Patent application number | Description | Published |
20100199673 | Gas Turbine Engine with Eductor and Eductor Flow Distribution Shield - A gas turbine engine comprises: a combustor with an aft end exhaust nozzle that discharges along an axis of the combustor; an eductor with a housing that circumscribes the combustor that has a sideward eductor inlet that intakes generally normal to the combustor axis and an aft end eductor outlet that circumscribes the combustor exhaust nozzle and exhausts along the combustor axis; and an eductor distribution shield mounted within the eductor housing between the eductor inlet and the combustor with a deflection surface that deflects the intake of the eductor inlet around the combustor. | 08-12-2010 |
20110272553 | REMOVABLE GAS TURBINE ENGINE STAND - A removable stand assembly for a gas turbine engine includes a first stand removably mountable to a gas turbine engine on one side of a center of gravity of the gas turbine engine and a second stand removably mountable to the gas turbine engine on a second side of the center of gravity of the gas turbine engine. | 11-10-2011 |
20120006151 | APU FUEL FILTER HOUSING SCUPPER - An auxiliary power unit includes a gearbox housing portion and a filter housing portion providing an integral housing. A filter cavity is provided in the filter housing portion. A surface circumscribes the filter cavity. A scupper includes a passage extending from the surface to an opening on an exterior surface of the integral housing. A sealing region between the scupper and the filter cavity is configured to fluidly isolate the scupper and the fuel filter cavity from one another. In one example, the filter cavity receives a fuel filter cartridge. A cap is secured to the filter housing portion and encloses the filter cavity when in a secured position. | 01-12-2012 |
20120023889 | AUXILIARY POWER UNIT FIRE ENCLOSURE - A fire enclosure for an auxiliary power unit having a hot zone formed by a gas turbine comprises an annular fire enclosure body, an axial expansion joint and a radial expansion joint. The annular fire enclosure body is configured to encapsulate the hot zone. The fire enclosure includes a first end and a second end. The axial expansion joint is connected to the first end. The radial expansion joint is connected to the second end. | 02-02-2012 |
20120023896 | AUXILIARY POWER UNIT FIRE ENCLOSURE DRAIN - A drain assembly for an auxiliary power unit having a hot zone formed by a combustor case comprises a fire enclosure, a drain fitting and an orifice. The fire enclosure encapsulates the hot zone. The drain fitting connects to the fire enclosure. The orifice extends from the combustor case into the drain fitting to form an expansion joint. | 02-02-2012 |
20120023897 | AUXILIARY POWER UNIT FIRE ENCLOSURE DRAIN SEAL - A drain assembly for an auxiliary power unit having a hot zone formed by a combustor case comprises a fire enclosure, a drain fitting, a discharge port and a piston seal. The fire enclosure encapsulates the hot zone of the combustor case. The drain fitting connects to the fire enclosure. The discharge port extends from the combustor case into the drain fitting. The piston seal is positioned between the drain fitting and the discharge port. | 02-02-2012 |
20120023967 | AUXILIARY POWER UNIT WITH HOT SECTION FIRE ENCLOSURE ARRANGEMENT - A Hot Section Fire Enclosure for a gas turbine engine according to an exemplary aspect of the present disclosure includes a multiple of supports mounted between a Hot Section Fire Enclosure support ring and a shroud, at least one of the supports includes a hollow support pin which spaces the Hot Section Fire Enclosure support ring relative the shroud. | 02-02-2012 |
20120291450 | AUXILIARY POWER UNIT MOUNTING FEATURE - An auxiliary power unit assembly includes an auxiliary power unit with an auxiliary power unit exhaust duct, a bell mouth, and one or more bell mouth struts. The auxiliary power unit exhaust duct extends from the auxiliary power unit and has an aft end portion that is received within the bell mouth. The bell mouth struts extend from an inner surface of the bell mouth and extend generally radially toward the auxiliary power unit exhaust duct. | 11-22-2012 |
20120292455 | AUXILIARY POWER UNIT INLET DUCT SCREEN ASSEMBLY - An example inlet duct screen assembly includes a grid portion having a plurality of apertures and a frame portion circumscribing the grid portion. The grid portion and the frame portion are formed from a single sheet of material. An example method of making an auxiliary power unit inlet duct screen includes machining apertures in a sheet of material to establish a grid portion of an inlet duct screen. | 11-22-2012 |
