Koji Tomita
Koji Tomita, Kawagoe-Shi JP
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20100270660 | Semiconductor device and method for manufacturing metallic shielding plate - Provided is a semiconductor device capable of preventing a semiconductor chip from being damaged by any sharp burrs of a metallic shielding plate. The semiconductor device includes a semiconductor chip and a metallic shielding plate provided on a circuit surface of the semiconductor chip. The metallic shielding plate is disposed in such a manner that a second surface of a shielding plate body is directed towards the circuit surface of the semiconductor chip, and burrs are positioned contiguous to the second surface of the shielding plate body. At distal ends of the burrs, cutting burrs are formed in a direction orthogonal to the second surface. The sharp burrs extend in a direction opposite to the semiconductor chip, so that the sharp burrs are prevented from damaging the circuit surface of the semiconductor chip. | 10-28-2010 |
20120074544 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region. | 03-29-2012 |
20140319663 | LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region. | 10-30-2014 |
Koji Tomita, Tokyo JP
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20090165107 | IDENTIFICATION MANAGMENT SYSTEM FOR ELECTRONIC DEVICE AUTHENTICATION - The conventional vertical integration system management form has a problem that a first user cannot receive a service provided by a second user belonging to another service system. To cope with this, a following system is suggested. That is, according to a second judgment server use request from a first electronic device used by a first user, an identification management server which has received a guarantee request outputted from a first judgment server searches for master-slave relationship information based on a common identifier. According to the search result, a guarantee is outputted. According to the guarantee, the first judgment server outputs a guaranteed service request to the second judgment server. Thus, the first user can receive the service used by the second user belonging to other vertical integration type system. | 06-25-2009 |
20090235340 | IDENTIFICATION MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE AUTHENTICATION - In the conventional vertical integration system management form, it is impossible or difficult to limit the electronic device function or format when providing a service to an electronic device which is judged by a judgment server of an administrator of the service providing system with whom a service provider has not concluded a contract. To cope with this, a following system is suggested. That is, according to a use request from a first electronic device to a second judgment server, an identification management server which has received a guarantee request outputted from a first judgment server searches an identification management unit for managing information including the electronic device identifiers. According to the search result, a guarantee is outputted. According to the guarantee, the first judgment server outputs a guaranteed service request to the second judgment server. Thus, it is possible to provide a more flexible service provision environment by cooperating the user identification management with other vertical integration type system management form. | 09-17-2009 |
20100223381 | IDENTIFICATION MANAGING SYSTEM FOR AUTHENTICATION OF ELECTRONIC DEVICE - In operation of a conventional vertical integration system a primary user cannot provide services to a secondary user belonging to other service group. An identification managing server is proposed to carry out the retrieval of a master-slave relation information by using common identification information as a key and outputs an assurance including its result when the identification managing server receives an assurance request output from a first judgment server at a request of a second judgment server from a first electronic device used by a primary user. Further, the first judgment server outputs an assured service based on such assurance to the second judgment server in order for the primary user to have services from the other vertical integration system to which the secondary user belongs. | 09-02-2010 |
Koji Tomita, Saitama JP
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20090326155 | Pressure-Sensitive Adhesive Composition for PDP Front Filter and Use Thereof - A pressure-sensitive adhesive composition for PDP front filters includes 100 parts by weight of a high molecular weight acrylic polymer A having a COOH or OH group, a weight average molecular weight (Mw) of 400,000 to less than 800,000, a molecular weight distribution (Mw/Mn) of not more than 5 and a glass transition temperature (Tg-A) of −40 to −10° C., and 5 to 20 parts by weight of a low molecular weight acrylic polymer B having a weight average molecular weight (Mw) of 10,000 to 50,000, a molecular weight distribution (Mw/Mn) of not more than 5 and a glass transition temperature (Tg-B) of 40 to 120° C.; and is crosslinked to a gel fraction of 50 to 90% and has a 90° peel strength of 5 to 15 N/25 mm. The pressure-sensitive adhesive composition does not cause bonding failures such as lifting even when exposed to thermal cycles. | 12-31-2009 |
