Patent application number | Description | Published |
20080249728 | METHOD FOR DETECTING DEFECTS ON THE BACK SIDE OF A SEMICONDUCTOR WAFER - The invention relates to a method for detecting defects on the back side of a semiconductor wafer. The brightness distribution of the color values is essentially a normal distribution. An average value and surroundings can be defined using the determined normal distribution, which are criteria for the occurrence of a defect. | 10-09-2008 |
20090052766 | Method for the optical inspection and visualization of optical measuring values obtained from disk-like objects - The present invention relates to a method for optically inspecting and visualizing optical measuring values from at least one image of a disk-like object, including the steps of recording said at least one image of said at least one disk-like object, wherein a plurality of optical measuring values are produced from said at least one recorded image; generating a resulting image, wherein an area of the surface of said disk-like object having optical measuring values within a predetermined interval, is associated with a colour or brightness value selected from a predetermined range; and varying at least one imaging parameter as a function of the detected and evaluated optical measuring values and/or as a function of a visual inspection of the resulting image by an operator. | 02-26-2009 |
20090130784 | Method for determining the position of the edge bead removal line of a disk-like object - A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the edge bead removal line is imaged on a line-by-line basis, an intensity profile I of the imaged edge area including the edge bead removal line is obtained with a camera on a line-by-line basis, and the edge area and the alignment mark are detected, wherein the local intensity maxima I′ | 05-21-2009 |
20090153657 | Method and apparatus for processing the image of the surface of a wafer recorded by at least one camera - A method for processing the image data of the surface of a wafer ( | 06-18-2009 |
20090161942 | Method for inspecting a surface of a wafer with regions of different detection sensitivity - The invention relates to a method for inspecting a surface of a wafer with regions of different detection sensitivity. For this purpose, an image of the selected surface of the wafer is acquired using a detector. At least one region handled with a different detection sensitivity than the rest of the wafer may be defined on the surface of the wafer by means of an input unit. The detection sensitivity set for the regions is a percentage less than the detection sensitivity for the surface of the wafer without the regions with the different detection sensitivity. | 06-25-2009 |
20120163698 | Method for Inspection and Detection of Defects on Surfaces of Disc-Shaped Objects and Computer System with a Software Product for Carrying out the Method | 06-28-2012 |