Patent application number | Description | Published |
20100277832 | PMR writer device with multi-level tapered write pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the tapered tip, giving the write pole a stepped profile. The tapered tip can be two sloped surfaces that are symmetric about a mid plane of the main pole or the taper can be a single sloped edge on the leading side or the trailing side of the pole. The yoke structure can consist of a single yoke formed on one side of the main pole or it can consist of two yokes formed symmetrically on both the leading and trailing sides of the main pole. Other yoke/pole combinations are also described as are various shield formations. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities. | 11-04-2010 |
20110051293 | Tapered PMR write pole with straight side wall portion - A main pole layer with a tapered trailing side is disclosed that has three sections each with a write pole portion along the ABS and a yoke portion. A lower section has a bottom surface including a leading edge at the write pole tip and sidewalls with a bevel angle between 4 and 20 degrees. The middle section has essentially vertical sidewalls with a tapered side starting at the trailing edge and extending to a back side of the write pole and into the yoke. An upper section includes a portion of the tapered side and a top surface of the main pole layer and has a sidewall with a bevel angle from 0 to 45 degrees. The thickness of the middle section is greater than the pole height variation caused by variations in back end processes including ion milling and lapping to reduce erase width (EW) variations. | 03-03-2011 |
20110063755 | PMR write with flux choking area - A PMR writer having a trailing shield structure is disclosed in which a flux choking layer (FCL) formed adjacent to the ABS provides a means to limit the amount of flux flowing from the trailing shield to a first write shield (WS | 03-17-2011 |
20110097601 | Wrap-around shielded writer with highly homogeneous shield material - A perpendicular magnetic recording (PMR) head is fabricated with a main pole shielded laterally by a pair of side shields, shielded above by a trailing shield and shielded optionally below by a leading shield. The shields and the seed layers on which they are formed are formed of materials having substantially the same physical characteristics including the same material composition, the same hardness, the same response to processes such as ion beam etching (IBE), chemical mechanical polishing (CMP), mechanical lapping, such as the slider ABS lapping, the same coefficient of thermal expansion (CTE) as well as the same B | 04-28-2011 |
20110097602 | External field robustness of read/write head shields - An improved magnetic shield for a perpendicular magnetic write head is disclosed. Its main feature is a pair of tabs at the shield's bottom corners. Said tabs are significantly wider at their point of attachment to the shield than further away from the shield. The end portions of each tab slope upwards (away from the ABS) at an angle of about ten degrees. A process for manufacturing the shield is also disclosed. | 04-28-2011 |
20110102942 | Writer and reader arrangements for shingled writing - A sloped reader is disclosed that reduces skew between reader and written transitions in shingled writing. The reader is formed between surfaces of S1 and S2 shields that are aligned parallel to the sloped reader. A PMR writer is described that straightens transition curvature and reduces signal-to-noise ratio in shingled writing. In one embodiment, a symmetrical writer with a bowed trailing edge where two corners have a greater pole height than a center portion may be used for either right corner or left corner shingled writing. In a second embodiment, an asymmetrical writer is formed with a straight and sloped trailing edge such that the write corner has a greater pole height than the opposite corner on the trailing edge. The bowed angle in the symmetrical writer and slope angle in the asymmetrical writer is between 5 and 45 degrees and preferably between 10 and 30 degrees. | 05-05-2011 |
20110249364 | PMR writer with seamless shields and method of making it - A process (and the structure resulting therefrom) is described for manufacturing a magnetic write head in which there is no physical interface between the first and second trailing shields. This is achieved by the introduction of a sacrificial layer immediately after the top yoke plating has been done and its photoresist mold has been stripped. | 10-13-2011 |
20110255196 | PMR writer with graded side shield - A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a graded side shield that is conformal to the shape of the pole tip at an upper portion of the shield but not conformal to the pole tip at a lower portion. The shield includes a trailing shield, that is conformal to the trailing edge of the pole tip and may include a leading edge shield that magnetically connects two bottom ends of the graded side shield. | 10-20-2011 |
