Garo
Garo Khanarian, Princeton, NJ US
Patent application number | Description | Published |
---|---|---|
20090146324 | Phenoxyphenyl polysiloxane composition and method for making and using same - A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with cured phenoxyphenyl polysiloxane are further disclosed. | 06-11-2009 |
20110232758 | Thin film photovoltaic cell - A thin film photovoltaic cell is provided having a substrate; a back contact provided on the substrate; a p-type semiconductor absorber layer provided on the back contact; a n-type semiconductor layer provided on the p-type semiconductor absorber layer; a dielectric organic material layer provided on the n-type semiconductor layer; a transparent conductive film provided on the dielectric organic material layer; and, optionally, an antireflective layer provided on the transparent conductive film. Also provided is a method of manufacturing a thin film photovoltaic cell. | 09-29-2011 |
20130045292 | Curable liquid composite light emitting diode encapsulant - A curable liquid polysiloxane/TiO | 02-21-2013 |
20130045552 | Light emitting diode manufacturing method - A method of making a light emitting diode (LED) having an optical element is provided, comprising: providing a curable liquid polysiloxane/TiO | 02-21-2013 |
20140027954 | Method of manufacturing high aspect ratio silver nanowires - A process for manufacturing silver nanowires is provided, comprising: providing a silver ink core component containing ≧60 wt % silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component depositing on the substrate a core shell fiber having a core and a shell surrounding the core, wherein the silver nanoparticles are in the core; and, treating the silver nanoparticles to form a population of silver nanowires, wherein the population of silver nanowires exhibit an average length, L, of ≧60 μm. | 01-30-2014 |
20140065300 | Method of Manufacturing Silver Miniwire Films - A method of manufacturing a silver miniwire film is provided, wherein the film exhibits a reduced sheet resistance. | 03-06-2014 |
20140131078 | Method of Manufacturing A Patterned Transparent Conductor - Method of manufacturing patterned transparent conductor is provided, comprising: providing a silver ink core component containing silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell. carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component to form a core shell fiber, wherein the silver nanoparticles are in the core; depositing the core shell fiber on the substrate; selectively treating a portion of the deposited core shell fiber to provide a patterned transparent conductor, wherein the patterned transparent conductor has a treated region and a non-treated region; wherein the treated region comprises a plurality of electrically interconnected silver miniwires and wherein the treated region is an electrically conductive region; and, wherein the non-treated region is an electrically insulative region. | 05-15-2014 |
20140290979 | Method Of Manufacturing A Patterned Transparent Conductor - Method of manufacturing patterned conductor is provided, comprising: providing a conductivised substrate, wherein the conductivised substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of masking fibers onto the electrically conductive layer; exposing the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the plurality of masking fibers is removed from the substrate, leaving an interconnected conductive network on the substrate covered by the plurality of masking fibers; and, exposing the plurality of masking fibers to the masking fiber solvent, wherein the plurality of masking fibers are removed to uncover the interconnected conductive network on the substrate. | 10-02-2014 |
Garo Kiremidjian, Los Altos, CA US
Patent application number | Description | Published |
---|---|---|
20140012517 | Structural damage estimation based on measurements of rotations - Structural damage to a building is assessed based on measurement of point rotations using MEMS accelerometer sensors attached to structural columns of a building. The measured point rotations are wirelessly transmitted to a central unit which estimates residual drifts of the structural columns using a model of plastic deformation of the columns that incorporates empirically predetermined structural parameters of the columns such as a height of a column plastic bending point or a column curvature coefficient. The structural damage to the building is then estimated by determining a damage state from performance-based earthquake engineering performance thresholds that relate residual drift to damage. In some embodiments, multiple sensors are attached to each structural column of the building and measure corresponding point rotations at multiple points along the height of the column. | 01-09-2014 |
Garo Miyamoto, Tsukuba-Shi JP