20130015291 | FIRE RESISTANT STRUCTURAL MOUNT YOKE AND SYSTEMAANM DeDe; Brian C.AACI San DiegoAAST CAAACO USAAGP DeDe; Brian C. San Diego CA USAANM Lau; DavidAACI San DiegoAAST CAAACO USAAGP Lau; David San Diego CA USAANM Jewess; Gordon F.AACI RzeszowAACO PLAAGP Jewess; Gordon F. Rzeszow PL - A mount yoke assembly comprises a first main hanger bracket and a first anchor bracket. The first main hanger bracket includes a first receiving portion for a first auxiliary power unit (APU) mount with first and second hanger arms. The first hanger arm includes a first hanger flange extending proximate a distal end of the first hanger arm. The first anchor bracket includes a first plurality of anchor holes and a first anchor flange. The first plurality of anchor holes are disposed substantially along a length of the first anchor bracket for securing the mount yoke assembly to a component of an APU assembly. The first anchor flange extends from the first anchor bracket for hingeably securing the first anchor bracket to the first main hanger bracket. | 01-17-2013 |
20130031911 | APU SELECTIVE COOL DOWN CYCLE - An APU has a control for controlling a load on the APU from an associated aircraft. The control further receives information with regard to a temperature challenge around the APU. If the temperature challenge exceeds a predetermined threshold, then the control operates the APU with a reduced load in a cool down cycle to reduce the heat load from the APU on an associated tail cone. A method is also disclosed. | 02-07-2013 |
20140332624 | INLET DUCT SCREEN ASSEMBLY - An example inlet duct screen assembly includes a grid portion including a plurality of apertures and a frame portion circumscribing the grid portion. The grid portion and the frame portion are formed from a single sheet of material. | 11-13-2014 |
Patent application number | Description | Published |
20110168223 | THERMOELECTRIC APPLICATION FOR WASTE HEAT RECOVERY FROM SEMICONDUCTOR DEVICES IN POWER ELECTRONICS SYSTEMS - In a power electronics system of a next generation vehicle, a power module is provided including a thermoelectric device which is provided in a thermally conductive path between a power device and a cooling plate such that the thermoelectric device creates useful electric power from the waste heat of the power device. | 07-14-2011 |
20110216502 | POWER MODULES, COOLING DEVICES AND METHODS THEREOF - A jet impingement cooling device may include a jet structure and a target layer. The jet structure may include at least one fluid jet operable to produce an impingement jet of cooling fluid. The target layer may further include a heat receiving surface configured to be coupled to a heat generating device and a jet impingement target surface. The jet impingement target surface may further include at least one target structure having a wavy-fin topology with a fin peak, wherein the fluid jet and the target structure are arranged such that the fin peak of the target structure is aligned with a centerline of the impingement jet of cooling fluid during operation of the jet impingement cooling device. | 09-08-2011 |
20110222239 | COOLING DEVICES, POWER MODULES, AND VEHICLES INCORPORATING THE SAME - A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology. | 09-15-2011 |
20110299244 | COOLING MEMBER FOR HEAT CONTAINING DEVICE - A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device. | 12-08-2011 |
20120000639 | THERMAL ENERGY STEERING DEVICE - A thermal flux steering device and method for steering thermal flux into a concentrated area is provided. The thermal flux steering device includes a matrix impregnated with a plurality of thermally conductive inclusions. The thermally conductive inclusions are angled so as to steer thermal flux into a concentrated area such as a thermal energy sink in communication with the matrix. The thermally conductive inclusions may be filler fibers or thermally conductive particles impregnated within the matrix. Orientation of the thermally conductive inclusions may be determined by detecting the thermal flux of the thermal energy source, the thermodynamic properties of the matrix and the thermally conductive inclusions, and the location of the flux concentration area. | 01-05-2012 |
20120063085 | Jet Impingement Heat Exchanger Apparatuses and Power Electronics Modules - A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device. | 03-15-2012 |