20110273802 | Side shielded magnetoresistive(MR) read with perpendicular magnetic free layer - A MR sensor is disclosed that has a free layer (FL) with perpendicular magnetic anisotropy (PMA) which eliminates the need for an adjacent hard bias structure to stabilize free layer magnetization and minimizes shield-FL interactions. In a TMR embodiment, a seed layer, free layer, junction layer, reference layer, and pinning layer are sequentially formed on a bottom shield. After patterning, a conformal insulation layer is formed along the sensor sidewall. Thereafter, a top shield is formed on the insulation layer and includes side shields that are separated from the FL by a narrow read gap. The sensor is scalable to widths <50 nm when PMA is greater than the FL self-demag field. Effective bias field is rather insensitive to sensor aspect ratio which makes tall stripe and narrow width sensors a viable approach for high RA TMR configurations. Side shields may be extended below the seed layer plane. | 11-10-2011 |
20120008229 | Magnetic core plasmon antenna with improved coupling efficiency - A TAMR (Thermal Assisted Magnetic Recording) write head uses the energy of optical-laser generated plasmons in a magnetic core plasmon antenna to locally heat a magnetic recording medium and reduce its coercivity and magnetic anisotropy. To enable the TAMR head to operate most effectively, the maximum gradient and value of the magnetic recording field should be at a point of the magnetic medium that is as close as possible to the point being heated. In addition, the coupling between the optical mode and the plasmon mode should be efficient so that maximum energy is transmitted to the medium. The present invention achieves both these objects by surrounding the magnetic core of a plasmon antenna by a variable thickness plasmon generating layer, whose thinnest and shortest portion is at the ABS end of the TAMR head and whose thickest and longest portion efficiently couples to the optical mode of a waveguide to produce a plasmon. | 01-12-2012 |
20120044598 | Writer shields with modified shapes for reduced flux shunting - A perpendicular magnetic recording (PMR) head is fabricated with a configuration of leading edge shields and trailing edge shields that reduce the leakage of flux between the main pole and the shields. The reduction of leakage is achieved by eliminating the sharp 90° corner between the backside surfaces of the shields and the surfaces adjacent to the main pole. In one embodiment the corner is replaced by two successive acute angles, in another embodiment it is replaced by a rounded surface. In a final embodiment, leakage between the pole and trailing edge shield is achieved by shortening the length of the write gap by forming the shield with a double taper. | 02-23-2012 |
20120075749 | Magnetic write head with thin and thick portions for balancing writability and ate - A perpendicular magnetic recording (PMR) head is fabricated with a tapered main pole having a variable thickness. The tapered portion of the pole is at the ABS tip and it can be formed by bevels at the leading or trailing edges or both. The taper terminates to form a region with a maximum thickness, t | 03-29-2012 |
20130001190 | Method of Forming a PMR Writer Device with Multi-Level Tapered Write Pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole which creates an efficient channeling of magnetic flux to the pole tip. The write pole comprises a main pole with a tapered tip on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the tapered tip, giving the write pole a stepped profile. The tapered tip can be two sloped surfaces that are symmetric about a mid plane of the main pole or a single sloped edge on the leading side or the trailing side of the pole. The yoke structure can consist of a single yoke formed on one side of the main pole or it can consist of two yokes formed symmetrically on both the leading and trailing sides of the main pole. | 01-03-2013 |
20130003226 | PMR Writer Device with Multi-Level Tapered Write Pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on a leading edge or a trailing edge, on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the main pole, giving the head a stepped profile. The yoke can be a single yoke formed on one side of the main pole or it can be two yokes formed on both the leading and trailing sides of the main pole. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities. | 01-03-2013 |
20140091055 | Method of Making a PMR Writer with Graded Side Shield - A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a graded side shield that is conformal to the shape of the pole tip at an upper portion of the shield but not conformal to the pole tip at a lower portion. The shield includes a trailing shield, that is conformal to the trailing edge of the pole tip and may include a leading edge shield that magnetically connects two bottom ends of the graded side shield. | 04-03-2014 |
20140177103 | PMR Writer Device with Multi-Level Tapered Write Pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on a leading edge or a trailing edge, on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the main pole, giving the head a stepped profile. The yoke can be a single yoke formed on one side of the main pole or it can be two yokes formed on both the leading and trailing sides of the main pole. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities. | 06-26-2014 |
20150029616 | Wrap-Around Shielded Writer with Highly Homogeneous Shield Material - A perpendicular magnetic recording (PMR) head is fabricated with a main pole shielded laterally by a pair of side shields, shielded above by a trailing shield and shielded optionally below by a leading shield. The shields and the seed layers on which they are formed are formed of materials having substantially the same physical characteristics including the same material composition, the same hardness, the same response to processes such as ion beam etching (IBE), chemical mechanical polishing (CMP), mechanical lapping, such as the slider ABS lapping, the same coefficient of thermal expansion (CTE) as well as the same B | 01-29-2015 |
