Patent application number | Description | Published |
20080223612 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - In a wiring substrate, a wiring pattern is formed on a substrate. An insulating layer covers the substrate. A connection part of the wiring pattern is exposed from the insulating layer. A pedestal for mark is formed on the substrate. An alignment mark is formed on the top part of the pedestal for mark. The alignment mark is formed in a shape in which a length of a horizontal direction and a length of a vertical direction are respectively longer than a length of a horizontal direction and a length of a vertical direction of the top part of the pedestal for mark and a shape in which an area present in the top part of the pedestal for mark is smaller than an area of the top part of the pedestal for mark. An upper surface part of the alignment mark is exposed from the insulating layer. | 09-18-2008 |
20080251279 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof. | 10-16-2008 |
20080283277 | WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD - A wiring board | 11-20-2008 |
20100090352 | FLIP-CHIP SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - There is provided a flip-chip substrate which is flip-chip connected to electrode terminals provided on one surface of an electronic component. The flip-chip substrate includes: mounting pads which are exposed to a surface of the flip-chip substrate on which the electronic component is mounted and each of which comprises a pad surface which is flip-chip connected to a corresponding one of the electrode terminals; wiring patterns which are electrically connected to the mounting pads; an insulating layer which covers the wiring patterns; and a solder resist formed on an entire surface of the insulating layer such that each pad surface of the mounting pads is exposed from the solder resist. | 04-15-2010 |
20110253422 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof. | 10-20-2011 |
20110316170 | Wiring Substrate, Semiconductor Device, and Method for Manufacturing Wiring Substrate - A wiring substrate includes a wiring pattern in an uppermost layer that includes pads. A solder resist layer covers the wiring pattern. A recess exposes part of the wiring pattern from the solder resist layer to form pads. The solder resist layer includes a portion formed in a region corresponding to the recess, a portion formed outward from the recess, and a portion formed inward from the recess. The upper surface of the solder resist layer at the portion corresponding to the recess is higher than the upper surface of the pads but lower than the upper surfaces of the other portions of the solder resist layer. | 12-29-2011 |
20120073862 | Wiring Substrate, Semiconductor Device, and Method for Manufacturing Wiring Substrate - A wiring substrate includes a wiring pattern, which includes an upper surface forming a desired recognition mark, and a solder resist layer, which covers the wiring pattern. The solder resist layer includes a recess that entirely exposes the upper surface of the wiring pattern. The solder resist layer includes a solder resist layer formed at a region corresponding to the recess and a solder resist layer formed outside the recess. The recess entirely exposes the upper surface of the wiring pattern as the recognition mark, and the solder resist layer is formed at portions outside the upper surface of the wiring pattern. | 03-29-2012 |
20120119377 | WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIRING SUBSTRATE - A wiring substrate is provided with a first wiring layer including a first land, a first insulative layer formed on the first wiring layer, a second wiring layer formed on the first insulative layer, a second insulative layer formed on the second wiring layer, and a via formed extending through the first insulative layer and the second insulative layer in a thicknesswise direction. The via includes one end, which is electrically connected to the first land of the first wiring layer, and another end, which is located opposed to the one end and serves as a pad to which a mounted electronic component is electrically connected. The second wiring layer includes a coupling portion electrically connected to the via. The coupling portion of the second wiring has a width that is smaller than a diameter of the via. | 05-17-2012 |
20130187182 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first surface and a second surface opposite to the first surface, the second surface contacting the insulating member; and a metal layer on the first surface of the wiring pattern, wherein an exposed surface of the metal layer is flush with an exposed surface of the insulating member. | 07-25-2013 |
20130187190 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; a first insulating layer on the heat sink; a wiring pattern on the first insulating layer, wherein the wiring pattern is configured to mount a light emitting element thereon; and a second insulating layer on the first insulating layer such that the wiring pattern is exposed from the second insulating layer. | 07-25-2013 |
20130188361 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer. | 07-25-2013 |