Tsapepas
Giorgos S. Tsapepas, Poughkeepsie, NY US
Patent application number | Description | Published |
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20090064082 | METHOD FOR CUSTOM REGISTER CIRCUIT DESIGN - A computer program product stored on machine readable media is disclosed. The computer program product includes machine executable instructions for implementing a method of automatically creating a custom register circuit with a Computer Aided Design (CAD) application. The method includes obtaining parameters of the custom register circuit via a graphical user interface, executing one or more custom functions using the obtained parameters, and creating a cell comprising the custom register circuit. | 03-05-2009 |
Giorgos Stellos Tsapepas, Poughkeepsie, NY US
Patent application number | Description | Published |
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20080320430 | Spare Gate Array Cell Distribution Analysis - A method for determining gate array distribution includes steps or acts of: randomly placing a plurality of test boxes in a logic circuit layout; counting the number of fill cells in each of the plurality of test boxes; recording the count; grouping the plurality of test boxes into two groups: a first group with local clock buffers and a second group without local clock buffers; determining the fill cell percentage of each of the plurality of test boxes; and flagging the test boxes with a poor distribution of gate array cells. | 12-25-2008 |
Stelios G. Tsapepas, Yorktown Heights, NY US
Patent application number | Description | Published |
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20100276796 | REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD - An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts. | 11-04-2010 |
Stelios G. Tsapepas, Poughkeepsie, NY US
Patent application number | Description | Published |
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20110171756 | REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD - An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts. | 07-14-2011 |