Patent application number | Description | Published |
20100020463 | HIGH TEMPERATURE ELECTROSTATIC CHUCK AND METHOD OF USING - An electrostatic chuck configured for high temperature reduced-pressure processing is described. The electrostatic chuck comprises a chuck body having an electrostatic clamp electrode and an optional heating element, and a heat sink body having a heat transfer surface spaced in close relationship with an inner surface of the chuck body, wherein the heat sink body is configured to remove heat from the chuck body due to the close proximity of the inner surface and the heat transfer surface. The electrostatic chuck further comprises a table assembly configured to support the chuck body and the heat sink body, and an expansion joint disposed between the chuck body and the table assembly, and configured to sealably join the chuck body to the table assembly while accommodating for differential thermal expansion of the chuck body and the table assembly. | 01-28-2010 |
20100248397 | High temperature susceptor having improved processing uniformity - A susceptor configured to be coupled to a material processing system is described. The susceptor comprises a substrate support comprising a central portion and an edge portion, wherein the central portion has a support surface configured to receive and support a substrate, and the edge portion extends beyond a peripheral edge of the substrate. The susceptor further comprises an edge reflector coupled to the edge portion of the substrate support and configured to partially or fully shield the peripheral edge of the substrate from radiative exchange with an outer region of the material processing system. | 09-30-2010 |
20110061595 | High temperature gas heating device for a vapor deposition system - A gas heating device that may be used in a system for depositing a thin film on a substrate using a vapor deposition process is described. The gas heating device may be configured for heating one or more constituents of a film forming composition. The gas heating device comprises one or more resistive heating elements. Additionally, the gas heating device comprises a mounting structure configured to support at least one of the one or more resistive heating elements. Furthermore, the gas heating device comprises a static mounting device coupled to the mounting structure and configured to fixedly couple the at least one of the one or more resistive heating elements to the mounting structure, and a dynamic mounting device coupled to the mounting structure and configured to automatically compensate for changes in a length of the at least one of the one or more resistive heating elements. Further yet, the dynamic mounting device comprises a thermal break configured to reduce heat transfer between the dynamic mounting device and the mounting structure. | 03-17-2011 |
20110303654 | Device to reduce shadowing during radiative heating of a substrate - A substrate heating apparatus configured to be coupled to a processing system and radiatively heat a substrate is described. The substrate heating apparatus comprises a radiative heat source coupled to a processing system and configured to produce electromagnetic (EM) radiation, a translucent object disposed between the radiative heat source and the substrate along an EM wave path there between, and an opaque object disposed between the radiative heat source and the substrate along the EM wave path there between. The translucent object comprises at least one textured surface to cause random refraction of the EM radiation passing through the translucent object, or an optical waveguide configured to encapsulate the opaque object and direct the EM radiation around the opaque object, or a combination thereof. | 12-15-2011 |
20120312234 | PROCESS GAS DIFFUSER ASSEMBLY FOR VAPOR DEPOSITION SYSTEM - A gas diffuser assembly and vapor deposition system for use therein are described. The gas diffuser assembly includes a gas diffuser manifold configured to be coupled to a substrate processing system and arranged to introduce a process gas from a gas outlet into the substrate processing system in a direction substantially normal to a surface of a substrate to create a stagnation flow pattern over the surface. The gas diffuser manifold includes a gas inlet, a stagnation plate, and a diffusion member. | 12-13-2012 |
20140116339 | PROCESS GAS DIFFUSER ASSEMBLY FOR VAPOR DEPOSITION SYSTEM - A gas diffuser assembly and vapor deposition system for use therein are described. The gas diffuser assembly includes a gas diffuser manifold configured to be coupled to a substrate processing system and arranged to introduce a process gas from a gas outlet into the substrate processing system in a direction substantially normal to a surface of a substrate to create a stagnation flow pattern over the surface. The gas diffuser manifold includes a gas inlet, a stagnation plate, and a diffusion member. | 05-01-2014 |
20140273532 | PROCESSING SYSTEM FOR ELECTROMAGNETIC WAVE TREATMENT OF A SUBSTRATE AT MICROWAVE FREQUENCIES - A processing system is disclosed, having a process chamber that houses a substrate for exposure of a surface of the substrate to a travelling electromagnetic (EM) wave. The processing system also includes an EM wave transmission antenna configured to launch the travelling EM wave into the process chamber for the travelling EM wave to propagate in a direction substantially parallel to the surface of the substrate. The processing system also includes a power coupling system configured to supply EM energy into the EM wave transmission antenna to generate the travelling EM wave at a prescribed output power and in a prescribed EM wave mode during treatment of the substrate. The processing system also includes an EM wave receiving antenna configured to absorb the travelling EM wave after propagation through the process chamber. | 09-18-2014 |