymeric chain represented by formula (I) or (II). In formula (I) a, b, d, and n are integers, a from 0 to 3, b from 1 to 5, c from 1 to 3, d from 1 to 5, and n from 2 to 5000; R | 08-21-2014 |
Patent application number | Description | Published |
20100052803 | VOLTAGE CONTROLLED OSCILLATOR - An integrated circuit and an apparatus are provided. The integrated circuit comprises a bias circuit, an LC resonator circuit, and a current mode logic (CML) frequency divider. The bias circuit generates first and second bias voltages. The LC resonator circuit generates an oscillation signal having an oscillation frequency. The CML frequency divider, coupled to the bias circuit and the LC resonator circuit, biased by the first and second bias voltages, receives the oscillation signal to generate an output signal having an output frequency with a fractional rate of the oscillation frequency. The oscillation signal comprises AC and DC components, the CML frequency divider receives the AC component to determine an injected frequency and reuses the DC component to provide tail currents to determine a natural frequency of the CML frequency divider. The output frequency is determined by the injected frequency and the natural frequency. | 03-04-2010 |
20110116578 | Mobile Communication System with Integrated GPS Receiver - A receiver includes a mixer, a poly phase filter, a channel select filter, an analog-to-digital converter and a HI/LO side reject selection unit. The mixer downconverts a signal to generate an in-phase signal and a quadrature signal. The poly phase filter for generates differential IF signals based on the in-phase signal and the quadrature signal. The channel select filter filters out unwanted channel signals from the differential IF signals. The analog-to-digital converter converts the filtered signal into a digital output signal. The HI/LO side reject selection unit is coupled between the mixer and the poly phase filter and capable of rejecting image signals while the mixer is at a high side frequency or at a low side frequency. | 05-19-2011 |
20150056939 | INTEGRATED CIRCUIT FOR COMMUNICATION - The present invention provides an integrated circuit for communication, e.g., for mobile radio-frequency (RF) telecommunication, including a resonator, a main amplifier, a matching circuit, a blocker detector, a mixer circuit, and a translation filter. The resonator provides conversion from single-end to differential, and filtering function for rejecting blockers at harmonics of local oscillation signal. The blocker detector detects occurrence of blocker; according to whether blocker exists, the main amplifier amplifies differential signal of the resonator by different gains, and the mixer circuit mixes amplified signal with different numbers of mixers. The translation filter contributes to rejection of blockers closed to in-band by providing a first pass band which is translated to a second pass band by the mixer circuit. The matching circuit provides impedance match. | 02-26-2015 |
Patent application number | Description | Published |
20080248610 | THERMAL BONDING PROCESS FOR CHIP PACKAGING - The present invention provides a thermal bonding process for chip packaging. In accordance with an aspect of the invention, there is provided an approach to solve the problems caused by the different CTEs between the die and the substrate. It discloses an improved thermal bonding process for forming pillar-shaped interconnection, which controls the thermal expansion of the semiconductor die and the substrate by applying differential heating temperature to the two, thereby minimizing the misalignment between the die and the substrate, overcoming the stresses imposed on the interconnection and allowing more reliable and accurate packaging. | 10-09-2008 |
20110287560 | IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTIONS AND SYSTEMS THEREOF - A method for fabricating a flip-chip semiconductor package. The method comprises processing a semiconductor device, for example a semiconductor chip and processing a device carrier, for example a substrate. The semiconductor device comprises bump structures formed on a surface thereof. The substrate comprises bond pads formed on a surface thereof. Processing of the semiconductor chip results in heating of the semiconductor chip to a chip process temperature. The chip process temperature melts solder portions on the bump structures Processing of the substrate results in heating of the substrate to a substrate process temperature. The method comprises spatially aligning the semiconductor chip in relation to the substrate to correspondingly align the bump structures in relation to the bump pads. The semiconductor chip is then displaced towards the substrate for abutting the bump structures of the semiconductor chip with the bond pads of the substrate to thereby form bonds therebetween. A system for performing the above method is also disclosed. | 11-24-2011 |
20120153466 | PACKAGE STRUCTURE - A package structure including a first semiconductor element, a second semiconductor element, a semiconductor interposer and a substrate is provided. The first semiconductor element includes multiple first conductive bumps. The second semiconductor element includes multiple second conductive bumps. The semiconductor interposer includes a connection motherboard, at least one signal wire and at least one signal conductive column. The signal wire is disposed on the connection motherboard. The two ends of the signal wire are electrically connected to one of the first conductive bumps and one of the second conductive bumps respectively. The signal conductive column is electrically connected to the signal wire. The substrate is electrically connected to the signal conductive column. The first and the second semiconductor elements have the same circuit structure. The substrate of the package structure can simultaneously form a signal communication path with the first and the second semiconductor element respectively. | 06-21-2012 |
20120220118 | CHIP AND MANUFACTURING METHOD THEREOF - A semiconductor device and a manufacturing method thereof are provided. The semiconductor device has an active surface. The semiconductor device includes at least a connecting element and at least a bump. The connecting element is disposed on the activate surface and has a minimum dimension smaller than 100 microns. The bump is disposed on the connecting element and is electrically connected to the active surface by the connecting element. The bump includes a pillar part disposed on the connecting element and a top part disposed at the top of the pillar part. The pillar part has a first dimension and a second dimension both parallel to the active surface. The first dimension is longer than 1.2 times the second dimension. The top part is composed of solder and will melt under the determined temperature. The pillar part will not melt under a determined temperature. | 08-30-2012 |
