Chia-Tai
Chia-Tai Chang, Chu-Pei City TW
Patent application number | Description | Published |
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20140015561 | HIGH FREQUENCY PROBE CARD - A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe. | 01-16-2014 |
20140016123 | PROBE HOLDING STRUCTURE AND OPTICAL INSPECTION DEVICE EQUIPPED WITH THE SAME - A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips. | 01-16-2014 |
20140016124 | OPTICAL INSPECTION DEVICE - An optical inspection device includes a circuit board having at least one first opening, a mounting plate disposed on a top or bottom surface of the circuit board and having at least one second opening corresponding to the at least one first opening respectively, at least one lens holder received in the at least one second opening, and at least one probe module disposed on a bottom surface of the mounting plate or the bottom surface of the circuit board, corresponding to the at least one lens holder respectively, and having probes electrically connected with the circuit board. Each lens holder has an accommodation for accommodating a lens, and is operatable to do a position adjusting motion in the corresponding second opening. | 01-16-2014 |
20150022227 | INTEGRATED HIGH-SPEED PROBE SYSTEM - An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system. | 01-22-2015 |
20150028911 | HIGH FREQUENCY PROBE CARD FOR PROBING PHOTOELECTRIC DEVICE - A high frequency probe card for probing a photoelectric device includes a substrate having a first opening and at least one first through hole, an interposing plate disposed on the substrate and having a second opening and at least one second through hole, a circuit board disposed on the interposing plate and having a third opening and at least one third through hole, and a probe module mounted to the substrate and having at least one ground probe and at least one high-frequency impedance matching probe having a signal transmitting structure and a grounding structure passing through the at least one first, second and third through holes and being electrically connected with a signal pad and a ground pad of the circuit board, respectively. The first, second and third openings are communicated with each other for light transmission. | 01-29-2015 |
Chia-Tai Chang, Hsinchu Hsiang TW
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20100253378 | PROBE FOR HIGH FREQUENCY SIGNAL TRANSMISSION - A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly. | 10-07-2010 |
20120274347 | INTEGRATED HIGH-SPEED PROBE SYSTEM - An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system. | 11-01-2012 |
Chia-Tai Chang, Hsinchu County TW
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20140203834 | PROBE MODULE - A probe module includes a substrate having a through hole, and at least four probe-needle rows arranged on the substrate. The probe-needle rows are arranged from a first side to a second side along a first direction. Each of the probe-needle rows has at least two needles arranged along a second direction. Each of the needles has a contact segment and an arm segment having an included angle with the contact segment. An end of the arm segment is connected to the substrate, and the other end of which extends toward the through hole to connect the contact segment. The lengths of the contact segments of the needles of each of the probe-needle rows are the same. The included angles of the needles of the probe-needle rows along the first direction are gradually increased from the first side to the second side. | 07-24-2014 |
Chia-Tai Chen, Hsinchu City TW
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20090273648 | INKJET PRINTHEAD AND MANUFACTURING METHOD THEREOF - An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material. | 11-05-2009 |
Chia-Tai Chen, Hsinchu County TW
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20120242949 | MANUFACTURING METHODS OF PHASE RETARDATION FILM AND STEREOSCOPIC DISPLAY DEVICE, AND PHASE RETARDATION FILM - A manufacturing method of a phase retarding film, a manufacturing method of a stereoscopic display apparatus, and a phase retarding film are provided. A light transmissive substrate is provided. An alignment layer is formed on the light-transmissive substrate. The alignment layer is aligned. A birefringent material film is formed on the alignment layer. A reaction-causing light is used to expose a first patterned region of the birefringent material film to induce a reaction on the first patterned region, wherein a second patterned region of the biregringent material film is not exposed to the reaction-causing light. The second patterned region of the biregringent material film is removed. | 09-27-2012 |
20140091056 | MANUFACTURING METHOD OF PHASE RETARDATION FILM AND MANUFACTURING SYSTEM CONFIGURED TO PRODUCE PHASE RETARDATION FILM - A manufacturing method of a phase retardation film is provided. A flexible light-transmissive substrate is provided. The flexible light-transmissive substrate is aligned to form an alignment substrate. A birefringent material film is formed on the alignment substrate. A reaction-causing light is used to expose and induce a reaction on a first patterned region of the birefringent material film. A second patterned region of the birefringent material film is not exposed by the reaction-causing light. The second patterned region of the birefringent material film is removed. A manufacturing system configured to produce a phase retardation film is also provided. | 04-03-2014 |