20110293953 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR POLARIZER AND POLARIZER FORMED USING SAME - An object is to provide a pressure-sensitive adhesive composition for a polarizer that is excellent in durability and simultaneously is excellent in prevention of leakage of light, without the use of a high-energy light ray. The pressure-sensitive adhesive composition for a polarizer contains components (A) to (C) and having a gel fraction of 91% or more. (A) 100 parts by weight of an acrylic polymer that is obtained by copolymerizing at least the following monomer components (a1) to (a3), and has a weight average molecular weight of 500,000 to 2,000,000 and a ratio (Mw/Mn) of the weight average molecular weight (Mw) to a number average molecular weight (Mn) of 8 or less: (a1) 45 to 94.9% by mass of an alkyl (meth)acrylate ester monomer, (a2) 0.1 to 5% by mass of a carboxyl group-containing monomer, and (a3) 5 to 50% by mass of a benzene ring-containing monomer; (B) 4 to 12 parts by weight of a tolylene diisocyanate crosslinking agent; and (C) 0.05 to 1 part by weight of a silane coupling agent that has reactivity with a carboxyl group, wherein the benzene ring-containing monomer of the monomer component (a3) is 5 times or more in terms of mole of the tolylene diisocyanate crosslinking agent of the component (B). | 12-01-2011 |
Koji Tomita, Sayama-Shi JP
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20090270557 | Adhesive Composition for Optical Film, Adhesive Sheet, and Optical Member Using Such Adhesive Composition - An adhesive composition for optical films, which inhibits contamination in the re-release process and peeling under severe conditions while favorably maintaining its durability and light leakage prevention properties. The adhesive composition includes: (A) an acrylic-based polymer which is obtained by copolymerizing at least the following monomer components: (a1) a (meth)acrylic acid alkyl ester and/or a (meth)acrylic acid alkoxyalkyl ester, (a2) an aromatic ring-containing monomer, (a3) a hydroxyl group-containing monomer, and optionally, (a4) a carboxyl group- or amino group-containing monomer, and which has a weight-average molecular weight of 800,000 to 1,600,000 and a value (Mw/Mn), as obtained by dividing the weight-average molecular weight of the copolymer by the number-average molecular weight thereof of 10 to 50, (B) an isocyanate-based crosslinking agent, (C) a silane coupling agent, and optionally, (D) a crosslinking accelerator. | 10-29-2009 |
Koji Tomita, Fukuoka JP
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20090251092 | POSITION CONTROLLER - A position controller includes a position control part that calculates a speed command on the basis of a difference between a position command and a rotation position of a motor, a PI control part that calculates a torque command on the basis of a speed difference between the speed command and a feedback speed, an observer that generates the feedback speed on the basis of the torque command and a rotation speed of the motor, a phase lead compensator that generates a phase lead compensation signal of the torque command on the basis of the speed command, and an adder that generates a new torque command by adding the phase lead compensation signal of the torque command to the torque command. | 10-08-2009 |
Koji Tomita, Saitama-Ken JP
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20090140411 | RESIN-SEALED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, BASE MATERIAL FOR THE SEMICONDUCTOR DEVICE, AND LAYERED AND RESIN-SEALED SEMICONDUCTOR DEVICE - The present invention provides a resin-sealed semiconductor device, which includes a semiconductor element; a plurality of terminal members, each surrounding the semiconductor element and including an external terminal portion, an internal terminal portion and a connecting portion; bonding wires, each connecting the semiconductor element with the internal terminal portion; and a resin-sealing portion sealing the semiconductor element, terminal members and bonding wires. Each terminal member is composed of an inner thinned portion forming the internal terminal portion and an outer thickened portion forming the external terminal portion. A rear face of each internal terminal portion, and a front face, a rear face and an outer side face of each external terminal portion are exposed to the outside from the resin-sealing portion, respectively. | 06-04-2009 |
Koji Tomita, Kanagawa JP
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20120105566 | PRINTER, PRINT SYSTEM AND PRINTING METHOD - According to one embodiment, a printer includes a conveying mechanism, a first image forming unit and a coloring conversion mechanism. The conveying mechanism conveys a medium. The first image forming unit forms an image on the medium with a temperature-sensitive ink whose color changes depending on temperature. The coloring conversion mechanism converts a coloring state of the image with the temperature-sensitive ink by heating or cooling the image with the temperature-sensitive ink. | 05-03-2012 |