Patent application number | Description | Published |
20100270581 | OPTICAL SEMICONDUCTOR PACKAGE SEALING RESIN MATERIAL - An optical semiconductor package sealing resin material used to seal an optical semiconductor chip in a semiconductor package includes a thermosetting epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is hydrophobized by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide. The smectite clay mineral is bentonite, saponite, hectorite, vermiculite, stevensite, tainiolite, montmorillonite, or nontronite. | 10-28-2010 |
20120175660 | LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE AND LIGHT-EMITTING DEVICE - A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles. | 07-12-2012 |
20120193666 | LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AND LIGHT-EMITTING DEVICE - A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at least one of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, and aluminum oxide, or resin-coated metal particles formed by coating the surface of scale-like or spherical metal particles with an insulating resin. | 08-02-2012 |
20120248495 | LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE PASTE AND LIGHT-EMITTING DEVICE - A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent. | 10-04-2012 |
20130049054 | LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AGENT, AND LIGHT EMITTING DEVICE - A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate. | 02-28-2013 |
20130056686 | CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM - To provide a curable resin composition that can improve resistant properties such as thermal impact resistance even in a high-temperature and high-humidity environment and has a high adhesive property, high conduction reliability and superior crack resistant property. The curable resin composition contains an epoxy resin and an epoxy resin-use curing agent, and is characterized in that a difference between a maximum value of tan δ in a viscoelastic spectrum and a value of the tan δ at −40° C. thereof is 0.1 or more. | 03-07-2013 |
20130087825 | LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AND LIGHT EMITTING DEVICE - A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane. | 04-11-2013 |
20130092310 | BUFFER FILM FOR MULTI-CHIP PACKAGING - A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head. | 04-18-2013 |
20130105841 | LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE, AND LIGHT-EMITTING DEVICE | 05-02-2013 |
20130264602 | LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AND LIGHT-EMITTING DEVICE - A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board contains a thermosetting resin composition, conductive particles, light-reflective needle-shaped insulating particles, and light-reflective spherical insulating particles. Each of the amount of the light-reflective needle-shaped insulating particles and the amount of the light-reflective spherical insulating particles in the thermosetting resin composition is 1 to 50 percent by volume based on the volume of the thermosetting resin composition, and the mixing ratio (V/V) of the light-reflective spherical insulating particles to the light-reflective needle-shaped insulating particles is 1:1 to 10. The light-reflective needle-shaped insulating particles are titanium oxide whiskers, zinc oxide whiskers, titanate whiskers, aluminum borate whiskers, or wollastonite. | 10-10-2013 |
20140001419 | LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AND LIGHT-EMITTING DEVICE | 01-02-2014 |
20140103266 | LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE AND LIGHT-EMITTING DEVICE - A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles. | 04-17-2014 |
20140248477 | BUFFER FILM FOR MULTI-CHIP PACKAGING - A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head. | 09-04-2014 |
20150069448 | LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AGENT, AND LIGHT EMITTING DEVICE - A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray. | 03-12-2015 |
20150353781 | ANISOTROPIC CONDUCTIVE ADHESIVE, LIGHT EMITTING DEVICE, AND METHOD FOR PRODUCING ANISOTROPIC CONDUCTIVE ADHESIVE - Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties. | 12-10-2015 |
Patent application number | Description | Published |
20120156629 | RICH-LEAN COMBUSTION BURNER - A row of rich-side flame holes is centrally arranged. Two rows of lean-side flame holes are arranged on both sides of the rich-side flame hole row, respectively. In addition, two rows of rich-side flame holes are arranged on the outsides of the two lean-side flame hole rows, respectively. A lower end part of a central rich-side burner part is projected into a tubular part into which the rich-side mixture is introduced, and communication holes in fluid communication with an inner space are formed in walls on both sides so as to pass completely therethrough in alignment with each other. Each communication hole has a larger diameter than an inner width P and is disposed at a portion situated nearer to the upper of the tubular part and nearer to the front so as to leave, at the rear, a space in which dust p particles are accumulated. | 06-21-2012 |