20140299984 | CHIP AND MANUFACTURING METHOD THEREOF - A semiconductor device and a manufacturing method thereof are provided. The semiconductor device has an active surface. The semiconductor device includes at least a connecting element and at least a bump. The connecting element is disposed on the activate surface and has a minimum dimension smaller than 100 microns. The bump is disposed on the connecting element and is electrically connected to the active surface by the connecting element. The bump includes a pillar part disposed on the connecting element and a top part disposed at the top of the pillar part. The pillar part has a first dimension and a second dimension both parallel to the active surface. The first dimension is longer than 1.2 times the second dimension. The top part is composed of solder and will melt under the determined temperature. The pillar part will not melt under a determined temperature. | 10-09-2014 |
Patent application number | Description | Published |
20090042388 | METHOD OF CLEANING A SEMICONDUCTOR SUBSTRATE - A semiconductor substrate is first provided. The semiconductor substrate includes a material layer and a patterned photoresist layer disposed on the material layer. Subsequently, a contact etching process is performed on the material layer by utilizing the patterned photoresist layer as an etching mask so to form an etched hole in the material layer. Thereafter, a solvent cleaning process is carried out on the semiconductor substrate by utilizing a cleaning solvent. Next, a water cleaning process is performed on the semiconductor substrate by utilizing deionized water. The temperature of the deionized water is in a range from 30° C. to 99° C. | 02-12-2009 |
20120187584 | Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers - A semiconductor device has a semiconductor die and encapsulant deposited over the semiconductor die. A first insulating layer is formed over the die and encapsulant. The first insulating layer is cured with multiple dwell cycles to enhance adhesion to the die and encapsulant. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. The second insulating layer is cured with multiple dwell cycles to enhance adhesion to the first insulating layer and first conductive layer. A second conductive layer is formed over the second insulating layer and first conductive layer. A third insulating layer is formed over the second insulating layer and second conductive layer. The first, second, and third insulating layers have different CTE. The second insulating layer or third insulating layer is cured to a dense state to block moisture. | 07-26-2012 |
20130140719 | Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers - A semiconductor device has a semiconductor die and encapsulant deposited over the semiconductor die. A first insulating layer is formed over the die and encapsulant. The first insulating layer is cured with multiple dwell cycles to enhance adhesion to the die and encapsulant. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. The second insulating layer is cured with multiple dwell cycles to enhance adhesion to the first insulating layer and first conductive layer. A second conductive layer is formed over the second insulating layer and first conductive layer. A third insulating layer is formed over the second insulating layer and second conductive layer. The first, second, and third insulating layers have different CTE. The second insulating layer or third insulating layer is cured to a dense state to block moisture. | 06-06-2013 |
20130241048 | Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers - A semiconductor device has a semiconductor die and encapsulant deposited over the semiconductor die. A first insulating layer is formed over the die and encapsulant. The first insulating layer is cured with multiple dwell cycles to enhance adhesion to the die and encapsulant. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. The second insulating layer is cured with multiple dwell cycles to enhance adhesion to the first insulating layer and first conductive layer. A second conductive layer is formed over the second insulating layer and first conductive layer. A third insulating layer is formed over the second insulating layer and second conductive layer. The first, second, and third insulating layers have different CTE. The second insulating layer or third insulating layer is cured to a dense state to block moisture. | 09-19-2013 |
Patent application number | Description | Published |
20100283394 | Light Guide for Ambient Light Sensor in a Portable Electronic Device - Disclosed are various embodiments of a light guide and corresponding ambient light sensor, computing device and backlit display for use in a portable electronic device. The various embodiments of the light guide are configured to permit ambient light to be collected efficiently and accurately over wide angles of incidence, even under low-ambient-light conditions. The efficient and accurate collection of ambient light by the various embodiments of the light guide disclosed herein may be employed to more accurately control the amount and degree of backlighting provided to a backlit display, which in turn can be used to conserve valuable battery power in a portable electronic device. | 11-11-2010 |
20110057104 | Miniaturized Optical Proximity Sensor - Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, alight emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded to over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics. | 03-10-2011 |
20110057108 | Compact Optical Proximity Sensor with Ball Grid Array and Windowed Substrate - Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components. | 03-10-2011 |
20110057129 | Package-on-Package (POP) Optical Proximity Sensor - Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package. | 03-10-2011 |
20110133941 | Optical Proximity Sensor with Improved Shield and Lenses - Various embodiments of an optical sensor comprising a novel shield that may be quickly and accurately aligned and positioned with respect to an underlying light emitting and light detecting assembly are disclosed. Also disclosed are novel lens arrangements for efficiently collimating light emitted and received by the optical proximity sensor, and for reducing crosstalk. | 06-09-2011 |
20110297831 | Small Low-Profile Optical Proximity Sensor - In an embodiment, the invention provides a proximity sensor including a transmitter die, a receiver die, an ASIC die, a lead frame, wire bonds, a first transparent encapsulant, a second transparent encapsulant, and an opaque encapsulant. The transmitter die, the receiver die and the ASIC die are attached to portions of the lead frame. Wire bonds electrically connect the transmitter die, the receiver die, the ASIC die, and the lead frame. The first transparent encapsulant covers the receiver die, the ASIC die, the wire bonds, and a portion of the lead frame. The second transparent encapsulant covers the transmitter die, the wire bonds, and a portion of the lead frame. The opaque encapsulant covers portions of the first and second encapsulants and a portion of the lead frame. | 12-08-2011 |
20110316776 | INPUT DEVICE WITH PHOTODETECTOR PAIRS - Input devices configured to provide user interface by detecting three dimensional movement of an external object are disclosed. The input device comprises at least two photodetector pairs, a radiation source and a circuit configurable to detect differential and common mode signals generated in the photodetector pairs. By detecting the common mode and differential signals, movement of an external object may be determined and used to control a pointer, or a cursor. | 12-29-2011 |