20120063091 | Cooling Apparatuses and Power Electronics Modules - A cooling apparatus for a power electronics system includes a jet plate, a target plate, a plurality of fluid collection passageways, and a fluid outlet. The jet plate includes an array of impingement jets having a jet body and an impingement jet channel. The target plate includes an array of microchannel cells having a plurality of radially-extending wavy-fin microchannels. The coolant fluid is directed toward an impingement location through the array of impingement jets and travels through the wavy-fin microchannels. The plurality of fluid collection passageways are arranged in a grid pattern such that the coolant fluid exits the wavy-fin microchannels and flows into the plurality of fluid passageways. The coolant fluid exits the cooling apparatus through the fluid outlet. The cooling apparatus may be incorporated into a power electronics module having a power electronics device to cool the power electronics device. | 03-15-2012 |
20120170222 | COLD PLATE ASSEMBLIES AND POWER ELECTRONICS MODULES - A cold plate assembly includes an inlet manifold layer, a target heat transfer layer, a second-pass heat transfer layer, and an outlet manifold layer. The inlet manifold layer includes a coolant fluid outlet and an inlet channel. The inlet channel includes a plurality of fluid inlet holes fluidly coupled to a plurality of impingement jet nozzles. The target heat transfer layer includes a plurality of target heat transfer cells having a plurality of target heat transfer layer microchannels extending in a radial direction from a central impingement region. The second-pass heat transfer layer includes a plurality of second-pass heat transfer cells having a plurality of second-pass heat transfer layer microchannels extending in a radial direction toward a central fluid outlet region, and one or more transition channels. The impingement jet nozzles are positioned through the central fluid outlet region. The outlet manifold layer includes an outlet channel having a plurality of fluid outlet holes. | 07-05-2012 |
20120206226 | MAGNETIC FIELD FOCUSING FOR ACTUATOR APPLICATIONS - The magnetic force between the electromagnet and plunger of a magnetic actuator, the electromagnet including a coil generating magnetic flux when the coil is energized, can be increased by locating a near field plate on the electromagnet. The near field plate has a spatially modulated surface reactance configured to focus the magnetic flux within a region of the plunger, such as the central portion of an end portion of the plunger proximate the electromagnet, so as to increase the magnetic force between the electromagnet and plunger. Examples also include permanent magnet based actuators and the use of other magnetic field focusing devices. | 08-16-2012 |
20120212907 | POWER ELECTRONICS MODULES AND POWER ELECTRONICS MODULE ASSEMBLIES - A power electronics module includes a frame, a jet impingement cooler assembly, and a power electronics assembly. The frame includes a first surface, a second surface, a power electronics cavity within the first surface of the frame, a fluid inlet reservoir, and a fluid outlet reservoir. The fluid inlet and outlet reservoirs extend between the first surface of the frame and the second surface of the frame. The fluid inlet reservoir and the fluid outlet reservoir are configured to be fluidly coupled to one or more additional modular power electronics devices. The jet impingement assembly is sealed within the frame and fluidly coupled to the fluid inlet reservoir and the fluid outlet reservoir. The power electronics assembly includes at least one power electronics component, is positioned within the power electronics cavity, and is thermally coupled to the jet impingement cooler assembly. Power electronic module assemblies are also disclosed. | 08-23-2012 |
20120243192 | THREE-DIMENSIONAL POWER ELECTRONICS PACKAGES - Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane. The second power electronics device is electrically coupled to the second conductive layer such that the second power electronics device is positioned in a second plane parallel to the first plane. | 09-27-2012 |
20120257354 | POWER ELECTRONICS CARD ASSEMBLIES, POWER ELECTRONICS MODULES, AND POWER ELECTRONICS DEVICES - A power electronics card assembly includes a printed circuit board assembly including a printed circuit board substrate, a power electronics device opening, a fluid inlet channel extending from a perimeter of the printed circuit board assembly to the power electronics device opening, a fluid outlet channel within the printed circuit board substrate extending from the perimeter of the printed circuit board assembly to the power electronics device opening, and electrically conductive power connections. A power electronics device is positioned within the power electronics device opening and includes a fluid inlet layer fluidly coupled to the fluid inlet channel, a fluid outlet layer fluidly coupled to the fluid outlet channel, a target heat transfer layer fluidly coupled to the fluid inlet layer, a second pass-heat transfer layer and a power device layer. The second-pass heat transfer layer is fluidly coupled to the target heat transfer layer and the fluid outlet layer. | 10-11-2012 |
