Patent application number | Description | Published |
20090201256 | PORTABLE TERMINAL HAVING INPUTTING MEANS USING IMAGE SENSOR - The present invention is directed to a portable terminal having inputting means using an image sensor and its input method. The portable terminal according to an embodiment of the present invention comprises a transparent solid plate mounted in a keypad area; an image sensor having unit cells of lattice type outputting an electrical signal corresponding to the light irradiated through the transparent solid plate; and a key selection recognizer generating and outputting a key button selection signal corresponding to the location of a unit cell that outputted the least electrical signal value by making reference to the size of the value of the electrical signal inputted from the unit cells. The present invention enables compacting of portable terminals owing to eliminating the need to design key buttons to match the size of human fingers. | 08-13-2009 |
20090243078 | Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same - Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module. | 10-01-2009 |
20110204500 | POWER DEVICE PACKAGES HAVING THERMAL ELECTRIC MODULES USING PELTIER EFFECT AND METHODS OF FABRICATING THE SAME - Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module. | 08-25-2011 |