20120037793 | LENS HAVING MULTIPLE CONIC SECTIONS FOR LEDS AND PROXIMITY SENSORS - A lens element comprising a base, a plurality of lens sections and a top lens section is disclosed. The plurality of lens sections are formed above a planar parallel to the base with each of the lens sections being positioned rotationally symmetric about an optical axis. The lens sections define a dome shape with every adjoining lens sections being conjugated with each other. A top lens section is formed at the center above the other lens sections and conjugated therewith. All of the lens sections are conjugated with each of its neighboring lens sections. Each of the lens sections has a optical property to direct light towards a target point. The target point may be positioned along the optical axis. | 02-16-2012 |
20120086018 | PACKAGE-ON-PACKAGE PROXIMITY SENSOR MODULE - A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing. | 04-12-2012 |
Patent application number | Description | Published |
20120019952 | MAGNETIC MEDIA TESTER AND A METHOD OF MAGNETIC MEDIA TESTING - A magnetic media tester comprising a Laser Doppler Vibrometer (LDV) head; and a magnetic read head; the LDV head and the magnetic read head being configured for obtaining correlatable data of a region on a magnetic disk. | 01-26-2012 |
20130114161 | Data Storage System and a Method for Measuring a Change in a Spacing Between a Head and a Storage Medium of a Data Storage System - A method for measuring a change in a spacing between a head and a storage medium of a data storage system. The method includes obtaining a first readback signal from the storage medium using the head at a first spacing between the head and the storage medium, determining a first power spectrum density over a frequency range from the obtained first readback signal, obtaining a second readback signal from the storage medium using the head at a second spacing between the head and the storage medium, determining a second power spectrum density over the frequency range from the obtained second readback signal, and providing a measurement indicative of the change in the spacing based on the determined first power spectrum density and the determined second power spectrum density. A data storage system is also provided. | 05-09-2013 |
20130148236 | DATA STORAGE DEVICE AND A METHOD FOR PROVIDING A SYNCHRONIZATION SIGNAL FOR AT LEAST ONE OF A READ OPERATION OR A WRITE OPERATION CARRIED OUT BY MEANS OF A HEAD IN A DATA STORAGE DEVICE - According to embodiments of the present invention, a method for providing a synchronization signal for at least one of a read operation or a write operation carried out by means of a head in a data storage device is provided. The method includes obtaining a readback servo signal from a storage medium of the data storage device by means of the head, the readback servo signal having at least one frequency associated with a servo track of the storage medium, frequency mixing the readback servo signal with a local signal having a local frequency to provide a frequency mixed signal, and filtering the frequency mixed signal to provide the synchronization signal for at least one of the read operation or the write operation. According to further embodiments of the present invention, a data storage device is also provided. | 06-13-2013 |
20130335843 | METHODS AND APPARATUS FOR HARD DISK DRIVE SYSTEM OPERATION MONITORING AND SELF-ADJUSTMENT - Methods and architecture for monitoring hard disk drive operation is provided. The hard disk drive system provided includes a spindle, a head and a disk with a disk medium including a buried servo layer having a first frequency of data on a first track and a second frequency of data on a second track, the second track adjacent to the first track. The method includes the steps of writing a wide track pattern having a predetermined frequency on a track of a hard disk drive medium, generating a readback signal by reading the pattern from the track, processing the readback signal by mixing the readback signal with a reference signal to obtain a mixed signal having a summed signal and a difference signal, and filtering the mixed signal by a filter centered around the difference signal to generate a measurement signal corresponding to a relative speed change of the spindle and a head-to-disk motion. In addition, filtering a readback signal generated by the head when positioned at the middle of the first track and the second track with a first filter centered at the first frequency and a second filter centered at the second frequency is used to generate signals for determining spindle speed variation, spindle speed jitter, and relative head-disk vibration in the downtrack direction, for synchronizing writing in Two Dimensional Magnetic Recording (TDMR) and for measuring continuous flying height information based on Wallace equations. | 12-19-2013 |
20140022877 | METHODS FOR READING DATA FROM A STORAGE MEDIUM USING A READER AND STORAGE DEVICES - According to various embodiments, a method for reading data from a storage medium using a reader, wherein the reader includes at least one reader head, may be provided, wherein the storage medium includes a plurality of tracks. The method may include: reading a first signal with a reader head of the reader at a pre-determined position of the storage medium; reading a second signal with a reader head of the reader at the pre-determined position of the storage medium; and determining data stored at the pre-determined position of the storage medium based on the first signal and based on the second signal. | 01-23-2014 |
20140139940 | METHODS FOR READING DATA FROM A STORAGE MEDIUM USING A READER AND STORAGE DEVICES - According to various embodiments, a method for reading data from a storage medium using a reader may be provided. The method may include: reading a first signal with a reader head of the reader at a first position of the storage medium; reading a second signal with a reader head of the reader at a second position of the storage medium; and determining data stored at a pre-determined position of the storage medium based on the first signal and based on the second signal. | 05-22-2014 |
Patent application number | Description | Published |
20120182886 | Method and Apparatus for Wireless Medium Access - In a non-limiting and example embodiment, a method is provided for arranging multi-channel wireless communications, including detecting, by a communications apparatus, information on available bandwidth for a transmission opportunity applying multiple channels, and controlling duration of channel occupancy for at least one of channels available for the transmission opportunity on the basis of the information on available bandwidth. | 07-19-2012 |
20130294289 | COMMUNICATION BETWEEN WIRELESS NETWORKS - Methods, apparatuses, and a computer program are presented for utilizing, by a wireless communication apparatus of a first network, a proxy apparatus of a second network, wherein the channels of the two networks overlap. The proxy apparatus is used to reserve the overlapping channels also in the second network so as to protect data transmissions in the first network and to avoid collisions. | 11-07-2013 |
20130294394 | RESERVING TRANSMISSION RESOURCES IN WIRELESS NETWORK - Methods, apparatuses, and a computer program are presented for determining a reservation period for data transmission in a wireless communication network. The duration of the reservation period is determined on the basis of RTS/CTS handshake between a transmitter and a receiver apparatus. | 11-07-2013 |