20120267077 | COOLING APPARATUSES AND POWER ELECTRONICS MODULES COMPRISING THE SAME - Cooling apparatuses and power electronics modules with cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes a heat transfer plate having a heat output surface and a periodic fractal pattern formed in the heat output surface. The periodic fractal pattern increases the surface area of the heat output surface and provides vapor bubble nucleation sites. An enclosure encloses the heat transfer plate and forms a fluid chamber between the enclosure and the heat transfer plate. A fluid source is fluidly coupled to the fluid chamber and provides cooling fluid to the fluid chamber. When the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source. | 10-25-2012 |
20130003245 | FOCUSING DEVICE FOR LOW FREQUENCY OPERATION - An example apparatus for obtaining a desired magnetic field distribution from an incident magnetic field, such as a kHz magnetic field, comprises a structure receiving the incident magnetic field and generating the desired magnetic field distribution at a predetermined distance from the transmitting side of the apparatus. The desired magnetic field distribution results from a spatial distribution of induced electrical current over the structure. Examples of the invention also include design methods and methods of using the apparatus. | 01-03-2013 |
20130038147 | Three Dimensional Magnetic Field Manipulation in Electromagnetic Devices - Electromagnetic devices and near field plates for three-dimensional magnetic field manipulation are disclosed. In one embodiment, an electromagnetic device includes a rotor, a stator, and a magnetic field focusing device. The rotor may include a rotor body and a plurality of radially extending rotor poles. The stator may include a plurality of stator poles radially extending inwardly from a stator body toward the rotor body. Each stator pole may have a magnetic flux generating device and a stator pole tip, wherein an air gap may be located between each stator pole tip and each corresponding rotor pole. The magnetic field focusing device is coupled to at least one stator pole tip and produces a magnetic field profile having at least one concentrated magnetic flux region proximate the stator pole tip. The magnetic field focusing device twists the magnetic field profile by an angle α. | 02-14-2013 |
20130148301 | MAGNETIC FLUID COOLING DEVICES AND POWER ELECTRONICS ASSEMBLIES - Magnetic fluid cooling devices and power electronic devices are disclosed. In one embodiment, a magnetic fluid cooling device includes a magnetic field generating device, a magnetic fluid chamber assembly, and a heat sink device. The magnetic field generating device includes a plurality of magnetic regions having alternating magnetic directions such that magnetic flux generated by the magnetic field generating device is enhanced on a first side of the magnetic field generating device and inhibited on a second side of the magnetic field generating device. The magnetic fluid chamber assembly defines a magnetic fluid chamber configured to receive magnetic fluid. The heat sink device includes a plurality of extending fins, and is thermally coupled to the magnetic fluid chamber assembly. Power electronic devices are also disclosed, wherein the magnetic fluid chamber may be configured as opened or closed. | 06-13-2013 |
20130188313 | COOLING APPARATUSES, ELECTRONIC DEVICE ASSEMBLIES, AND COOLING ASSEMBLIES USING MAGNETIC SHAPE MEMORY MEMBERS - Cooling apparatuses, electronic device assemblies, and cooling assemblies having a magnetic shape memory member are disclosed. In one embodiment, a cooling apparatus includes a first compliant member, a magnetic shape memory member, a magnetic field generating device, a second compliant member and a fan member. A first end of the magnetic shape memory member is coupled to the first compliant member. The magnetic field generating device is positioned proximate the magnetic shape memory member, and generates a magnetic field toward the magnetic shape memory member to cause the magnetic shape memory member to expand along a linear translation axis. Expansion of the magnetic shape memory member causes an actuated portion of the second compliant member to translate about an axis. The fan member is coupled to the actuated portion of the compliant member such that translation of the actuated portion translates the fan member. | 07-25-2013 |
20130308277 | TWO-PHASE HEAT TRANSFER ASSEMBLIES AND POWER ELECTRONICS MODULES INCORPORATING THE SAME - A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter. | 11-21-2013 |