20120219920 | RICH-LEAN COMBUSTION BURNER - A row of rich-side flame holes of a combustion burner is arranged in center. Two rows of lean-side flame holes are arranged respectively on sides of the rich-side flame hole row. Two rows of rich-side flame holes are arranged respectively on the outsides of the two lean-side flame hole rows. Supply of lean-side mixture is provided to the lean-side flame hole rows from a tubular part. A lower end part of a central rich-side burner part is projected into a tubular part, into which the rich-side mixture is introduced, to establish lateral fluid communication, with its lower end edge placed in a state of non-contact with the inner surface of the tubular part. First communication holes in fluid communication with an internal space are opened in the lower end part. Communication holes in fluid communication with the outer rich-side flame holes are opened in the inside of the tubular part. | 08-30-2012 |
20120308945 | RICH-LEAN COMBUSTION BURNER - A rich-lean combustion burner has a supply channel through which a lean-side mixture is supplied to lean-side flame holes; and a supply channel through which a rich-side mixture is supplied to rich-side flame holes. The supply channels are partitioned from each other. A third plate member including a pair of plate parts which are bent to form a V shape at its lower end edge as a fold line is employed to form a central rich-side burner part. A slit part is partitioned and formed between side edges of a pair of first plate members on both longitudinal sides for forming lean-side flame holes on width-wise sides of the central rich-side burner part. With the lower end part in front, the V-shaped third plate members inserted into the slit part, thereby being interposed between the first plate members. | 12-06-2012 |
20130149653 | RICH-LEAN COMBUSTION BURNER AND COMBUSTION APPARATUS - In a rich-lean combustion burner, each of outer rich-side flame holes disposed on both outer sides is supplied with rich-side mixture in the same amount and mixing state as the others. A lower end part of a central rich-side burner part is projected into an interior of a tubular part to which a rich-side mixture is introduced. First communication holes are opened, respectively, in both side walls of the lower end part. A second and a third communication holes in fluid communication with an outer rich-side burner part are opened in a tubular part. The second and the third communication holes are oriented so as to face each other without any obstruction, other than a space, therebetween. Furthermore, a pocket part which is a space part adapted to collect and accumulate dust particles is formed on the downstream side up to a closed end. | 06-13-2013 |
20130171576 | RICH-LEAN COMBUSTION BURNER AND COMBUSTION APPARATUS - There is provided a flame hole formation member | 07-04-2013 |
Patent application number | Description | Published |
20110006147 | WEBBING WINDING DEVICE - A webbing winding device includes a clutch mechanism interposed between a spool and an output shaft of a motor and has a simple structure and high operability. In an interference piece that has an interference portion interfering with a connection pawl when an input gear of a clutch is rotated in the winding direction, a base portion is disposed between an outer retaining ring and an inner retaining ring formed at a gear box, and the base portion comes into press contact with an inner peripheral portion of the outer retaining ring and an outer peripheral portion of the inner retaining ring. The interference portion keeps interfering with the connection pawl until a pressing force more than a maximum static frictional force generated between the inner peripheral portion of the outer retaining ring and the outer peripheral portion of the inner retaining ring, and the base portion is applied to the interference portion, thereby rotating the connection pawl. | 01-13-2011 |
20110121122 | ENGAGING MEMBER SUPPORTING STRUCTURE AND WEBBING TAKE-UP DEVICE - An engaging member supporting structure having a rotating body being connected to a spool, transmitting rotation to the spool and having rotation from the spool transmitted thereto; a support body provided coaxially with the rotating body; an engaging member provided at the support body and rotating in one direction to engage with the rotating body; a shaft potion formed at one of the support body or the engaging member; and a bearing portion formed at the other of the support body or the engaging member in such a manner that the shaft portion is inserted therein, whereby the engaging member is rotatably provided at the support body, wherein, in a state in which the engaging member engages with the rotating body, a clearance is formed between an outer peripheral surface of the shaft portion and a portion of an inner peripheral surface of the bearing portion. | 05-26-2011 |
20130087649 | WEBBING RETRACTOR - A webbing retractor that can alleviate the load on a reducing balance spring without increasing cost and weight is obtained. When a ring inertially rotates in a retraction direction together with a ratchet gear, a ring-side pressing portion of a load receiving portion accommodating portion formed in the ring presses a spring-side load receiving portion of a clutch spring in the retraction direction. Due to this, the clutch spring is loosened, whereby the ring can easily inertially rotate in the retraction direction together with the ratchet gear, and the load acting on a reducing balance spring can be alleviated. | 04-11-2013 |