Chia-Tai Kuo, Taipei City TW
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20090115313 | LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF - A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light. | 05-07-2009 |
20110012137 | STRUCTURE OF AC LIGHT-EMITTING DIODE DIES - A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage. | 01-20-2011 |
20130146921 | LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF - A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light. | 06-13-2013 |
Chia-Tai Liu, Tainan City TW
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20160037864 | Method of Gluing a Single Surface of a Shoe - A method of gluing a single surface of a shoe contains a first-stage processing and a second-stage processing. The first-stage processing includes a sole bonding having a first washing and polishing step, a first surface modifying step, a glue spraying step, and a sole adhering step. The second-stage processing includes a second washing and polishing step, a second surface modifying step, and an adhesive agent coating step. A vamp and sole processing includes a vamp treating step, a treatment agent coating step, and an adhesion forming step. A shoe midsole on which an adhesion promoter is sprayed and a shoe outsole on which adhesive glue is coated are adhered together to finish a shoe sole. The adhesive glue is coated on an upper surface of the shoe sole to adhere with a lower adhering surface of a vamp on which a treatment agent is coated, thus finishing a shoe. | 02-11-2016 |
Chia-Tai Tsai, Hsinchu TW
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20150117335 | SYSTEM OF DYNAMICALLY ADJUSTING GENERATION FREQUENCY OF MESSAGES IN VEHICULAR NETWORKS AND METHOD THEREOF - A method of dynamic adjusting a generation frequency of messages in vehicular networks is provided, including: receiving updating requests and emergent degree of the vehicle event, and then determining whether the generation frequency of messages meets the dynamic change of the vehicle, if not satisfied, selecting a different adjustment method according to the event emergent degree. When the event is emergent, its generation frequency can be raised immediately by an interruptive adjustment and to suppress the generation frequency of messages of the others. Conversely, adjusting its generation frequency by a progressive adjustment and reducing the generation frequency of messages of the other lower-priority vehicles. According to the present disclosure, it prevents lower priority messages from occupying the channel overly, and emergency messages with higher priority can be satisfied immediately when it needed. | 04-30-2015 |
Chia-Tai Tsai, Taipei City TW
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20120281105 | AUTOMATIC PHOTOGRAPHING SYSTEM AND METHOD THEREOF - An automatic photographing method is provided. The method includes the steps of: receiving a dialing message from a telecommunications network; recognizing a phone number from the dialing message, and controlling a camera module to take at least one photo according to the dialing message; and performing image processing to the photo to generate photo data corresponding to the phone number | 11-08-2012 |
Chia-Tai Wu, Taoyuan County TW
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20130049809 | MICRO ELECTRO-MECHANICAL SYSTEM CIRCUIT CAPABLE OF COMPENSATING CAPACITANCE VARIATION AND METHOD THEREOF - A micro electro-mechanical system (MEMS) circuit includes a MEMS differential capacitor, a read-out circuit, a control circuit, and a compensation circuit. The MEMS differential capacitor includes a first capacitor and a second capacitor. The read-out circuit is coupled to the MEMS differential capacitor for reading a difference between the first capacitor and the second capacitor in a zero-G condition, and generating an output signal according to the difference. The control circuit is coupled to the read-out circuit for receiving the output signal and generating a control signal. The compensation circuit is coupled to the control circuit for compensating the MEMS differential capacitor according to the control signal. | 02-28-2013 |
Chia-Tai Yang, Tainan City 700 TW
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20150061551 | FAN SYSTEM - SINGLE-PHASE DC MOTOR CONTROL CIRCUIT AND CONTROL METHOD THEREOF - A signal-phase DC motor control circuit is disclosed. The signal-phase DC motor control circuit includes a logic circuit, a switching circuit and a driving circuit. The logic circuit transmits a first logic signal, a second logic signal, a third logic signal and a forth logic signal. The switching circuit transmits a first direction driving signal according to a PWM signal and the first logic signal, and transmits a second direction driving signal according to the PWM signal and the second logic signal. The driving circuit transmits a first output signal according to the first direction driving signal and the fourth logic signal, and transmits a second output signal according to the second direction driving signal and the third logic signal. The first output signal and the second output signal are positive half-wave sinusoidal wave, and the phase difference between the first output signal and the second output signal is 180 degrees. | 03-05-2015 |