20140056177 | DIRECTIONAL WIRELESS NETWORK DISCOVERY - A wireless device may perform one or more omnidirectional scans for network wireless devices. Based at least in part on results of those omnidirectional scans, the scanning wireless device may determine that one or more directional scans should be performed. The scanning wireless device may then select one or more scan directions and perform a directional scan in each of those scan directions. | 02-27-2014 |
20140092860 | CHANNEL RESERVATION IN WIRELESS NETWORK - Methods, apparatuses, and a computer program are presented for carrying out channel reservations in a wireless communication system. A communication apparatus initiates a channel reservation procedure. During the channel reservation procedure, the communication apparatus is caused to transmit a reservation request message comprising information elements specifying at least one secondary channel being reserved and a communication direction for at least one channel being reserved. Upon completed reservation procedure, the communication apparatus is caused to utilize the reserved at least one secondary channel in wireless communication in the communication direction specified in the reservation request message. | 04-03-2014 |
Patent application number | Description | Published |
20100298995 | METHOD AND SYSTEM FOR CONTROLLING OPERATION OF A WIND TURBINE - Methods and systems for controlling operation of a wind turbine. The method may comprise determining an alarm level for at least one component of the wind turbine. In the case that an alarm level for at least one component exceeds a predefined level, the method comprises estimating an expected remaining lifetime for the component under the current operating conditions, and controlling operation of the wind turbine in order to adjust the expected remaining lifetime for the component to a desired expected remaining lifetime for said component. Thereby, the expected remaining lifetime for the component can be prolonged until the next scheduled service event. Downtime of the wind turbine is considerably reduced, and unscheduled service events are avoided to the greatest possible extent. Mean time between inspections (MTBI) is also extended. | 11-25-2010 |
20100332272 | Method and a system for controlling operation of a wind turbine - A method and a system for controlling operation of a wind turbine are provided. The method includes determining at least one failure mode relating to one or more components of the wind turbine, estimating a remaining lifetime of the component under current operating conditions, determining one or more control schemes to control the operation of the wind turbine in order to adjust the remaining lifetime of the component to a desired remaining lifetime of the component, determining a power production yield for the determined one or more control schemes and selecting a determined control scheme for controlling the operation of the wind turbine that maximizes the power production yield. | 12-30-2010 |
20120156034 | APPARATUS FOR HARVESTING ENERGY FROM A GEARBOX TO POWER AN ELECTRICAL DEVICE AND RELATED METHODS - Apparatus and methods for monitoring component health in a gearbox of a power generation system. A gearbox has a gear set with relatively-movable components, an armature attached to one of these components, and a magnet attached to another of these components. The armature is subjected to a changing magnetic field from the magnet that generates electrical energy. An electrical device for monitoring component health is inside the gearbox and is powered by the electrical energy received from the armature. | 06-21-2012 |
Patent application number | Description | Published |
20120156829 | POLYMERIC SEMICONDUCTORS, DEVICES, AND RELATED METHODS - A polymer comprises a polymeric chain represented by formula (I) or (II). In formula (I), a, b, c, d, and n are integers, a from 0 to 3, b from 1 to 5, c from 1 to 3, d from 1 to 5, and n from 2 to 5000; R | 06-21-2012 |
20120161117 | P-TYPE MATERIALS AND ORGANIC ELECTRONIC DEVICES - There is presently provided compounds of formula (I), which are useful as p-type semiconductor materials and in devices comprising such p-type semiconductor materials. | 06-28-2012 |
20120298976 | N-Type Materials And Organic Electronic Devices - There is presently provided organic compounds of formula I, n-type acceptor materials derived from such compounds and devices comprising such n-type acceptor materials. | 11-29-2012 |
20140231784 | POLYMERIC SEMICONDUCTORS, DEVICES, AND RELATED METHODS - A polymer comprises a polymeric chain represented by formula (I) or (II). In formula (I) a, b, d, and n are integers, a from 0 to 3, b from 1 to 5, c from 1 to 3, d from 1 to 5, and n from 2 to 5000; R | 08-21-2014 |
Patent application number | Description | Published |
20080316683 | CASE FOR CONTAINING A PORTABLE MEDIA PLAYER - There is provided a case for containing a portable media player, the case including: a frame for placement of the media player; and a speaker driver mounted in a cabinet, the speaker driver connectable to an audio output of the media player. The media player may be either permanently located within the case or removable from the case. The speaker driver may be connected to the audio output of the media player using either a wired connection or a wireless connection, the speaker driver being exposed when the case is in an open mode and the speaker driver being concealed when the case is in a closed mode. The case alternates between the open mode and the closed mode using fasteners such as, for example, adhesive strips, Velcro strips, magnetic strips, or a zipper. | 12-25-2008 |
20090190784 | MULTI CHAMBER PORTED STEREO SPEAKER - A method and apparatus for a multi-chamber ported stereo speaker is disclosed. The stereo speaker is a single unit with multi-chambers in an enclosure box. The multi chamber ported speaker comprises an enclosure housing a shared acoustic chamber having an external port for allowing air external of the enclosure box to flow into the shared acoustic chamber, and at least two additional chambers comprising a corresponding internal port in each additional chamber for forming an air pass from each additional chamber with the shared chamber, each additional chamber comprising a corresponding driver mounted through a wall of the chamber and enclosure box for forming the ported speaker. | 07-30-2009 |
20110112664 | METHOD AND AUDIO SYSTEM FOR PROCESSING MULTI-CHANNEL AUDIO SIGNALS FOR SURROUND SOUND PRODUCTION - A method and audio system for processing multi-channel audio signals for surround sound production on a plurality of loudspeakers to a listening area. The plurality of loudspeakers is front located with respect to the listening area. The plurality of loudspeakers comprises an outer left loudspeaker, an inner left loudspeaker, an inner right loudspeaker and an outer right loudspeaker. The multi-channel audio signals comprise one or more low frequency effects audio signals and one or more audio signals categorised as front based left inclined, front based right inclined, rear based left inclined, rear based right inclined, and centre based. The method comprising filtering and adjusting phase and amplitude of one or more audio signals that are front based left inclined, front based right inclined, rear based left inclined and rear based right inclined in a specific manner, and transmitting the one or more processed audio signals in a specific manner to the outer left loudspeaker, the outer right loudspeaker, the inner left loudspeaker and the inner right loudspeaker. | 05-12-2011 |