Patent application number | Description | Published |
---|---|---|
20080251493 | Method for manufacturing printed wiring board with built-in capacitor - There is provided a method for manufacturing a wiring board with built-in capacitors in which small high-frequency capacitors, decoupling capacitors, and EMI filter capacitors can be built with precision by using the same method. The method includes preparing an insulating base material | 10-16-2008 |
20100236065 | Method of Producing Printed Circuit Board Incorporating Resistance Element - There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes | 09-23-2010 |
Garo Miyamoto, Ushiku-Shi JP
Patent application number | Description | Published |
---|---|---|
20080313887 | Method of producing printed circuit board incorporating resistance element - The present invention provides a method of producing a resistance element incorporated in a printed circuit board at an accuracy of resistance value of ±1% or less, at low cost and with a good yield while the resistance element formed by a resistor paste is incorporated. A method of producing a printed circuit board incorporating a resistance element includes: preparing a double-sided copper clad board having a first metallic foil on one face of an insulating base material thereof and a second metallic foil on the other face of the insulating base material thereof; providing at least a pair of electrodes on one of the metallic foils; printing a resistor paste between the electrodes to form a resistor; preparing a circuit board having at least one wiring layer; causing a layer on which the resistor paste is formed to oppose the circuit board to layer the double-sided copper clad board on the circuit board; forming openings in the first and the second metallic foils; and emitting laser through the openings to partly remove the insulating base material and the resistor paste to adjust resistance value. A conformal mask for etching may be formed on the second metallic foil to form openings in the insulating base material by etching to emit laser through the openings. | 12-25-2008 |
20090071599 | Method for manufacturing a printed-wiring board having a resistive element - A method for manufacturing a printed-wiring board having an organic resin insulating layer and a metal wiring layer and having a film-like resistive element formed on the metal wiring layer thereof, the method including: disposing a metal wiring layer on one surface of one organic resin insulating layer | 03-19-2009 |
20090097218 | Capacitor-embedded printed wiring board and method of manufacturing the same - There is provided a capacitor-embedded printed wiring board incorporating therein a capacitor having stabilized electrical characteristics. The capacitor-embedded printed wiring board includes: a capacitor having a first electrode | 04-16-2009 |
Garo Miyamoto, Tokyo JP
Patent application number | Description | Published |
---|---|---|
20150153523 | APPARATUS AND METHOD FOR MOUNTING PHOTOELECTRIC ELEMENT - A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis. | 06-04-2015 |
Garo Paroonagian, Upland, CA US
Patent application number | Description | Published |
---|---|---|
20080250557 | Plumbing System for a Shower - A prefabricated plumbing system or wall system for a shower includes a support frame, a plumbing system carried by the support frame and an enclosure member for enclosing the plumbing system within the support frame. The plumbing system includes a piping configuration for carrying a plurality of body spray mountings and includes a hot water inlet, a cold water inlet, water mixing valve arrangement and a control valve arrangement. Each body spray mounting supports a body spray unit and forms a jet array consisting of spray units. Control valves control the volume of water supplied to the body spray units and the water volume supplied to the water delivering devices. The prefabricated system is adapted to be manufactured as a unit and then shipped for installation in a shower as a unit. A steam seat arrangement for converting a shower into a steam bath is also provided. | 10-16-2008 |
20100187326 | Waterfall Unit - A waterfall unit for supplying a laminar flow of water into a water containment device. The waterfall unit comprising a fill spout having a water inlet for receiving water from a water source, a plenum chamber for containing an amount of water, and an elongated fill spout water outlet for expelling the water. A cover is provided for encasing at least a portion of the fill spout. The cover includes an elongated water outlet in alignment with the fill spout outlet. The waterfall unit also includes an enclosure member for enclosing the fill spout and the cover member to form a unit adapted for mounting onto a ledge of the water containment device. A related method for retrofitting a waterfall unit onto a water containment device is also provided. | 07-29-2010 |