Patent application number | Description | Published |
20090253358 | POLISHING ARTICLE WITH INTEGRATED WINDOW STRIPE - A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis. | 10-08-2009 |
20100035515 | CHEMICAL MECHANICAL POLISHER WITH HEATER AND METHOD - A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad. | 02-11-2010 |
20100112919 | MONOLITHIC LINEAR POLISHING SHEET - A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt. | 05-06-2010 |
20100285666 | PROCESS SEQUENCE TO ACHIEVE GLOBAL PLANARITY USING A COMBINATION OF FIXED ABRASIVE AND HIGH SELECTIVITY SLURRY FOR PRE-METAL DIELECTRIC CMP APPLICATIONS - A method and apparatus for polishing or planarizing a pre-metal dielectric layer by a chemical mechanical polishing process are provided. The method comprises providing a semiconductor substrate having feature definitions formed thereon, forming a pre-metal dielectric layer over the substrate, wherein the as-deposited pre-metal dielectric layer has an uneven surface topography, and planarizing the uneven surface topography of the pre-metal dielectric layer using chemical mechanical polishing techniques, wherein planarizing the uneven surface topography comprises polishing the pre-metal dielectric layer with a fixed abrasive polishing pad and a first polishing composition to remove a bulk portion of the pre-metal dielectric layer and achieve a first predetermined planarity, and polishing the pre-metal dielectric layer with a non-abrasive polishing pad and high selectivity slurry to remove a residual portion of the pre-metal dielectric and achieve a second predetermined planarity. | 11-11-2010 |
20120021671 | REAL-TIME MONITORING OF RETAINING RING THICKNESS AND LIFETIME - A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, a method for monitoring at least one surface of a retaining ring coupled to a carrier head is provided. The method includes moving the carrier head adjacent a sensor device disposed in a polishing module, transmitting energy from the sensor device toward the retaining ring, receiving energy reflected from the retaining ring, and determining a condition of the retaining ring based on the received energy. | 01-26-2012 |
20140237905 | METHOD OF FORMING POLISHING SHEET - A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt. | 08-28-2014 |
Patent application number | Description | Published |
20120001135 | Antireflective Coatings for Via Fill and Photolithography Applications and Methods of Preparation Thereof - An absorbing composition is described herein that includes at least one inorganic-based compound, at least one absorbing compound, and at least one material modification agent. In addition, methods of making an absorbing composition are also described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) allowing the reaction mixture to form the absorbing composition at room temperature. Another method of making an absorbing composition includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) heating the reaction mixture to form the absorbing composition. Yet another method of making an absorbing composition is described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) heating the reaction mixture to form an absorbing material, a coating or a film. In other methods of making an absorbing composition described herein, those methods include: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) allowing the reaction mixture to form an absorbing material, a coating or a film. | 01-05-2012 |
Patent application number | Description | Published |
20080291634 | THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF - Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile. | 11-27-2008 |
20090026924 | METHODS OF MAKING LOW-REFRACTIVE INDEX AND/OR LOW-K ORGANOSILICATE COATINGS - A method for forming a substantially transparent nanoporous organosilicate film on a substantially transparent substrate, for use in optical lighting devices such as organic light emitting diodes (OLEDs). The method includes first preparing a composition comprising a silicon containing pre-polymer, a porogen, and a catalyst. The composition is coated onto a substrate which is substantially transparent to visible light, forming a film thereon. The film is then gelled by crosslinking and cured by heating, such that the resulting cured film is substantially transparent to visible light. It is preferred that both the substrate and the nanoporous film are at least 98% transparent to visible light. Optical devices which include the resulting structures of this invention exhibit improved light extraction and illuminance where the nanoporous organosilicate film has a low refractive index in the range of 1.05 to 1.4, serving as an impedance matching layer in such devices. | 01-29-2009 |
Patent application number | Description | Published |
20090239363 | METHODS FOR FORMING DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES USING NON-CONTACT PRINTING PROCESSES AND DOPANT-COMPRISING INKS FOR FORMING SUCH DOPED REGIONS USING NON-CONTACT PRINTING PROCESSES - Methods for forming doped regions in semiconductor substrates using non-contact printing processes and dopant-comprising inks for forming such doped regions using non-contact printing processes are provided. In an exemplary embodiment, a method for forming doped regions in a semiconductor substrate is provided. The method comprises providing an ink comprising a conductivity-determining type dopant, applying the ink to the semiconductor substrate using a non-contact printing process, and subjecting the semiconductor substrate to a thermal treatment such that the conductivity-determining type dopant diffuses into the semiconductor substrate. | 09-24-2009 |