20120008798 | Method and Apparatus For Stereo Enhancement Of An Audio System - A processing apparatus which is suitable for signal communication with a system having at least one of an input module and an output module. The processing apparatus can be configured to receive input signals from the input module of the system. The processing apparatus includes a first channel processing portion to which the input signals are communicable. The first channel processing portion can be configurable to receive and process the input signals in a manner such that bass frequency audio signals are extracted from the input signals. The bass frequency audio signals can be further processed via at least one of linear dynamic range processing, manipulation of dynamic range via compression and manipulation of dynamic range via expansion. | 01-12-2012 |
20140086437 | SPEAKER FOR REPRODUCING SURROUND SOUND - The present invention relates to a speaker, and a method and surround sound system for processing multi-channel audio signals in each of a plurality of audio output sources for generation of surround sound in a listening area. In particular, the system comprises a transmitter for transmitting a left channel (L) signal and a right channel (R) signal to a speaker. The speaker comprises a processing unit configured to (a) receive an audio signal having a left channel (L) signal and a right channel (R) signal; (b) process separately and independently the L and R audio signals to produce processed signals; and (c) mix the processed signals to produce the surround sound signal. | 03-27-2014 |
20140112479 | PROCESSING METHOD AND PROCESSING APPARATUS FOR STEREO AUDIO OUTPUT ENHANCEMENT - A processing method and processing apparatus suitable for stereo audio output enhancement. The processing apparatus can include an input portion configurable to receive a set of input signals, an intermediate portion coupled to the input portion and an output portion coupled to the intermediate portion. The input portion can be configured to produce processed input signals based on the set of input signals. The intermediate portion can be configured to produce a compensated signal based on the processed input signals. The intermediate portion can also be configured to produce a first mixed signal and a second mixed signal based on the set of input signals and at least a portion of the compensated signal. The output portion can be configured to produce a set of output signals based on the first and second mixed signals. | 04-24-2014 |
20140341410 | SPEAKER APPARATUS SUITABLE FOR USE WITH A COMPUTER - A speaker apparatus suitable for use with a computer operable for communicating audio signals to the speaker apparatus. The speaker apparatus includes a housing having a top portion and a body portion adjacent the top portion. The housing can be configured for carrying a coupling module and a speaker driver array. The coupling module can be configured for coupling the speaker apparatus and the computer. The speaker driver array can include a first speaker driver and a second speaker driver. The first and second speaker drivers can be arranged in a stacked arrangement. The stacked arrangement can be such that the first speaker driver can be positioned atop the second speaker and such that the first and second speaker drivers face different directions. | 11-20-2014 |
Patent application number | Description | Published |
20110224565 | METHOD OF PREDICTING ACUTE CARDIOPULMONARY EVENTS AND SURVIVABILITY OF A PATIENT - According to embodiments of the invention, there is provided a method of producing an artificial neural network capable of predicting the survivability of a patient, the method including: storing in an electronic database patient health data, the patient health data comprising a plurality of sets of data, each set having at least one of a first parameter relating to heart rate variability data and a second parameter relating to vital sign data, each set further having a third parameter relating to patient survivability; providing a network of nodes interconnected to form an artificial neural network, the nodes comprising a plurality of artificial neurons, each artificial neuron having at least one input with an associated weight; and training the artificial neural network using the patient health data such that the associated weight of the at least one input of each artificial neuron of the plurality of artificial neurons is adjusted in response to respective first, second and third parameters of different sets of data from the patient health data, such that the artificial neural network is trained to produce a prediction on the survivability of a patient. | 09-15-2011 |
20130237776 | METHOD OF PREDICTING ACUTE CARDIOPULMONARY EVENTS AND SURVIVABILITY OF A PATIENT - A method of producing an artificial neural network capable of predicting the survivability of a patient, including: storing in an electronic database patient health data comprising a plurality of sets of data, each set having at least one of a first parameter relating to heart rate variability data and a second parameter relating to vital sign data, each set further having a third parameter relating to patient survivability; providing a network of nodes interconnected to form an artificial neural network, the nodes comprising a plurality of artificial neurons, each artificial neuron having at least one input with an associated weight; and training the artificial neural network using the patient health data such that the associated weight of the at least one input of each artificial neuron is adjusted in response to respective first, second and third parameters of different sets of data from the patient health data. | 09-12-2013 |
20140187988 | METHOD OF PREDICTING ACUTE CARDIOPULMONARY EVENTS AND SURVIVABILITY OF A PATIENT - A method of producing an artificial neural network capable of predicting the survivability of a patient, including: storing in an electronic database patient health data comprising a plurality of sets of data, each set having at least one of a first parameter relating to heart rate variability data and a second parameter relating to vital sign data, each set further having a third parameter relating to patient survivability; providing a network of nodes interconnected to form an artificial neural network, the nodes comprising a plurality of artificial neurons, each artificial neuron having at least one input with an associated weight; and training the artificial neural network using the patient health data such that the associated weight of the at least one input of each artificial neuron is adjusted in response to respective first, second and third parameters of different sets of data from the patient health data. | 07-03-2014 |
