Xunqing
Xunqing Shi, Taiwai HK
Patent application number | Description | Published |
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20100247879 | SUBSTRATE WARPAGE-REDUCING STRUCTURE - The subject matter disclosed herein relates to methods to reduce warpage of a substrate. | 09-30-2010 |
20110304026 | VIA AND METHOD OF VIA FORMING AND METHOD OF VIA FILLING - An electronic or micromechanical device having first ( | 12-15-2011 |
Xunqing Shi, New Territories HK
Patent application number | Description | Published |
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20100123241 | SEMICONDUCTOR CHIP WITH THROUGH-SILICON-VIA AND SIDEWALL PAD - Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in flash memory devices. In an example embodiment, a semiconductor chip may comprise a through-silicon via and a sidewall pad. | 05-20-2010 |
Xunqing Shi, Fanling HK
Patent application number | Description | Published |
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20090294974 | BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING - There is described a bonding method for through-silicon-via bonding of a wafer stack in which the wafers are formed with through-silicon-vias and lateral microchannels that are filled with solder. To fill the vias and channels the wafer stack is placed in a soldering chamber and molten solder is drawn through the vias and channels by vacuum. The wafers are held together by layers of adhesive during the assembly of the wafer stack. Means are provided for local reheating of the solder after it has cooled to soften the solder to enable it to be removed from the soldering chamber. | 12-03-2009 |
Xunqing Shi, Singapore SG
Patent application number | Description | Published |
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20090243046 | Pulse-Laser Bonding Method for Through-Silicon-Via Based Stacking of Electronic Components - There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs. | 10-01-2009 |