20100035422 | METHODS FOR FORMING DOPED REGIONS IN A SEMICONDUCTOR MATERIAL - Methods for forming doped regions in a semiconductor material that minimize or eliminate vapor diffusion of a dopant element and/or dopant from a deposited dopant and/or into a semiconductor material and methods for fabricating semiconductor devices that minimize or eliminate vapor diffusion of a dopant element and/or dopant from a deposited dopant and/or into a semiconductor material are provided. In one exemplary embodiment, a method for forming doped regions in a semiconductor material comprises depositing a conductivity-determining type dopant comprising a dopant element overlying a first portion of the semiconductor material. A diffusion barrier material is applied such that it overlies a second portion of the semiconductor material. The dopant element of the conductivity-determining type dopant is diffused into the first portion of the semiconductor material. | 02-11-2010 |
20100081264 | METHODS FOR SIMULTANEOUSLY FORMING N-TYPE AND P-TYPE DOPED REGIONS USING NON-CONTACT PRINTING PROCESSES - Methods for simultaneously forming doped regions of opposite conductivity using non-contact printing processes are provided. In one exemplary embodiment, a method comprises the steps of depositing a first liquid dopant comprising first conductivity-determining type dopant elements overlying a first region of a semiconductor material and depositing a second liquid dopant comprising second conductivity-determining type dopant elements overlying a second region of the semiconductor material. The first conductivity-determining type dopant elements and the second conductivity-determining type dopant elements are of opposite conductivity. At least a portion of the first conductivity-determining type dopant elements and at least a portion of the second conductivity-determining type dopant elements are simultaneously diffused into the first region and into the second region, respectively. | 04-01-2010 |
20100162920 | BORON-COMPRISING INKS FOR FORMING BORON-DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES USING NON-CONTACT PRINTING PROCESSES AND METHODS FOR FABRICATING SUCH BORON-COMPRISING INKS - Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks are provided. A boron-comprising ink comprises boron from or of a boron-comprising material and a spread-minimizing additive that results in a spreading factor of the boron-comprising ink in a range of from about 1.5 to about 6. The boron-comprising ink has a viscosity in a range of from about 1.5 to about 50 centipoise and, when deposited on a semiconductor substrate, provides a post-anneal sheet resistance in a range of from about 10 to about 100 ohms/square, a post-anneal doping depth in a range of from about 0.1 to about 1 μm, and a boron concentration in a range of from about 1×10 | 07-01-2010 |
20100167511 | METHODS FOR SIMULTANEOUSLY FORMING DOPED REGIONS HAVING DIFFERENT CONDUCTIVITY-DETERMINING TYPE ELEMENT PROFILES - Method for simultaneously forming doped regions having different conductivity-determining type elements profiles are provided. In one exemplary embodiment, a method comprises the steps of diffusing first conductivity-determining type elements into a first region of a semiconductor material from a first dopant to form a doped first region. Second conductivity-determining type elements are simultaneously diffused into a second region of the semiconductor material from a second dopant to form a doped second region. The first conductivity-determining type elements are of the same conductivity-determining type as the second conductivity-determining type elements. The doped first region has a dopant profile that is different from a dopant profile of the doped second region. | 07-01-2010 |
20110021012 | COMPOSITIONS FOR FORMING DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES, METHODS FOR FABRICATING SUCH COMPOSITIONS, AND METHODS FOR FORMING DOPED REGIONS USING SUCH COMPOSITIONS - Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions are provided. In one embodiment, a dopant-comprising composition comprises a conductivity-determining type impurity dopant, a silicate carrier, a solvent, and a moisture adsorption-minimizing component. In another embodiment, a dopant-comprising composition comprises a conductivity-determining type impurity dopant, a silicate carrier, a solvent, and a high boiling point material selected from the group consisting of glycol ethers, alcohols, and combinations thereof. The high boiling point material has a boiling point of at least about 150° C. | 01-27-2011 |
20130098266 | DOPANT INK COMPOSITIONS FOR FORMING DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES, AND METHODS FOR FABRICATING DOPANT INK COMPOSITIONS - Dopant ink compositions for forming doped regions in semiconductor substrates and methods for fabricating dopant ink compositions are provided. In an exemplary embodiment, a dopant ink composition comprises a dopant compound including at least one alkyl group bonded to a Group 13 element or a Group 15 element. Further, the dopant ink composition includes a silicon-containing compound. | 04-25-2013 |
20130240794 | BORON-COMPRISING INKS FOR FORMING BORON-DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES USING NON-CONTACT PRINTING PROCESSES AND METHODS FOR FABRICATING SUCH BORON-COMPRISING INKS - A method for fabricating a boron-comprising ink is provided. The method includes providing an inorganic boron-comprising material, combining the inorganic boron-comprising material with a polar solvent having a boiling point in a range of from about 50° C. to about 250° C., and combining the inorganic boron-comprising material with a spread-minimizing additive that results in a spreading factor of the boron-comprising ink in a range of from about 1.5 to about 6. | 09-19-2013 |
Patent application number | Description | Published |