20140257063 | METHOD OF PREDICTING ACUTE CARDIOPULMONARY EVENTS AND SURVIVABILITY OF A PATIENT - A method of producing an artificial neural network capable of predicting the survivability of a patient, including: storing in an electronic database patient health data comprising a plurality of sets of data, each set having at least one of a first parameter relating to heart rate variability data and a second parameter relating to vital sign data, each set further having a third parameter relating to patient survivability; providing a network of nodes interconnected to form an artificial neural network, the nodes comprising a plurality of artificial neurons, each artificial neuron having at least one input with an associated weight; and training the artificial neural network using the patient health data such that the associated weight of the at least one input of each artificial neuron is adjusted in response to respective first, second and third parameters of different sets of data from the patient health data. | 09-11-2014 |
20140257122 | SYSTEM AND METHOD OF DETERMINING A RISK SCORE FOR TRIAGE - The present disclosure provides a system and method of determining a risk score for triage. In particular, a system is provided for providing an assessment of risk of a cardiac event for a patient, for example an incoming patient to a hospital emergency department complaining of chest pain. In the disclosure, the system includes an input device for measuring physiological data based vital signs parameter of the patient, a twelve-lead electrocardiogram (ECG) device for establishing an ECG obtained from results of the electrocardiography procedure, and determining an ECG parameter and a heart rate variability (HRV) parameter therefrom. An ensemble-based scoring system is further provided, establishing weighted classifier based on past patient data and where the vital signs parameter, the ECG parameter and the HRV parameter are compared to corresponding weighted classifiers to determine a risk score. A corresponding method to determine a risk score for triage is also provided. | 09-11-2014 |
Patent application number | Description | Published |
20080277829 | COMPRESSION MOLDING OF AN ELECTRONIC DEVICE - A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities. | 11-13-2008 |
20100090357 | OPTICAL DEVICE MOLDING SYSTEM - A substrate having a plurality of protrusion members on its surface is molded by a molding system comprising first and second molds cooperating to apply a clamping force onto the substrate for molding, and a middle plate located between the first and second molds such that the substrate is clamped between the middle plate and the first mold during molding. A plurality of molding cavities is located on the second mold and through-holes formed in the middle plate correspond to positions of the molding cavities, such that each through-hole is sized and configured for inserting a protrusion member of the substrate to enable each protrusion member to be in communication with a molding cavity of the second mold. Molding compound is molded onto the protrusion members by the molding cavities during molding. | 04-15-2010 |
20120013040 | SUBSTRATE CARRIER FOR MOLDING ELECTRONIC DEVICES - A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant. | 01-19-2012 |
20150033966 | SCREEN PRINTER, AND METHOD OF CLEANING A STENCIL OF A SCREEN PRINTER - An SMT screen printer 100 is disclosed herein. In a described embodiment, the screen printer | 02-05-2015 |
Patent application number | Description | Published |
20090090975 | INTEGRATED CIRCUIT SYSTEM EMPLOYING FLUORINE DOPING - An integrated circuit system that includes: providing a substrate including a first integrated circuit region electrically connected to a second integrated circuit region; implanting a dielectric growth material underneath a gate for each of an NFET device and a PFET device within the first integrated circuit region and the second integrated circuit region; and annealing the integrated circuit system. | 04-09-2009 |
20090206408 | NESTED AND ISOLATED TRANSISTORS WITH REDUCED IMPEDANCE DIFFERENCE - A processing layer, such as silicon, is formed on a metal silicide contact followed by a metal layer. The silicon and metal layers are annealed to increase the thickness of the metal silicide contact. By selectively increasing the thickness of silicide contacts, R | 08-20-2009 |
20100230777 | SELECTIVE STI STRESS RELAXATION THROUGH ION IMPLANTATION - A first example embodiment comprises the following steps and the structure formed therefrom. A trench having opposing sidewalls is formed within a substrate. A stress layer having an inherent stress is formed over the opposing trench sidewalls. The stress layer having stress layer sidewalls over the trench sidewalls. Ions are implanted into one or more portions of the stress layer to form ion-implanted relaxed portions with the portions of the stress layer that are not implanted are un-implanted portions, whereby the inherent stress of the one or more ion-implanted relaxed portions of stress layer portions is relaxed. | 09-16-2010 |
20100301424 | NESTED AND ISOLATED TRANSISTORS WITH REDUCED IMPEDANCE DIFFERENCE - A processing layer, such as silicon, is formed on a metal silicide contact followed by a metal layer. The silicon and metal layers are annealed to increase the thickness of the metal silicide contact. By selectively increasing the thickness of silicide contacts, R | 12-02-2010 |
20120018815 | Semiconductor device with reduced contact resistance and method of manufacturing thereof - A method (and semiconductor device) of fabricating a semiconductor device provides a filed effect transistor (FET) with reduced contact resistance (and series resistance) for improved device performance. An impurity is implanted in the source/drain (S/D) regions after contact silicide formation and a spike anneal process is performed that lowers the schottky barrier height (SBH) of the interface between the silicide and the lower junction region of the S/D regions. This results in lower contact resistance and reduces the thickness (and Rs) of the region at the silicide-semiconductor interface. | 01-26-2012 |
20130270654 | SEMICONDUCTOR DEVICE WITH REDUCED CONTACT RESISTANCE AND METHOD OF MANUFACTURING THEREOF - A method (and semiconductor device) of fabricating a semiconductor device provides a filed effect transistor (FET) with reduced contact resistance (and series resistance) for improved device performance. An impurity is implanted in the source/drain (S/D) regions after contact silicide formation and a spike anneal process is performed that lowers the schottky barrier height (SBH) of the interface between the silicide and the lower junction region of the S/D regions. This results in lower contact resistance and reduces the thickness (and Rs) of the region at the silicide-semiconductor interface. | 10-17-2013 |
20140264484 | FLUORINE-DOPED CHANNEL SILICON-GERMANIUM LAYER - Methods for forming P-type channel metal-oxide-semiconductor field effect transistors (PMOSFETs) with improved interface roughness at the channel silicon-germanium (cSiGe) layer and the resulting devices are disclosed. Embodiments may include designating a region in a substrate as a channel region, forming a cSiGe layer above the designated channel region, and implanting fluorine directly into the cSiGe layer. Embodiments may alternatively include implanting fluorine into a region in a silicon substrate designated a channel region, forming a cSiGe layer above the designated channel region, and heating the silicon substrate and the cSiGe layer to diffuse the fluorine into the cSiGe layer. | 09-18-2014 |