20130343913 | DIAPHRAGM PUMP - An apparatus that includes a chamber. The chamber includes an inlet via which process fluid enters the chamber and an outlet via which the process fluid exits the chamber. A diaphragm is fixed in position in the chamber at a periphery of the diaphragm. The diaphragm includes a magnetic fluid therein. | 12-26-2013 |
20140028424 | METAMATERIAL MAGNETIC FIELD GUIDE - A magnetic field manipulation apparatus comprises a metamaterial structure, the metamaterial structure including a multilayer stack of metamaterial layers, each metamaterial layer including a substrate supporting one or more conductive loops. The metamaterial structure may be configured to redirect the magnetic flux around the metamaterial structure, and in some examples concentrated into a gap between two adjacent metamaterial structures. An apparatus may further include a magnetic field source such as an electromagnet. | 01-30-2014 |
20140028425 | MAGNETIC FIELD MANIPULATION DEVICES - Magnetic field manipulation devices and magnetic actuators are disclosed. In one embodiment, a magnetic field manipulation device includes an iron base substrate having a surface, and at least four electrically conductive loops embedded in the surface of the iron substrate. The at least four electrically conductive loops are electrically coupled to one another, and are arranged in the surface of the iron substrate such that the magnetic field manipulation device diverges magnetic flux lines of a magnetic field generated by a magnetic field source positioned proximate the magnetic field manipulation device. In another embodiment, the at least four electrically conductive loops are electrically isolated such that the magnetic field manipulation device converges magnetic flux lines of a magnetic field generated by a magnetic field source positioned proximate the magnetic field manipulation device. | 01-30-2014 |
20140029199 | COOLING APPARATUSES AND ELECTRONICS MODULES HAVING BRANCHING MICROCHANNELS - Electronics modules and cooling apparatuses having branching microchannels for liquid cooling by jet impingement and fluid flow are disclosed. In one embodiment, a cooling apparatus includes a heat receiving surface and an array of branching microchannel cells. Each branching microchannel cell includes an inlet manifold fluidly coupled to the heat receiving surface and a branching microchannel manifold fluidly coupled to the inlet manifold. The branching microchannel manifold includes a plurality of fins that orthogonally extend from the heat receiving surface such that the plurality of fins define a plurality of branching microchannels that is normal with respect to the heat receiving surface. The cooling apparatus further includes an outlet manifold fluidly coupled to the plurality of branching microchannels. The coolant fluid flows through the plurality of branching microchannels in a direction normal to the heat receiving surface. | 01-30-2014 |
20140029203 | ELECTRONIC DEVICE ASSEMBLIES AND VEHICLES EMPLOYING DUAL PHASE CHANGE MATERIALS - Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state. | 01-30-2014 |
20140140006 | Cooling Apparatuses Having Sloped Vapor Outlet Channels - Jet impingement and two-phase cooling apparatuses with sloped vapor outlet channels are disclosed. In one embodiment, a cooling apparatus includes a fluid inlet channel, a jet orifice surface having one or more jet orifices fluidly coupled to the fluid inlet channel such that coolant fluid within the fluid inlet channel flows through the one or more jet orifices as one or more impingement jets, and a target surface. The target surface and the jet orifice surface define an impingement chamber where the one or more impingement jets impinge the target surface at an impingement region such that at least some of the coolant fluid changes to a vapor. The cooling apparatus further includes a plurality of sloped vapor outlet channels that are fluidly coupled to the impingement chamber. Coolant fluid flows through the plurality of sloped vapor outlet channels after it impinges the target surface. | 05-22-2014 |
20140168894 | Cooling Apparatuses, Electronic Device Assemblies, and Cooling Assemblies Using Magnetic Shape Memory Members - Cooling apparatuses, electronic device assemblies, and cooling assemblies having a magnetic shape memory member are disclosed. In one embodiment, a cooling apparatus includes a first compliant member, a magnetic shape memory member, a magnetic field generating device, a second compliant member and a fan member. A first end of the magnetic shape memory member is coupled to the first compliant member. The magnetic field generating device is positioned proximate the magnetic shape memory member, and generates a magnetic field toward the magnetic shape memory member to cause the magnetic shape memory member to expand along a linear translation axis. Expansion of the magnetic shape memory member causes an actuated portion of the second compliant member to translate about an axis. The fan member is coupled to the actuated portion of the compliant member such that translation of the actuated portion translates the fan member. | 06-19-2014 |