20100114962 | METHOD AND TOOLS FOR IDENTIFYING IMPACT OF DATABASE CHANGES ON AN APPLICATION - A technique is disclosed for identifying impact of database changes on an application. Given a proposed database change, affected source code is identified that is affected by the proposed database change. References to the affected source code are created and organized into a hierarchy. A user can ascertain the extent of the impact by viewing the hierarchy and by using the hierarchy to access and view the affected source code in a visually distinct manner. | 05-06-2010 |
20110137891 | CLIENT AND DATABASE PROBLEM DETERMINATION AND MONITORING - Provided are techniques for collecting client information for client applications running on a client computer, wherein the client information includes a client application identifier for each client application that issues queries to a database along with text of each of the queries that the client application issues; collecting database monitoring information that includes text of each query issued against the database and performance information for each query; combining the client information and the database monitoring information based on the text of the queries to obtain combined information that provides the client application identifier and the performance information for each of the queries; and identifying a problem query and at least one client application that has issued the problem query using the combined information. | 06-09-2011 |
20110153675 | COMMON CONNECTION DEFINITIONS FOR DATABASE CLIENTS - A system and method for connection of an application program to its corresponding database in a relational database system environment. Rather than embedding connection configuration information or properties in an application program, connection configurations are stored in a connection configuration repository. The connection configuration repository is likewise stored in a database within the relational database system environment. The connection configuration information stored in the configuration repository may be updated, revised, deleted or assembled into groups/subgroups, without affecting the application programs. | 06-23-2011 |
20110270857 | Method and System for Centralized Control of Database Applications - According to one embodiment of the present invention, a system enables control of database applications. The system comprises a computer system including a database application to provide access to a database system, and at least one processor. The computer system requests retrieval of application specific property information for the database application from a data repository, and applies the retrieved application specific property information to the database application to control operation of the database application. Embodiments of the present invention further include a method and computer program product for controlling database applications in substantially the same manner described above. | 11-03-2011 |
20120159433 | METHOD AND TOOLS FOR IDENTIFYING IMPACT OF DATABASE CHANGES ON AN APPLICATION - A technique is disclosed for identifying impact of database changes on an application. Given a proposed database change, affected source code is identified that is affected by the proposed database change. References to the affected source code are created and organized into a hierarchy. A user can ascertain the extent of the impact by viewing the hierarchy and by using the hierarchy to access and view the affected source code in a visually distinct manner. | 06-21-2012 |
Patent application number | Description | Published |
20080294657 | HANDLING ERROR DOCUMENTS IN A TEXT INDEX - Provided are techniques for handling error documents. One or more entries for error documents are stored in a text index. A document with a document identifier is received. It is determined whether the document has an entry in the text index. | 11-27-2008 |
20080313181 | DEFINING A WEB CRAWL SPACE - Provided are techniques for defining a web crawl space to be crawled. A seed list including one or more seed names is received from a user, wherein each seed name represents a website. In response to receiving the seed list, a web crawl space for the received seed list is generated by generating one or more allow rules. | 12-18-2008 |
20100332473 | CORRELATING QUERIES ISSUED BY APPLICATIONS WITH THEIR SOURCE LINES AND ANALYZING APPLICATIONS FOR PROBLEM DETERMINATION AND WHERE USED ANALYSIS - Provided are techniques for invoking with a processor executing on a computer a source code parser to obtain source information that includes a first location of an Application Programming Interface (API) call and parameters of the API call in source code of a client application, where the parameters the API call do not include query text for a query that is to be used to access a database; examining a stack trace to determine a second location of the API call in the stack trace; and deriving the query of the API call and a third location of the query in the source code by identifying the query in the stack trace at the location of the API call in the stack trace. | 12-30-2010 |
20130185282 | CLIENT AND DATABASE PROBLEM DETERMINATION AND MONITORING - Provided are techniques for collecting client information for client applications running on a client computer, wherein the client information includes a client application identifier for each client application that issues queries to a database along with text of each of the queries that the client application issues; collecting database monitoring information that includes text of each query issued against the database and performance information for each query; combining the client information and the database monitoring information based on the text of the queries to obtain combined information that provides the client application identifier and the performance information for each of the queries; and identifying a problem query and at least one client application that has issued the problem query using the combined information. | 07-18-2013 |