20140357028 | METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH THE IMPLANTATION OF FLUORINE - A method for fabricating an integrated circuit includes forming a first gate electrode structure above a first active region and a second gate electrode structure above a second active region, forming a sacrificial spacer on sidewalls of the first and second gate electrode structures, and forming deep drain and source regions selectively in the first and second active regions by using the sacrificial spacer as an implantation mask. The method further includes forming drain and source extension and halo regions in the first and second active regions after removal of the sacrificial spacer and forming a fluorine implant region in the halo region of the first active region before or after formation of the drain and source extension and halo regions. | 12-04-2014 |
Patent application number | Description | Published |
20110133941 | Optical Proximity Sensor with Improved Shield and Lenses - Various embodiments of an optical sensor comprising a novel shield that may be quickly and accurately aligned and positioned with respect to an underlying light emitting and light detecting assembly are disclosed. Also disclosed are novel lens arrangements for efficiently collimating light emitted and received by the optical proximity sensor, and for reducing crosstalk. | 06-09-2011 |
20110297832 | Proximity Sensor - A proximity sensor includes a printed circuit board (PCB); a first cup and a second cup embedded in the PCB; an electromagnetic radiation transmitter operably mounted in the first cup; and an electromagnetic radiation receiver operably mounted in the second cup. | 12-08-2011 |
20110316776 | INPUT DEVICE WITH PHOTODETECTOR PAIRS - Input devices configured to provide user interface by detecting three dimensional movement of an external object are disclosed. The input device comprises at least two photodetector pairs, a radiation source and a circuit configurable to detect differential and common mode signals generated in the photodetector pairs. By detecting the common mode and differential signals, movement of an external object may be determined and used to control a pointer, or a cursor. | 12-29-2011 |
20120037793 | LENS HAVING MULTIPLE CONIC SECTIONS FOR LEDS AND PROXIMITY SENSORS - A lens element comprising a base, a plurality of lens sections and a top lens section is disclosed. The plurality of lens sections are formed above a planar parallel to the base with each of the lens sections being positioned rotationally symmetric about an optical axis. The lens sections define a dome shape with every adjoining lens sections being conjugated with each other. A top lens section is formed at the center above the other lens sections and conjugated therewith. All of the lens sections are conjugated with each of its neighboring lens sections. Each of the lens sections has a optical property to direct light towards a target point. The target point may be positioned along the optical axis. | 02-16-2012 |
20120145932 | PROXIMITY SENSOR DEVICE AND METHOD - A proximity sensor device is provided in compact unit that has the ability to sense or monitor in different directions, such as sensing or monitoring in both the vertical and horizontal directions. Methods are also provided. In an illustrative embodiment, the proximity sensor device includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board along with an IC to control the transmitters and receivers, as well as, in some embodiments, to provide signal filtering, amplification or other desired features. | 06-14-2012 |
20120293472 | Ambient Light Sensor Configured to Determine the Direction of a Beam of Ambient Light Incident Thereon - Various embodiments of an ambient light sensor configured to determine the direction of a beam of light incident thereon are disclosed. In one embodiment, an ambient light sensor is provided that comprises a plurality of light detectors arranged in a spatial array upon a light sensing surface. Each of the light detectors in the array is configured to generate an analog output voltage in response to the beam of ambient light falling thereon. The amount of light incident on the individual light detectors in the spatial array varies according to the position of each such sensor with respect to direction of the beam of ambient light. An analog-to-digital converter (ADC) is operably coupled to the plurality of light detectors and is configured to receive the analog output signals generated thereby as inputs thereto, and to provide digital output values representative of the analog signals. Control logic circuitry is operably coupled to the ADC and configured to receive the digital output values therefrom, and is further configured to process such digital output values to determine the direction of the beam of light incident upon the spatial array. | 11-22-2012 |
20120327491 | HOLOGRAPHIC DISPLAY SYSTEM WITH MOTION SENSORS - A holographic display system with motion sensors is disclosed. In one embodiment, the holographic display system is a flat screen display having display screen and a holographic overlay positioned over the display screen. A plurality of sensors are embedded in the holographic overlay. Alternatively, the plurality of sensors may be attached to a substrate, which is positioned behind the display screen. In another embodiment, the holographic display system is a projection type display in which image beams are projected from an image projector onto a holographic screen. A plurality of sensors are located on the holographic screen. In yet another embodiment, a method for sensing a user's movement using a holographic display system with motion sensors is shown. | 12-27-2012 |
20130026350 | MULTI-DIRECTIONAL PROXIMITY SENSOR - A proximity sensor with multi-directional movement detection is provided. The proximity sensor may include an ASIC chip; at least three light sources configured to emit light in a particular sequence; and a photo detector configured to receive light and generate an output signal. The multi-directional proximity sensor may have a first proximity sensor with at least one side surface and a second proximity sensor connected to the first proximity sensor configured to detect object movement over a plane substantially parallel to the at least one side surface of the first proximity sensor. The multi-directional movement detection proximity sensor may include a PCB, in which more than one proximity sensor may be disposed on the PCB and operatively integrated to detect multi-directional movement. | 01-31-2013 |
Patent application number | Description | Published |
20090204092 | BODY ADHERING ABSORBENT ARTICLE - In a body adhering absorbent article, an absorbent structure is configured for disposition adjacent a female wearer's vaginal region to absorb bodily fluids discharged by the wearer. A shell supports the absorbent structure at the vaginal region and has an adhesive on a body-facing surface thereof for adhering the shell directly to the wearer. A placement aid is disposed on at least one of the absorbent structure and the shell to facilitate placement on the wearer. Securement components may be provided for securing the article in a folded configuration during wear and/or to the wearer's undergarment. Detachment components may also be provided to facilitate detachment of the article from the wearer. | 08-13-2009 |
