Patent application number | Description | Published |
20140172104 | INSTRUMENT FOR INSERTION AND DEPLOYMENT OF AN IMPLANT - An exemplary surgical instrument for inserting a spinal implant includes an inserter portion, a coupling member, a first actuator, and a second actuator. The inserter portion includes at a proximal end a receiving block, at a distal end a sleeve, and a channel extending therethrough. The coupling member includes at a proximal end movably coupled with the receiving block, a middle portion that slides within the channel, a distal end that couples the spinal implant, and a first axial bore extending therethrough. The first actuator includes a proximal end with a first projection for engaging the receiving block, a first shaft extending through the first axial bore, and a distal end with a first engagement feature for engaging a first deployment feature of the implant. The second actuator includes a proximal lend with a second projection for engaging the receiving block, a second shaft extending through a second axial bore of the first shaft, and a distal end with a second engagement feature for engaging a second deployment feature of the implant. | 06-19-2014 |
20150238327 | Spinal Implants and Insertion Instruments - An instrument for insertion and positioning of a spinal implant includes an outer member, an inner member, and a first thread. The outer member includes a distal attachment feature configured to engage with the spinal implant, a tubular member, and a proximal housing. The inner member is rotatably disposed within a lumen of the outer member and includes a distal coupling feature for coupling with a proximal end of the spinal implant, an elongated shaft within the tubular member, and a proximal end operably coupled with a handle that rotates relative to the proximal housing. The first thread is disposed on the distal coupling feature and includes a first lead and a first thread pitch greater than a thickness of the proximal end of the spinal implant. | 08-27-2015 |
Patent application number | Description | Published |
20090000626 | HAPTIC GUIDANCE SYSTEM AND METHOD - A method for joint replacement is provided. A representation of a first bone is created, and a representation of a second bone is created. Bone preparation for implanting a first implant on the first bone is planned. The first bone to receive the first implant is prepared by manipulating a surgical tool to sculpt the first bone. Bone preparation for implanting a second implant on the second bone after preparing the first bone is planned. The second bone to receive the second implant is prepared by manipulating the surgical tool to sculpt the second bone. | 01-01-2009 |
20090000627 | HAPTIC GUIDANCE SYSTEM AND METHOD - A surgical planning method is provided. A representation of a bone of a joint is created. The joint is moved to a first position. A first point corresponding to a first location in the joint is identified when the joint is in the first position. The joint is moved to a second position. A second point corresponding to a second location in the joint is identified, when the joint is in the second position. Bone preparation for implanting an implant on the bone is planned based at least in part on the first and second points. | 01-01-2009 |
20090012531 | HAPTIC GUIDANCE SYSTEM AND METHOD - A surgical apparatus includes a surgical device, configured to be manipulated by a user to perform a procedure on a patient, and a computer system. The computer system is programmed to create a representation of an anatomy of a patient; to associate the anatomy and a surgical device with the representation of the anatomy; to manipulate the surgical device to perform a procedure on a patient by moving a portion of the surgical device in a region of the anatomy; to control the surgical device to provide at least one of haptic guidance and a limit on manipulation of the surgical device, based on a relationship between the representation of the anatomy and at least one of a position, an orientation, a velocity, and an acceleration of a portion of the surgical device; and to adjust the representation of the anatomy in response to movement of the anatomy during the procedure. | 01-08-2009 |
20090012532 | HAPTIC GUIDANCE SYSTEM AND METHOD - A surgical planning method is provided. A height of a cartilage surface above a bone is detected. A representation of the bone and a representation of the height of the cartilage surface is created. Bone preparation for implanting an implant on the bone is planned based at least in part on the detected height of the cartilage surface. | 01-08-2009 |
20120109150 | HAPTIC GUIDANCE SYSTEM AND METHOD - A surgical apparatus includes a surgical device, configured to be manipulated by a user to perform a procedure on a patient, and a computer system. The computer system is programmed to implement control parameters for controlling the surgical device to provide at least one of haptic guidance to the user and a limit on user manipulation of the surgical device, based on a relationship between an anatomy of the patient and at least one of a position, an orientation, a velocity, and an acceleration of a portion of the surgical device, and to adjust the control parameters in response to movement of the anatomy during the procedure. | 05-03-2012 |
Patent application number | Description | Published |
20120074210 | SOLDERING PREFORM - A soldering preform for soldering in a reducing atmosphere is substantially disc-shaped and has two soldering surfaces each for being in contact with an object to be soldered, respectively, and with at least one recess on at least one soldering surfaces for constituting a channel open to a surface of the object. | 03-29-2012 |
20130043578 | PRESSPIN, POWER SEMICONDUCTER MODULE AND SEMICONDUCTER MODULE ASSEMBLY WITH MULTIPLE POWER SEMICONDUCTER MODULES - A first presspin includes a foot, whereby a base of the foot is provided for contacting a contact element of a power semiconductor device, such as within a power semiconductor module including a base plate and at least one power semiconductor device, which is arranged on the base plate and contacted by at least one further presspin. An insulation means is provided for electrically an outer surface of the foot. A power semiconductor module is also provided including a base plate, at least one power semiconductor device arranged on the base plate, and at least one of the aforementioned first presspin provided with the aforementioned insulation means. A power semiconductor module assembly is also provided including multiple power semiconductor modules as specified above, whereby the power semiconductor modules are arranged side by side to each other with electric connections between adjacent power semiconductor modules. | 02-21-2013 |
20130043579 | POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MULTIPLE POWER SEMICONDUCTOR ARRANGEMENTS, AND MODULE ASSEMBLY COMPRISING MULTIPLE POWER SEMICONDUCTOR MODULES - A power semiconductor arrangement includes a base plate having a molybdenum layer, and a power semiconductor device mounted to a top side of the base plate and electrically and thermally coupled thereto. The base plate includes a metallic mounting base, which is arranged between the semiconductor device and the molybdenum layer and prevents the molybdenum layer from forming highly resistive intermetallic phases with the semiconductor device. A semiconductor module, such as a power semiconductor module, includes multiple semiconductor arrangements, whereby the base plate of the semiconductor arrangements is a common base plate. A module assembly, such as a power semiconductor module assembly, includes multiple semiconductor modules, whereby the semiconductor modules are arranged side by side to each other with electric connections between adjacent semiconductor modules. | 02-21-2013 |