20140190665 | Modular Jet Impingement Cooling Apparatuses With Exchangeable Jet Plates - Modular cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes an inlet manifold, a jet plate manifold, a plurality of jet plates, a vapor manifold, and a target layer. The inlet manifold includes a fluid distribution chamber, and a plurality of fluid distribution channels symmetrically located within the fluid distribution chamber. The jet plate manifold is coupled to the inlet manifold such that the plurality of jet plate openings is vertically aligned with respect to the plurality of fluid distribution channels. The plurality of jet plates is removably disposed in the jet plate manifold. The vapor manifold has a plurality of walls that define a vapor manifold opening and at least one outlet channel through at least one of the walls. The target layer is coupled to the vapor manifold such that the jet orifice surface of each jet plate is positioned above the target layer. | 07-10-2014 |
20140192485 | VEHICLES, POWER ELECTRONICS MODULES AND COOLING APPARATUSES WITH SINGLE-PHASE AND TWO-PHASE SURFACE ENHANCEMENT FEATURES - Jet-impingement, two-phase cooling apparatuses and power electronics modules having a target surface with single- and two-phase surface enhancement features are disclosed. In one embodiment, a cooling apparatus includes a jet plate surface and a target layer. The jet plate surface includes a jet orifice having a jet orifice geometry, wherein the jet orifice is configured to generate an impingement jet of a coolant fluid. The target layer has a target surface, single-phase surface enhancement features, and two-phase surface enhancement features. The target surface is configured to receive the impingement jet, and the single-phase surface enhancement features and the two-phase enhancement features are arranged on the target surface according to the jet orifice geometry. The single-phase surface enhancement features are positioned on the target surface at regions associated with high fluid velocity, and the two-phase surface enhancement features are positioned on the target surface at regions associated with low fluid velocity. | 07-10-2014 |
20140207428 | Methods for Orienting Material Physical Properties Using Constraint Transformation and Isoparametric Shape Functions - Constraint-based methods for determining orientations of material physical properties using an isoparametric shape function are disclosed. In one embodiment, a method of defining an orientation of an material physical property includes defining nonlinear and/or discontinuous design constraints of design values in a geometric domain associated with one or more physical attributes of the material physical property, and translating the nonlinear and/or discontinuous design constraints into continuous, first order design constraints of the design values by applying an isoparametric shape function. The method further includes performing a topology optimization using the continuous, first order design constraints of the design values, and reverse-translating results of the topology optimization back into the geometric domain using the isoparametric shape function. The results of the topology optimization in the geometric domain are indicative of the orientation of the material physical property. | 07-24-2014 |
20140284039 | THERMAL ENERGY GUIDING SYSTEMS INCLUDING ANISOTROPIC THERMAL GUIDING COATINGS AND METHODS FOR FABRICATING THE SAME - Thermal energy guiding systems and methods for fabricating thermal energy guiding systems are provided. A thermal energy guiding system includes a thermal energy source and an anisotropic thermal guiding coating in thermal communication with a surface of the thermal energy source. The anisotropic thermal guiding coating includes a plurality of layers including a first layer and a second layer. The first layer has a first thermal conductivity and the second layer has a second thermal conductivity. The plurality of layers are non-uniformly arranged on the surface of the thermal energy source in order to guide thermal energy from the thermal energy source according to a thermal energy management objective. | 09-25-2014 |