20120296304 | Absorbent Article Containing Apertures Arranged in Registration with an Embossed Wave Pattern - An absorbent article that contains a topsheet having embossed regions is provided. The embossed regions propagate in a longitudinal direction of the article in the form of a wave having one or more alternating crests (peaks) and troughs (valleys). Such a wave pattern helps slow down the flow of bodily fluid by directing it along a tortuous path defined by the densified edges rather than in a straight line. Among other things, this reduction in flow rate can help provide sufficient time for the absorbent core to absorb the fluid, which is particularly helpful when it is already partially filled with fluid. Nevertheless, bodily fluids can still sometimes pool near the crests and/or troughs and result in leakage. To help counteract this tendency, the present inventors have discovered that a plurality of apertures can be employed in the topsheet that are arranged in a column that generally extends in a longitudinal direction of the article. At least a portion of the apertures are located proximate to contiguous crests and/or contiguous troughs of the embossed region. Without intending to be limited by theory, it is believed that the registration of the apertures with contiguous crests and/or contiguous troughs of the embossed region puts them in a better position to receive bodily fluids that tend to pool around the embossed regions and thus reduce the likelihood of leakage. | 11-22-2012 |
20130158494 | Absorbent Article Including Superabsorbent Yarn - The present invention discloses and claims an absorbent article which utilizes an absorbent portion that includes superabsorbent yarn as part of the absorbent portion, such that liquid is wicked to the perimeter or select regions of the absorbent portion, or the perimeter of the absorbent article itself, taking full advantage of either the depth, width, length or combination of dimensions of the absorbent portion, or absorbent article. The superabsorbent yarn can be one or more of several types, including encapsulated yarn, multilayered encapsulated yarn, coated yarn and sliver-formed yarn as long as such yarn includes at least two components, those being a superabsorbent polymer and a second material which promotes distribution of liquid along the yarn length. In alternatives of the invention, such absorbent article utilizing the superabsorbent yarn provides passive visual signals to consumers, of article saturation levels prior to leakage | 06-20-2013 |
20140180235 | BODY ADHERING ABSORBENT ARTICLE - In a body adhering absorbent article, an absorbent structure is configured for disposition adjacent a female wearer's vaginal region to absorb bodily fluids discharged by the wearer. A shell supports the absorbent structure at the vaginal region and has an adhesive on a body-facing surface for adhering the shell directly to the wearer. The article may be configurable between folded and unfolded configurations. Securement components may be provided for securing the article in a folded configuration during wear and/or to the wearer's undergarment. A method of adhering a body adhering absorbent article to a wearer includes adhering the article to the wearer with a portion of the article positioned generally at a predetermined target region. | 06-26-2014 |
Patent application number | Description | Published |
20100016780 | TAMPON APPLICATOR - In a tampon applicator, an elongated barrel has an interior chamber for housing a tampon therein, a grip region generally adjacent an outer end of the barrel, a tip region generally adjacent an inner end of the barrel, and a central region extending longitudinally between the grip region and the tip region. A plunger extends into the barrel at the outer end thereof and is moveable relative to the barrel to expel the tampon from the barrel at its inner end. The outer surface of the barrel at the grip region has a different coefficient of friction than at the central region of the barrel. In other embodiments the coefficient of friction of the barrel outer surface at the central region is different from the coefficient of friction at the tip region. | 01-21-2010 |
20100152690 | Leakage-signaling absorbent article - An absorbent article for preventing leakage is provided, the article including an absorbent assembly having an absorbent assembly perimeter, and a leakage warning element disposed adjacent a portion of the perimeter, wherein the leakage warning element includes a dimension change member adapted to dimensionally change upon liquid contact to produce a transition in the absorbent article between an activated state and an un-activated state, thereby producing a physical sensation indicating a fullness level of the absorbent assembly. The absorbent article also provides an absorbent assembly having an absorbent assembly perimeter and a leakage warning element including a stored energy device and a dimension change member, the dimension change member disposed along a portion of the perimeter, wherein the dimension change member is adapted to break upon liquid contact to produce a transition in the leakage warning element from an un-activated state to an activated state. | 06-17-2010 |
20100152692 | Article with fluid-activated barriers - An absorbent article has a longitudinal direction, a transverse direction, a first major surface which forms a body-facing surface of the absorbent article, and a second major surface disposed distally from the first major surface which forms a garment-facing surface of the absorbent article. The article includes an absorbent core positioned between the first major surface and the second major surface. The article also includes at least one barrier structure having an inward-facing side and an outward-facing side, and at least one liquid shrinkable string. The at least one barrier structure is disposed on the first major surface, and the inward-facing side of the at least one barrier structure is attached to the absorbent article. In addition, a first portion of the at least one liquid shrinkable string is attached to the at least one barrier structure. | 06-17-2010 |
Patent application number | Description | Published |
20090179312 | INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM - An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe. | 07-16-2009 |
20100176497 | INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM - An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height. | 07-15-2010 |
20110079899 | EMBEDDED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by the bumps; forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern; forming a channel in the substrate forming encapsulation; and applying a conductive material in the channel. | 04-07-2011 |
20120187555 | THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM - A semiconductor package system is provided including: a semiconductor chip; a substrate having a substrate opening and a vertical build-up wing, the substrate having the semiconductor chip mounted thereon with the vertical build-up wing circumscribed by vertical planes of a perimeter of, and spaced apart from, the semiconductor chip; a first heat slug attached above the substrate at a first horizontal plane and to a first surface of the semiconductor chip, the semiconductor chip at least partially encapsulated by the first heat slug; and a second heat slug attached to the substrate at a second horizontal plane above the first horizontal plane and to a second surface of the semiconductor chip through the substrate opening. | 07-26-2012 |