Patent application number | Description | Published |
20100283135 | LEAD FRAME FOR SEMICONDUCTOR DEVICE - A lead frame including a lead frame structure having a die support area and a plurality of electrical contact areas has shallow recesses formed on a surface of the lead frame structure. | 11-11-2010 |
20100317152 | METHOD FOR ASSEMBLING STACKABLE SEMICONDUCTOR PACKAGES - A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package. | 12-16-2010 |
20110108967 | SEMICONDUCTOR CHIP GRID ARRAY PACKAGE AND METHOD FOR FABRICATING SAME - A semiconductor chip grid array package includes a die attach pad and a plurality of connector pads. A semiconductor die is mounted on the die attach pad, the semiconductor die having external connection terminals electrically connected respectively to the connector pads. An encapsulating material encapsulates the die and connector pads. A stud protrudes from each of the connector pads for providing an external electrical contact for the semiconductor chip grid array package. Each of the connector pads and respective studs are formed from an electrically conductive sheet. The connector pads have a thickness of at least 60% of the thickness of the conductive sheet and the respective studs have a thickness of no more than 40% of the thickness of the conductive sheet. | 05-12-2011 |
20110263077 | METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION - A method of assembling semiconductor devices for surface mounting includes forming an array of lead frames in which supporting frame structures of adjacent lead frames include an intermediate common bar connecting on both its sides with sets of leads of the respective adjacent lead frames. The semiconductor devices are singulated by sawing through the leads on each side of the common bars without sawing the common bars longitudinally. The material sawn off from the common bars in a first direction is removed by washing it away before sawing off the intermediate common bars that run in an orthogonal direction. The supporting frame structures include bars surrounding the array and singulation includes sawing beside the surrounding bars to saw them off before sawing off the intermediate common bars. | 10-27-2011 |
20110316130 | THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads. | 12-29-2011 |
20120018858 | METHOD OF ASSEMBLING INTEGRATED CIRCUIT DEVICE - A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method further includes encapsulating the die with a first encapsulant, and the encapsulating the first encapsulant with a second encapsulant where the second encapsulant includes a material that provides electromagnetic shielding. | 01-26-2012 |
20120056311 | LEADFRAME FOR SEMICONDUCTOR DEVICE - A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers. | 03-08-2012 |
20120238058 | METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT - A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units. | 09-20-2012 |
20120286406 | SEMICONDUCTOR DEVICE WITH STAGGERED LEADS - A process for assembling a semiconductor device includes providing a lead frame having a native plane and a plurality of leads having a native lead pitch. The process includes trimming and forming a first subset of the plurality of leads to provide a first row of leads. The process includes trimming and forming a second subset of the plurality of leads to provide a second row of leads. At least one subset of leads is formed with an obtuse angle relative to the native plane such that lead pitch associated with the first or second subset of leads is greater than the native lead pitch. | 11-15-2012 |
20130049183 | POWER DEVICE AND METHOD OF PACKAGING SAME - A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers. | 02-28-2013 |
20130196473 | MOLD CHASE - A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows. | 08-01-2013 |
20130234306 | LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE - A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads. | 09-12-2013 |
20130249071 | SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME - A method of assembling a semiconductor device includes providing a lead frame having a die pad and a fame member with lead fingers that surround the die pad. The lead fingers have distal ends connected to the frame member and proximal ends near the die pad. A die is attached to the die pad and die connection pads are electrically connected to the proximal ends of the lead fingers with bond wires. The die, bond wires, and part of the lead fingers are encapsulated with an encapsulant. The encapsulating process includes separating the lead fingers into first and second sets of lead fingers. The proximal ends of the first set lie in a first plane and the proximal ends of the second set lie in a second plane that is spaced and maintained from the first plane solely by the encapsulation material. | 09-26-2013 |
20140191383 | POWER DEVICE AND METHOD OF PACKAGING SAME - A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers. | 07-10-2014 |
20140361421 | LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE - A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set. | 12-11-2014 |
20150028468 | NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME - A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling. | 01-29-2015 |