20140291696 | POWER ELECTRONICS MODULES WITH SOLDER LAYERS HAVING REDUCED THERMAL STRESS - Power electronics modules having solder layers with reduced thermal-stress are disclosed. In one embodiment, a power electronics module includes a power electronics device having a first surface, a second surface, a first edge, and a second edge opposite the first edge. The power electronics device has a device length measured from the first edge to the second edge. A first solder layer is adjacent to the first surface of the power electronics device, and a second solder layer is adjacent to the second surface. The first solder layer and the second solder layer have a maximum thickness T along a length that is less than the device length of the power electronics device. A first thermally conductive layer is adjacent to the first solder layer, and a second thermally conductive layer is adjacent to the second solder layer. In some embodiments, the first and second solder layers have tapered portions. | 10-02-2014 |
20140318758 | COMPOSITE LAMINAE HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MANAGEMENT APPARATUSES COMPRISING THE SAME - Heat transfer management apparatuses according to the present disclosure includes a composite lamina having an insulator substrate and a thermal conductor at least partially embedded in the insulator substrate, a temperature-sensitive component coupled to the composite lamina, and a temperature-insensitive component coupled to the composite lamina and positioned distally from the temperature-sensitive component. The temperature-insensitive component produces heat during operation. The thermal conductor and the insulator substrate are arranged into a targeted heat transfer region proximate to the temperature-sensitive component and a bulk region proximate to the temperature-insensitive component. The targeted heat transfer region and the bulk region are in thermal continuity with one another. | 10-30-2014 |
20140318829 | PRINTED WIRING BOARDS HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MANAGEMENT APPARATUSES COMPRISING THE SAME - A printed wiring board includes an insulator substrate, an electrical conductor at least partially embedded in the insulator substrate, and a thermal conductor at least partially embedded in the insulator substrate. The printed wiring board also includes a temperature-insensitive component mounting region and a temperature-sensitive component mounting region. The insulator substrate and the thermal conductor are arranged into a targeted heat transfer region proximate to the temperature-sensitive component mounting region and a bulk region at positions spaced apart from the temperature-sensitive component mounting region. | 10-30-2014 |
20140346660 | POWER ELECTRONICS DEVICES HAVING THERMAL STRESS REDUCTION ELEMENTS - Power electronics devices having thermal stress reduction elements are disclosed. A power electronics device includes a heat source having a heat source perimeter, a first conduction member coupled to the heat source, and a substrate coupled to the first conduction member. The first conduction member includes a support portion that extends to at least the heat source perimeter and a plurality of finger portions extending from the support portion and separated from one another by web regions, where the plurality of finger portions have a finger thickness that is greater than a web thickness of the web regions. | 11-27-2014 |
20140347817 | JET IMPINGEMENT COOLERS AND POWER ELECTRONICS MODULES COMPRISING THE SAME - Jet impingement assemblies and power electronics devices incorporating jet impingement assemblies are described. The jet impingement assemblies include a fluid inlet, a fluid outlet, a manifold, and a heat distribution member. The manifold includes a distribution side in fluid communication with the fluid inlet, a collection side in fluid communication with the fluid outlet, a plurality of orifices extending from the distribution side to the collection side, and a return channel extending from the collection side to the distribution side. The heat distribution member is positioned proximate to the collection side of the manifold. | 11-27-2014 |
20150109736 | Electronic Device Assemblies and Vehicles Employing Dual Phase Change Materials - Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state. | 04-23-2015 |
20150351279 | ANISOTROPIC THERMAL ENERGY GUIDING SHELLS AND METHODS FOR FABRICATING THERMAL ENERGY GUIDING SHELLS - Anisotropic thermal energy guiding shells and methods for fabricating thermal energy guiding shells are provided. An anisotropic thermal energy guiding shell includes an interior volume defined within the anisotropic thermal energy guiding shell, a plurality of thermally conductive fibers, and at least one component attachment region. The plurality of thermally conductive fibers are arranged to guide thermal energy received by the anisotropic thermal energy guiding shell non-uniformly relative to the at least one component attachment region according to a thermal energy management objective. A method for fabricating a thermal energy guiding shell includes forming a composite fabric of thermally conductive fibers, impregnating the composite fabric of thermally conductive fibers with a resin, curing the impregnated composite fabric of thermally conductive fibers, and forming the impregnated composite fabric of thermally conductive fibers into the thermal energy guiding shell. | 12-03-2015 |
Patent application number | Description | Published |
20080255265 | Glass Filler Material and Method of Production - The present invention relates to a glass filler material with an average particle size of 0.1-20 μm. It further relates to a method for producing a glass filler material. The glass filler material comprises 65-99.95 mol % silicon dioxide (SiO | 10-16-2008 |
20080319102 | Dental Composition Containing Epoxy Functional Polymerizable Compounds - The present invention relates to dental compositions comprising a halogenated epoxy functional ether derivative comprising at least one aryl alkyl ether moiety, at least one halogen atom attached to each aryl residue of the aryl alkyl ether moieties, at least two aliphatic epoxy moieties, no glycidyl ether structure, an initiator, optionally filler and optionally additive components selected from the group of modifiers, dyes, pigments, thixotropic agents, flow improvers, polymeric thickeners, surfactants, odorous substances, diluting agent(s) and flavourings. | 12-25-2008 |
20100197824 | METHACRYLATE BASED MONOMERS CONTAINING A URETHANE LINKAGE, PROCESS FOR PRODUCTION AND USE THEREOF - The invention relates to a dental composition comprising a monomer or mixture of monomers represented by the following structure | 08-05-2010 |
20110077361 | INITIATOR SYSTEM CONTAINING A DIARYLALKYLAMINE DERIVATE, HARDENABLE COMPOSITION AND USE THEREOF - The invention relates to an initiator system comprising a diarylalkylamine compound and a sensitizing agent. The invention also relates to a hardenable composition comprising the initiator system. The invention further relates to the use of the initiator system for initiating the hardening process of a hardenable composition being selected from cationically curing composition(s) and/or radically curing composition(s) or a mixture thereof. The initiator system and the hardening composition can be used in various fields, including the dental and orthodontic area. | 03-31-2011 |
20110124764 | INITIATOR SYSTEM WITH BIPHENYLENE DERIVATES, METHOD OF PRODUCTION AND USE THEREOF - The invention relates to an initiator system comprising (a) an iodonium salt, (b) a light sensitizer and (c) an electron donor compound comprising a biphenylene structure, the biphenylene structure comprising at least one but not more than about 4 alkyl groups. The invention also relates to a hardenable composition comprising such an initiator system and the use thereof, as well as to a process for producing the substituted biphenylene compound. | 05-26-2011 |
20130109777 | DENTAL COMPOSITION, KIT OF PARTS AND USE THEREOF | 05-02-2013 |
20130143176 | KIT OF PARTS, METHOD OF PRODUCING AND USE THEREOF - The present disclosure relates to a kit of parts comprising part A and part B, part A comprising a polymerizable component having an acid group in the molecule, an initiator, part B comprising an activator, and a film former with a molecular weight of at least 1000. The present disclosure also relates to a composition obtainable by mixing the components contained in the kit of parts and to a process for producing the kit of parts comprising the steps of bringing the components contained in part B of the kit in contact with a surface, drying the surface to form a film. | 06-06-2013 |
20130303655 | DENTAL COMPOSITION, METHOD OF PRODUCING AND USE THEREOF - The invention relates to a dental composition having
| 11-14-2013 |
20140200284 | DENTAL COMPOSITION, METHOD OF PRODUCING AND USE THEREOF - The invention is directed to a composition comprising a) compound (A) being characterized by at least the following features: comprising a backbone unit (U) comprising a tricylclic hydrocarbon moiety, two spacer units (S) each comprising a hydrocarbon chain (G) being directly connected to the backbone unit (U) via an urethane moiety, and at least two reactive groups (M) being connected to the hydrocarbon chain (G) via an ester linkage, with (G) being a non-branched hydrocarbon chain having a length of at least 3 carbon atoms, (G) not comprising ether moieties, and (M) being selected from acroyl and methacroyl, b) initiator (B) and c) optionally filler (C), the composition being a dental composition. | 07-17-2014 |
20140377718 | DENTAL MILLING BLOCK CONTAINING INDIVIDUALIZED DENTAL ARTICLE AND PROCESS OF PRODUCTION - The invention relates to a dental milling block ( | 12-25-2014 |